Patents by Inventor Hiroyoshi DEGUCHI

Hiroyoshi DEGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid resin composition for sealing and electronic component device
    Patent number: 12269943
    Abstract: A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 8, 2025
    Assignee: RESONAC CORPORATION
    Inventors: Yuma Takeuchi, Hisato Takahashi, Hiroyoshi Deguchi
  • LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20190144660
    Abstract: A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.
    Type: Application
    Filed: May 11, 2016
    Publication date: May 16, 2019
    Inventors: Yuma TAKEUCHI, Hisato TAKAHASHI, Hiroyoshi DEGUCHI