Patents by Inventor Hiroyasu Toyoda

Hiroyasu Toyoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4600833
    Abstract: A solid state image sensing device comprises a photosensitive semiconductor element having a plurality of photocells on a surface thereof. A protective layer is disposed on the photosensitive semiconductor element, and an inorganic layer is disposed on the protective layer. A plurality of color filter layers each comprising a coloring agent having a color absorption characteristic are mixed into a portion of the inorganic layer in locations overlying the photocell, and a surface protective coating is disposed on a surface of the color filter layers.
    Type: Grant
    Filed: March 15, 1983
    Date of Patent: July 15, 1986
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Shibata, Hiroyasu Toyoda, Hidefumi Nakata
  • Patent number: 4438315
    Abstract: A parallel-plate type gas plasma etching apparatus for etching a workpiece having a multilayer structure having a high etch rate ratio. A pair of parallel-plate electrodes are disposed in a reactor. A workpiece to be etched is disposed upon one of the electrodes. The reactor is held at a predetermined pressure and an etching gas supplied thereto. Rf power is applied between the electrodes with the positive terminal of the rf generator being coupled to the electrode upon which the workpiece is disposed. The frequency of the rf power is 10 MHz or less.
    Type: Grant
    Filed: August 26, 1981
    Date of Patent: March 20, 1984
    Assignee: VLSI Technology Research Association
    Inventors: Hiroyasu Toyoda, Hiroyoshi Komiya, Hideaki Itakura
  • Patent number: 4348577
    Abstract: A parallel-plate type gas plasma etching apparatus for etching a workpiece having a multilayer structure having a high etch rate ratio. A pair of parallel-plate electrodes are disposed in a reactor. A workpiece to be etched is disposed upon one of the electrodes. The reactor is held at a predetermined pressure and an etching gas supplied thereto. Rf power is applied between the electrodes with the positive terminal of the rf generator being coupled to the electrode upon which the workpiece is disposed. The frequency of the rf power is 10 MHz or less.
    Type: Grant
    Filed: September 3, 1980
    Date of Patent: September 7, 1982
    Assignee: VLSI Technology Research Association
    Inventors: Hiroyasu Toyoda, Hiroyoshi Komiya, Hideaki Itakura