Patents by Inventor Hiroyoshi Iijima
Hiroyoshi Iijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9487656Abstract: A heat-curable addition-reactive type silicone rubber composition which gives a molded article having excellent antistatic property, heat resistance, compression set property. The heat-curable addition-reactive type silicone rubber composition includes: (A) a mixture containing a heat curable addition-reactive silicone rubber and a curing agent, (B) an ionic liquid in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass, (C) a heterocyclic compound containing nitrogen atoms in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass.Type: GrantFiled: November 1, 2013Date of Patent: November 8, 2016Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Hiroyoshi Iijima, Hideo Takahashi, Hidefumi Tagai
-
Patent number: 9487639Abstract: The present invention provides a heat-curable silicone rubber composition capable of giving a stable and high antistatic property for a long time without degrading inherent properties of a silicone rubber, such as thermal stability. The heat-curable silicone rubber composition includes: (A) 100 parts by mass of a mixture of a polyorganosiloxane obtained by polymerization by using an alkali metal hydroxide as a polymerization catalyst and by neutralization, and a curing agent, and (B) 50 to 1000 ppm of an ionic substance containing an anion and a cation, and being a bis(trifluoromethanesulfonyl)imide as the anion.Type: GrantFiled: November 1, 2013Date of Patent: November 8, 2016Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Hidefumi Tagai, Hiroyoshi Iijima, Hideo Takahashi
-
Patent number: 9343196Abstract: Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 ?·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.Type: GrantFiled: January 24, 2013Date of Patent: May 17, 2016Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Toshihiko Matsukura, Hiroyoshi Iijima, Masanari Shimakawa
-
Publication number: 20150299398Abstract: The present invention provides a heat curable addition-reactive type silicone rubber composition which gives a molded article having excellent antistatic property, heat resistance, compression set property. A heat curable addition-reactive type silicone rubber composition includes: (A) a mixture containing a heat curable addition-reactive silicone rubber and a curing agent, (B) an ionic liquid in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass, (C) a heterocyclic compound containing nitrogen atoms in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass.Type: ApplicationFiled: November 1, 2013Publication date: October 22, 2015Applicant: Momentive Performance Materials Japan LLCInventors: Hiroyoshi IIJIMA, Hideo TAKAHASHI, Hidefumi TAGAI
-
Publication number: 20150291766Abstract: The present invention provides a heat curable silicone rubber composition capable of giving a stable and high antistatic property for a long time without degrading inherent properties of a silicone rubber, such as thermal stability. A heat curable silicone rubber composition includes: (A) 100 parts by mass of a mixture of a polyorganosiloxane obtained by polymerization by using an alkali metal hydroxide as a polymerization catalyst and by neutralization, and a curing agent, and (B) 50 to 1000 ppm of an ionic substance containing an anion and a cation, and being a bis (trifluoromethanesulfonyl) imide as the anion.Type: ApplicationFiled: November 1, 2013Publication date: October 15, 2015Inventors: Hidefumi Tagai, Hiroyoshi Iijima, Hideo Takahashi
-
Publication number: 20150252238Abstract: The present invention provides a heat curable silicone rubber composition capable of obtaining a cured product having a good transparency and antistatic property. A heat curable silicone rubber composition includes: (A) 100 parts by mass of an organopolysiloxane, (B) 10 to 400 parts by mass of a silicone resin, (C) an organohydrogenpolysiloxane in an amount such that the number of the hydrogen atoms bonded to a silicon atom per one alkenyl group bonded to a. silicon atom in the component (A) and the component (B) is 1.0 to 10.0, (D) a silicone rubber base polymer containing a hydrosilylation reaction catalyst, and (E) 30 to 3000 ppm of an ionic liquid serving as an antistatic agent, wherein the ionic liquid of the component (E) is one in which a difference of a refractive index from a refractive index of a cured product of the silicone rubber base polymer is within the range of ±0.04.Type: ApplicationFiled: November 1, 2013Publication date: September 10, 2015Inventors: Hideo Takahashi, Hiroyoshi Iijima, Hidefumi Tagai
-
