Abstract: A hard disk drive comprises a carriage assembly that comprises a carriage-arm tip with a swaging hole centered about a swaging axis. A first head-gimbal assembly comprises a tension baseplate on a first side of the carriage-arm tip with a tension swage boss located within the swaging hole. A second head-gimbal assembly comprises a compression baseplate on a second side of the carriage-arm tip with a compression swage boss located with the swaging hole. The tension swage boss comprises an uppercut that extends radially outward, away from the swaging axis, from a first backbore diameter to a second backbore diameter and a tension-boss undercut that extends radially outward, away from the swaging axis, from a tension-boss outer diameter to a first undercut diameter. The compression swage boss comprises a compression-boss undercut that extends radially outward, away from the swaging axis, from a compression-boss outer diameter to a second undercut diameter.

Abstract: A hard disk drive comprises a carriage assembly that comprises a carriage-arm tip with a swaging hole centered about a swaging axis. A first head-gimbal assembly comprises a tension baseplate on a first side of the carriage-arm tip with a tension swage boss located within the swaging hole. A second head-gimbal assembly comprises a compression baseplate on a second side of the carriage-arm tip with a compression swage boss located with the swaging hole. The tension swage boss comprises an uppercut that extends radially outward, away from the swaging axis, from a first backbore diameter to a second backbore diameter and a tension-boss undercut that extends radially outward, away from the swaging axis, from a tension-boss outer diameter to a first undercut diameter. The compression swage boss comprises a compression-boss undercut that extends radially outward, away from the swaging axis, from a compression-boss outer diameter to a second undercut diameter.

Abstract: A hard disk drive suspension assembly includes a pad base layer, a pad-end fixing layer, and a plurality of electrical pads each comprising a conductive layer on the pad base layer, where the base layer extends to the fixing layer, to which a distal end of the base layer is fixed. This configuration inhibits the delamination or deformation of the end edge of each pad. An additional cover layer may be implemented to cover the distal end of the conductive layer(s), further inhibiting deformation of the pads. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

Abstract: A hard disk drive comprises a carriage assembly that comprises a carriage-arm tip with a swaging hole centered about a swaging axis. A first head-gimbal assembly comprises a tension baseplate on a first side of the carriage-arm tip with a tension swage boss located within the swaging hole. A second head-gimbal assembly comprises a compression baseplate on a second side of the carriage-arm tip with a compression swage boss located with the swaging hole. The tension swage boss comprises an uppercut that extends radially outward, away from the swaging axis, from a first backbore diameter to a second backbore diameter and a tension-boss undercut that extends radially outward, away from the swaging axis, from a tension-boss outer diameter to a first undercut diameter. The compression swage boss comprises a compression-boss undercut that extends radially outward, away from the swaging axis, from a compression-boss outer diameter to a second undercut diameter.

Abstract: A head gimbal assembly (HGA) for a hard disk drive includes a primary dimple having a secondary structure protruding from the primary dimple, where a flexure is movably coupled with a load beam via the primary dimple, and where the secondary structure is configured to restrict the point of contact between the load beam and the flexure. Such an arrangement avoids any shift in the axis of rotation of the flexure, and the attached slider, due to any undesirable protrusion from the primary dimple which may arise in the manufacturing process. Examples of secondary structures include a micro-dimple, a ridge, and an embedded mass of material.

Abstract: A head gimbal assembly (HGA) for a hard disk drive includes a primary dimple having a secondary structure protruding from the primary dimple, where a flexure is movably coupled with a load beam via the primary dimple, and where the secondary structure is configured to restrict the point of contact between the load beam and the flexure. Such an arrangement avoids any shift in the axis of rotation of the flexure, and the attached slider, due to any undesirable protrusion from the primary dimple which may arise in the manufacturing process. Examples of secondary structures include a micro-dimple, a ridge, and an embedded mass of material.

Abstract: An approach to a head gimbal assembly, such as for a hard disk drive, includes an offset swage plate coupling a suspension to one side of an actuator arm and another offset swage plate coupling another suspension to an opposing second side of the actuator arm. Each offset swage plate includes a main body, a swage through-hole through a first lateral or longitudinal side of the main body, a swage boss around the perimeter of the swage through-hole and extending substantially normal to the main body, and a clearance through-hole through an opposing second lateral or longitudinal side of the main body, the clearance through-hole having no swage boss. Each offset swage plate is configured in the assembly in a position opposing the other, such that the corresponding swage bosses are positioned on different lateral/longitudinal sides of the arm tip so that there is no coaxial swage boss buildup.

Abstract: An approach to a piezoelectric (PZT) device, such as a hard disk drive microactuator, includes one or more layers of poled PZT material, with top and bottom surfaces coupled with respective electrode layers coupled with a power source to drive the active PZT layer(s). The electrode layers have different thicknesses, where the particular thicknesses may be configured to mitigate the variation of out-of-plane motion or bending associated with operational variations in the z-height between a corresponding actuator arm and recording medium and, likewise, the phase variation of flexure vibration.

