Patents by Inventor Hiroyoshi Aikawa

Hiroyoshi Aikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fused spherical silica for liquid sealant and liquid sealing resin composition
    Patent number: 6303223
    Abstract: The present invention relates to fused spherical silica for liquid sealant which has a particle size distribution such that maximum particle size is 24 &mgr;m, average particle size is 2 to 7 &mgr;m, and the proportion of particles having a particle size of 1 &mgr;m or less is 1% by weight or less, and the silica has a BET specific surface area of 3 m2/g or less. Fused spherical silica filler of the present invention for liquid sealant can be blended with an epoxy resin or silicone resin which is liquid at normal temperature in high proportion, and can minimize the coefficient of linear expansion of a liquid sealing resin composition.
    Type: Grant
    Filed: April 17, 2000
    Date of Patent: October 16, 2001
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Yutaka Kinose, Shinsuke Miyabe, Takeshi Sakamoto, Hiroyoshi Aikawa, Yoshikazu Watanabe