Publication number: 20140296387Abstract: Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 ?·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.Type: ApplicationFiled: January 24, 2013Publication date: October 2, 2014Inventors: Toshihiko Matsukura, Hiroyoshi Iijima, Masanari Shimakawa
-
Publication number: 20140275363Abstract: The present invention provides a heat-curable silicone rubber composition having antistatic properties, even after secondary vulcanization at high temperatures. Specifically disclosed is a heat-curable silicone rubber composition which is obtained by adding 0.05 to 1000 ppm of (B) a poorly water-soluble or water-insoluble ionic substance whose anionic component is bis(trifluoromethanesulfonyl)imide, to 100 parts by weight of (A) a heat-curable silicone rubber.Type: ApplicationFiled: May 27, 2014Publication date: September 18, 2014Inventors: Hiroyoshi IIJIMA, Hideo TAKAHASHI
-
Patent number: 8779072Abstract: The present invention provides a heat-curable silicone rubber composition having antistatic properties, even after secondary vulcanization at high temperatures. Specifically disclosed is a heat-curable silicone rubber composition which is obtained by adding 0.05 to 1000 ppm of (B) a poorly water-soluble or water-insoluble ionic substance whose anionic component is bis(trifluoromethanesulfonyl)imide, to 100 parts by weight of (A) a heat-curable silicone rubber.Type: GrantFiled: December 26, 2008Date of Patent: July 15, 2014Assignee: Momentive Performance Materials Japan LLCInventors: Hiroyoshi Iijima, Hideo Takahashi
-
Publication number: 20130225735Abstract: Provided is a silicone rubber composition to form a high voltage insulation cured material, having tracking resistance, providing a low tension set and an excellent mechanical strength such as tensile strength, and having a good tracking resistance.Type: ApplicationFiled: September 28, 2011Publication date: August 29, 2013Inventors: Toshihiko Matsukura, Hiroyoshi Iijima
-
Patent number: 8030378Abstract: The present invention provides a silica-containing heat curing silicone rubber compound composition which can be produced safely and hardly suffers from inclusion of foreign substances. More specifically, when (A) 100 parts by weight of a polyorganosiloxane base polymer and (B) 1 to 100 parts by weight of a reinforcing silica are mixed together, (C) 0.05 to 80 ppm of an ionic liquid whose anionic component is bis(trifluoromethanesulfonyl)imide is added thereto.Type: GrantFiled: December 26, 2008Date of Patent: October 4, 2011Assignee: Momentive Performance Materials Japan LLCInventor: Hiroyoshi Iijima
-
Publication number: 20110118392Abstract: The present invention provides a silica-containing heat curing silicone rubber compound composition which can be produced safely and hardly suffers from inclusion of foreign substances. More specifically, when (A) 100 parts by weight of a polyorganosiloxane base polymer and (B) 1 to 100 parts by weight of a reinforcing silica are mixed together, (C) 0.05 to 80 ppm of an ionic liquid whose anionic component is bis(trifluoromethanesulfonyl)imide is added thereto.Type: ApplicationFiled: December 26, 2008Publication date: May 19, 2011Inventor: Hiroyoshi Iijima
-
Publication number: 20110039991Abstract: The present invention provides a heat curing silicone rubber composition having antistatic properties even after secondary vulcanization at high temperatures. Specifically, disclosed is a heat curing silicone rubber composition which is obtained by adding 0.05 to 1000 ppm of (B) a poorly water-soluble or water-insoluble ionic substance whose anionic component is bis(trifluoromethanesulfonyl)imide, to 100 parts by weight of (A) a heat curing silicone rubber.Type: ApplicationFiled: December 26, 2008Publication date: February 17, 2011Inventors: Hiroyoshi Iijima, Hideo Takahashi
-
Patent number: 6096792Abstract: A silicone rubber sponge composition obtained by compounding a polyorganosiloxane having an average degree of polymerization of 3,000 to 300,000, a reinforcing silica filler, 1,1'-azo-bis(1-acetoxy-1-phenylethane) as a foaming agent, and organic peroxides and/or addition reaction curing agents. The silicone rubber sponge composition can provide a silicone rubber sponge which has a high foaming ratio, has a fine and uniform cell structure, has excellent surface smoothness of the skin layer, does not show a surface tackiness, has a good compression set, and does not require a post cure of a long time.Type: GrantFiled: April 28, 1997Date of Patent: August 1, 2000Assignee: Toshiba Silicone Co., Ltd.Inventors: Hiroyoshi Iijima, Makoto Sawada, Isao Iida