Abstract: An output control method according to an embodiment is to control an output by a deflection amplifier that outputs a voltage signal to a deflection electrode of an electron beam writing apparatus. The voltage signal is proportional to input data, and the method includes: performing, for the voltage signal generated by synthesizing respective outputs by a plurality of D/A converters to which a control range of the voltage signal is assigned, the respective outputs by the plurality of D/A converters being proportional to respective inputs, sampling on at least either a lower limit value of the voltage signal within the control range or an upper limit value thereof; and generating a correction value to correct the output by the D/A converter based on the sampling result.

Abstract: An output control method according to an embodiment is to control an output by a deflection amplifier that outputs a voltage signal to a deflection electrode of an electron beam writing apparatus. The voltage signal is proportional to input data, and the method includes: performing, for the voltage signal generated by synthesizing respective outputs by a plurality of D/A converters to which a control range of the voltage signal is assigned, the respective outputs by the plurality of D/A converters being proportional to respective inputs, sampling on at least either a lower limit value of the voltage signal within the control range or an upper limit value thereof; and generating a correction value to correct the output by the D/A converter based on the sampling result.

Abstract: There is provided a service method, a service system, and a manufacturing/inspection apparatus that can reduce the initial cost of use of the apparatus at the time of introducing a manufacturing/inspection apparatus and maintain the accuracy after introduction of the apparatus. In the service method for using the manufacturing/inspection apparatus for manufacturing or inspecting products such as semiconductor wafer, semiconductor device, exposure mask or liquid crystal device, the charge for use of the manufacturing/inspection apparatus is set based on the manufacturing or inspection difficulty information of the product manufactured or inspected with the manufacturing/inspection apparatus and the running information of the manufacturing/inspection apparatus stored in a physical memory medium.

Abstract: There is provided a service method, a service system, and a manufacturing/inspection apparatus that can reduce the initial cost of use of the apparatus at the time of introducing a manufacturing/inspection apparatus and maintain the accuracy after introduction of the apparatus. In the service method for using the manufacturing/inspection apparatus for manufacturing or inspecting products such as semiconductor wafer, semiconductor device, exposure mask or liquid crystal device, the charge for use of the manufacturing/inspection apparatus is set based on the manufacturing or inspection difficulty information of the product manufactured or inspected with the manufacturing/inspection apparatus and the running information of the manufacturing/inspection apparatus stored in a physical memory medium.

Abstract: There is provided a service method, a service system and a manufacturing/inspection apparatus that can reduce the initial cost at the time of introducing a manufacturing/inspection apparatus and maintain the accuracy after introduction of the apparatus. In the service method for using the manufacturing/inspection apparatus for manufacturing or inspecting products such as semiconductor wafer, semiconductor device, exposure mask or liquid crystal device, the charge for use of the manufacturing/inspection apparatus is set based on the manufacturing or inspection difficulty information of the product manufactured or inspected with the manufacturing/inspection apparatus and the running information of the manufacturing/inspection apparatus stored in a physical memory medium.

Abstract: A sample stage is moved so that an alignment mark on a wafer successively move on positions symmetric to the positional origin of the electron beam, and waveformes of signals obtained by scanning the alignment mark at the symmetric positions with electron beam are added each other so as to be symmetry and decrease the alignment-mark position detecting error.

Abstract: A lithographic method and a lithographic apparatus ar disclosed in which the height of a silicon wafer making up an object of lithography is accurately measured. A lithographic apparatus such as an electron beam apparatus having a height-measuring instrument built therein is effectively used for forming a pattern on the order of submicrons.

Abstract: An electron beam lithography apparatus, comprising an electron beam source for irradiating an electron beam on a specimen surface, a deflectional controller of the electron beam, a focal controller of the electron beam on the specimen surface, a light source which irradiates two monochromatic lights on the surface having wavelengths which are different a half thereof each other, a signal processor for obtaining correction values in a height direction of the beam based on the reflected lights from the surface, and a means for adjusting the focal controller according to the correction values in the height direction. As the wavelengths of the two monochromatic lights on the surface are different in a half wavelength each other, an interference caused by a photo-resist on the specimen is prevented.