Abstract: An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable resin, a radical polymerization initiator, and a fire retardant. Specifically provided are a curable resin represented by General Formula (1) and a curable resin composition containing the curable resin, a radical polymerization initiator (B), and a fire retardant (C): in the formula, Ra and Rb each independently represent an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon number of 1 to 12; k indicates an integer of 0 to 3; X represents a hydrocarbon group; and Y represents General Formula (2) or (3) below: in the formula, Z represents an alicyclic group, an aromatic group, or a heterocyclic group.

Abstract: An object is to provide a cured product superior in heat resistance (high glass transition temperature) and dielectric properties (low dielectric properties) by using a curable resin having a specific structure and superior in storage stability. Specifically, a curable resin represented by general formula (1) below and having a hydroxyl group concentration of 0.005 to 3800 mmol/kg is provided.

Abstract: An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R1, R2, R3, k, and X are as described herein.

Abstract: An object is to provide a cured product, for example, that is made with a curable resin composition containing a curable resin having a particular structure, a radical polymerization initiator, and a flame retardant and therefore is superior in flame retardancy, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties). Specifically, there are provided a curable resin represented by general formula (1) below and a curable resin composition containing this curable resin, a radical polymerization initiator (B), and a flame retardant (C). (In general formula (1) above, Y is a substituent represented by general formula (2) below, and the details of the substituents and the numbers of substituents presented in general formulae (1) and (2) above are as described in the text.

Abstract: Provided is a cured product having excellent heat resistance and dielectric properties (low dielectric properties) by using a curable resin characterized by having an indane skeleton. Specifically, provided are a curable resin having an indane skeleton represented by the following formula, a resin composition containing the same, and a cured product thereof. X is a (meth)acryloyl group; Ra and Rb are each an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12; j is an integer of 1 to 3; k and 1 are each an integer of 0 to 4; n is an average number of repeating units, being 0.5 to 20; and m is an integer of 0 to 2.

Abstract: The present invention provides an aqueous urethane resin composition containing (A) a urethane resin, (B) an organic solvent having a boiling point of 150 to 350° C., and (C) an aqueous medium, the aqueous urethane resin composition being characterized in that the organic solvent (B) has a Hansen solubility parameter in which a dispersion member (?d) is 15.5 MPa0.5 or more and less than 20 MPa0.5, a polar member (?p) is 4.5 MPa0.5 or more and less than 12 MPa0.5, and a hydrogen-bonding member (?h) is 3 MPa0.5 or more and less than 10.5 MPa0.5. The aqueous urethane resin composition has excellent film formability, corrosion resistance, chemical resistance, and substrate adhesiveness, and is capable of forming a low-toxic coating film.

Abstract: The present invention provides a urethane resin composition containing a urethane resin having polymerizable unsaturated groups and an aqueous medium. The urethane resin is obtained by reacting a polyol with a polyisocyanate. The polyol contains an alkylenediol having two or more polymerizable unsaturated groups or an oxyalkylenediol having two or more polymerizable unsaturated groups. The alkylenediol is represented by general formula (1): HO—R1—OH??(1) (where R1 is a linear alkylene group of one to nine carbon atoms having two or more atomic groups containing a polymerizable unsaturated group in side chains thereof). The oxyalkylenediol (a1-2) is represented by general formula (2): HO—R1O—R2—OR3—OH??(2) (where R1 and R3 are ethylene groups having a total of two or more atomic groups containing a polymerizable unsaturated group in side chains thereof, and R2 is an alkylene group of one to five carbon atoms).

Abstract: The present invention provides a urethane resin composition containing a urethane resin having polymerizable unsaturated groups and an aqueous medium. The urethane resin is obtained by reacting a polyol with a polyisocyanate. The polyol contains an alkylenediol having two or more polymerizable unsaturated groups or an oxyalkylenediol having two or more polymerizable unsaturated groups. The alkylenediol is represented by general formula (1): HO—R1—OH??(1) (where R1 is a linear alkylene group of one to nine carbon atoms having two or more atomic groups containing a polymerizable unsaturated group in side chains thereof). The oxyalkylenediol (a1-2) is represented by general formula (2): HO—R1O—R2—OR3—OH??(2) (where R1 and R3 are ethylene groups having a total of two or more atomic groups containing a polymerizable unsaturated group in side chains thereof, and R2 is an alkylene group of one to five carbon atoms).