Abstract: Herein disclosed is a material for making conductive parts such as lead frames or connectors of semiconductor elements or integrated circuits (i.e., ICs). The material is an aluminum-based alloy containing 0.3 to 4.0 wt. % of manganese and 0.10 to 5.0 wt. % of magnesium, the remainder being aluminum and unavoidable impurities. The material may additionally contain: at least one of copper and zinc; and/or at least one of chromium, zirconium, vanadium and nickel, if necessary. The material having the composition specified above can be made at a reasonable cost with excellent softening resistance, electric and thermal conductivities, solderability and platability, a high mechanical strength, and an excellent bending repeatability.