Abstract: An approach to a piezoelectric (PZT) device, such as a hard disk drive microactuator, includes one or more layers of poled PZT material, with top and bottom surfaces coupled with respective electrode layers coupled with a power source to drive the active PZT layer(s). The electrode layers have different thicknesses, where the particular thicknesses may be configured to mitigate the variation of out-of-plane motion or bending associated with operational variations in the z-height between a corresponding actuator arm and recording medium and, likewise, the phase variation of flexure vibration.

Abstract: An approach to a head gimbal assembly, such as for a hard disk drive, includes an offset swage plate coupling a suspension to one side of an actuator arm and another offset swage plate coupling another suspension to an opposing second side of the actuator arm. Each offset swage plate includes a main body, a swage through-hole through a first lateral or longitudinal side of the main body, a swage boss around the perimeter of the swage through-hole and extending substantially normal to the main body, and a clearance through-hole through an opposing second lateral or longitudinal side of the main body, the clearance through-hole having no swage boss. Each offset swage plate is configured in the assembly in a position opposing the other, such that the corresponding swage bosses are positioned on different lateral/longitudinal sides of the arm tip so that there is no coaxial swage boss buildup.

Abstract: Approaches to pre-forming solder bumps, such as for use in electrically connecting a head slider and a suspension assembly for a hard disk drive, involves applying a height stabilizer plate over a shared solder paste applied over a substrate housing electrode pads, and reflowing the solder paste with the plate applied to create solder bumps electrically coupled to the pads. Use of such a plate functions to stabilize and contain the solder paste and create uniform solder bumps across the series of pads, where the plate may be composed of a heat-resistant and anti-solder-wetting material. The solder bump pre-forming techniques generally enable solder bonding of extremely small electrical interconnection pads.

Abstract: Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.

Abstract: Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.

Abstract: A head gimbal assembly for a hard disk drive comprises a flexure having a planar surface and a standoff structure extending from the planar surface, where the standoff structure includes a monolithic element. A head slider in which a read-write head is housed is adhered to the flexure with an adhesive, such that the adhesive surrounds the monolithic element so that the monolithic element may absorb strain energy caused by curing of the adhesive.

Abstract: Approaches to a suspension for a hard disk drive (HDD) include a non-hemispherical dimple for movably coupling a flexure with a load beam, where the length of the non-hemispherical dimple exceeds the width. Therefore, in the context of a microactuator system, piezo actuating devices may be installed closer together to improve the microactuator stroke performance in moving the slider over the disk surface.

Abstract: Approaches to a suspension for a hard disk drive (HDD) include a non-hemispherical dimple for movably coupling a flexure with a load beam, where the length of the non-hemispherical dimple exceeds the width. Therefore, in the context of a microactuator system, piezo actuating devices may be installed closer together to improve the microactuator stroke performance in moving the slider over the disk surface.

Abstract: A stepped suspension load beam is described, such as for a hard disk drive, in which the main body is composed of a proximal portion that lies in a first plane, an intermediate portion between the proximal portion and a distal portion and that lies in a second plane that angles upward from the proximal portion, and a distal portion that lies in a third plane that angles back down from the intermediate portion, thereby forming a load beam stepped in the longitudinal direction. Further, the proximal portion may be formed to taper in at a first angle, the intermediate portion formed to taper in at a second angle that is less than the first angle, and the distal portion formed to taper in at a third angle greater than the first and second angles, thereby forming a load beam stepped in the transverse direction.

Abstract: A head-gimbal assembly (HGA). The HGA includes a deformable plate affixed to a load beam, a piezoelectric element affixed to the deformable plate, and a base plate affixed to the deformable plate. The deformable plate includes: a hole; a first section in front of the hole and affixed to the load beam; a second section behind the hole and affixed to the base plate; and, first and second spring members that join the first section and the second section, can deform in a front-back direction, and are positioned to sandwich the hole in a left-right direction. The piezoelectric element is affixed between the first section and the second section. The base plate includes projection members on a front edge of the plate and projecting out toward the first section. The front edges of the projection member are positioned further to a front edge than a back edge of the hole.

Abstract: Approaches for integrated lead suspension that provides many benefits, such as enabling a dual stage actuator (DSA) to be used with a single layer flex with a reduced amount of crosstalk. An integrated lead suspension comprises a tail end having a plurality of conductive pads positioned thereat. The plurality of conductive pads includes a first and second dual stage actuator (DSA) pad. The first and second DSA pads are electrically coupled to a conductive member by way of conductive vias. The conductive member may be a stainless steel island. The first DSA pad conducts a signal to a first terminal at each of a plurality of dual stage actuators, while a second terminal at each of the plurality of dual stage actuators is connected to ground.

Abstract: Embodiments of the present invention provide a suspension assembly having a dielectric limiter. According to one embodiment, the suspension assembly includes a load beam and a flexure assembly. The flexure assembly includes a metal layer where there are formed a fixing portion fixed to the load beam, main rings, and extending from the fixing portion, sub-rings, and a flexure tongue having moving-side limiter coupling portions defined thereon. Fixing-side limiter coupling portions are defined at the main rings. Dielectric limiters each have a gross length larger than a between-coupling-portions distance between a fixing-side limiter coupling portion and a moving-side limiter coupling portion, and couple the fixing-side limiter coupling portion to the moving-side limiter coupling portion.