Abstract: A semiconductor device (1) includes a semiconductor module (20) and a fan device (30). The semiconductor module (20) includes a module board (21), a first element (22) mounted on the module board (21), and a second element (23a) having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (30), the fan device (30) is disposed downstream of the first element (22) and the second element (23a), and the first element (22) is disposed downstream of the second element (23a).

Abstract: A semiconductor device (1) includes a semiconductor module (20) and a fan device (30). The semiconductor module (20) includes a module board (21), a first element (22) mounted on the module board (21), and a second element (23a) having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (30), the fan device (30) is disposed downstream of the first element (22) and the second element (23a), and the first element (22) is disposed downstream of the second element (23a).

Abstract: A board holding apparatus holds an electric circuit board between a first case and a second case. The board holding apparatus includes locking parts that lock the first case and the second case together in a thickness direction of the electric circuit board such that the first case and the second case are not separated from each other and a bearing surface formed on the second case, the electric circuit board coming into contact with the bearing surface in the thickness direction. The board holding apparatus includes a spring that generates an elastic force, with the locking parts locking the first case and the second case together, the spring being formed on the first case and the elastic force pressing the bearing surface through the electric circuit board.

Abstract: A board holding apparatus holds an electric circuit board between a first case and a second case. The board holding apparatus includes locking parts that lock the first case and the second case together in a thickness direction of the electric circuit board such that the first case and the second case are not separated from each other and a bearing surface formed on the second case, the electric circuit board coming into contact with the bearing surface in the thickness direction. The board holding apparatus includes a spring that generates an elastic force, with the locking parts locking the first case and the second case together, the spring being formed on the first case and the elastic force pressing the bearing surface through the electric circuit board.

Abstract: A connector portion of a hard disk device is provided with a recess portion that guides a connector portion of a holder device so as to align the connector portion of the holder device with the connector portion of the hard disk device. The connector portion of the holder device is provided with a guide projection that is guided by the recess portion. A connector body is attached to a holder body shiftable within a range that the connector portion of the holder device can follow the connector portion of the hard disk device and a range that the guide projection can be guided by the recess portion.

Abstract: A connector portion of a hard disk device is provided with a recess portion that guides a connector portion of a holder device so as to align the connector portion of the holder device with the connector portion of the hard disk device. The connector portion of the holder device is provided with a guide projection that is guided by the recess portion. A connector body is attached to a holder body shiftable within a range that the connector portion of the holder device can follow the connector portion of the hard disk device and a range that the guide projection can be guided by the recess portion.