Abstract: A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 ?m in a top view.

Abstract: A light-emitting device comprises a casing including an upper surface portion having one or more first through holes, and a front surface portion having an opening; a transparent member that closes off the one or more first through holes; one or more light-emitting elements that face the one or more first through holes, respectively, within the casing; and a lid member provided so as to close off the opening, wherein the casing is integrally formed using one material.

Abstract: A light-emitting apparatus includes: a body having an inner space and an opening, the body incorporating at least one semiconductor laser element the body being made of a metal; and a sealing glass member joined to the body, to hermetically seal the inner space. The sealing glass member has a surface adjacent to the body, the surface of the sealing glass member being provided with a base joint layer in a joint region where the sealing glass member and the body are joined together, the base joint layer being made of a metal having a thermal expansion coefficient that falls between a thermal expansion coefficient of the sealing glass member and a thermal expansion coefficient of the metal constituting the body. The sealing glass member is joined to the body with the base joint layer and a solder-containing joint layer interposed between the sealing glass member and the body.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: A semiconductor module includes a base material, an alignment mark provided on a surface of the base material and plural semiconductor elements that are individually provided on the surface of the base material while being juxtaposed to the alignment mark and that are separated from each other. Accordingly, a semiconductor module and a method for manufacturing the semiconductor module are provided which may prevent an alignment mark from being peeled off and remaining as a foreign object and may improve reliability.

Abstract: A light-emitting device comprises a casing including an upper surface portion having one or more first through holes, and a front surface portion having an opening; a transparent member that closes off the one or more first through holes; one or more light-emitting elements that face the one or more first through holes, respectively, within the casing; and a lid member provided so as to close off the opening, wherein the casing is integrally formed using one material.

Abstract: A light source device includes: a driving circuit; a blue light emitting element made of a group III nitride semiconductor which has a light outgoing surface on a side opposite to a side with the driving circuit, is arranged on the driving circuit, and is electrically connected to the driving circuit; and a color conversion layer which is in contact with the light outgoing surface and converts a wavelength of light emitted from the light outgoing surface. The light outgoing surface is made of a group III nitride semiconductor.

Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Abstract: A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 ?m in a top view.

Abstract: A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: In a light-emitting element module, at least two or more first electrodes of a first substrate that includes a circuit element are joined to at least two or more light-emitting elements. The first substrate includes a first wiring line to an n-th wiring line (n is an integer of 2 or more) that are formed into layers in order from the at least two or more light-emitting elements in a thickness direction of the first substrate. The first wiring line that is located in one of the layers of the first substrate nearest to the at least two or more light-emitting elements is formed at least in an interelectrode region between the adjacent first electrodes of the first substrate in a plan view.

Abstract: A semiconductor module includes a base material, an alignment mark provided on a surface of the base material and plural semiconductor elements that are individually provided on the surface of the base material while being juxtaposed to the alignment mark and that are separated from each other. Accordingly, a semiconductor module and a method for manufacturing the semiconductor module are provided which may prevent an alignment mark from being peeled off and remaining as a foreign object and may improve reliability.

Abstract: A light source device includes: a driving circuit; a blue light emitting element made of a group III nitride semiconductor which has a light outgoing surface on a side opposite to a side with the driving circuit, is arranged on the driving circuit, and is electrically connected to the driving circuit; and a color conversion layer which is in contact with the light outgoing surface and converts a wavelength of light emitted from the light outgoing surface. The light outgoing surface is made of a group III nitride semiconductor.

Abstract: Resin covers a side surface and a back surface of a blue LED and holds the blue LED level. An electrode is disposed between a top surface of a wiring substrate and a back surface of the blue LED, extends through the resin, and electrically connects the wiring substrate and the blue LED to each other. A light-outgoing surface (top-surface) of the blue LED is exposed without being covered with the resin, and the light-outgoing surface (top-surface) is flush with a top surface of the resin.

Abstract: In a light-emitting element module, at least two or more first electrodes of a first substrate that includes a circuit element are joined to at least two or more light-emitting elements. The first substrate includes a first wiring line to an n-th wiring line (n is an integer of 2 or more) that are formed into layers in order from the at least two or more light-emitting elements in a thickness direction of the first substrate. The first wiring line that is located in one of the layers of the first substrate nearest to the at least two or more light-emitting elements is formed at least in an interelectrode region between the adjacent first electrodes of the first substrate in a plan view.

Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Abstract: A display apparatus includes: a plurality of pixel sections, each having a pixel element, to which image display signals are inputted; and test terminals via which the image display signals and test signals that are inputted from an outside source are selectively inputted to the plurality of pixel sections. A display apparatus includes: a plurality of pixel sections each having a pixel element; driver circuit sections that input image display signals to the plurality of pixel sections; and test terminals via which the image display signals and test signals that are inputted from an outside source are selectively inputted to the plurality of pixel sections, or the driver circuit sections generate test signals in accordance with test signals that are inputted from an outside source, and input the test signals thus generated to the plurality of pixel sections.

Abstract: A display device includes plural pixel elements that are arranged on a foundation substrate in a matrix manner. Among the plural pixel elements, outside pixel elements positioned in an outer periphery are set as a non-display region, and inside pixel elements positioned on an inside are set as a display region.

Abstract: A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.