Patents by Inventor Hiroyoshi Tagi

Hiroyoshi Tagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10367258
    Abstract: An antenna device of the present disclosure includes: an antenna element that radiates a main lobe of a radio wave and one or more side lobes of the radio wave; and a radome through which the main lobe of the radio wave and the one or more side lobes of the radio wave. The radome has a focusing lens structure that focuses the main lobe of the radio wave and a diverging lens structure that diverges the one or more side lobes of the radio wave.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: July 30, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Hiroyoshi Tagi
  • Patent number: 10122074
    Abstract: An antenna device comprises a dielectric substrate that has first and second surfaces; first and second antenna elements that are arranged on the first surface of the dielectric substrate; a ground conductor that is arranged on the second surface of the dielectric substrate; and an electromagnetic band gap structure that is arranged between the first and second antenna elements on the dielectric substrate. The electromagnetic band gap structure comprises: a plurality of patch conductors that are arranged on the first surface of the dielectric substrate and are electromagnetically coupled with the ground conductor; and at least one opening that is arranged in the ground conductor to expose the dielectric substrate, and causes the electromagnetic coupling between the plurality of patch conductors and the ground conductor to change.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: November 6, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroyoshi Tagi, Hideki Iwaki
  • Patent number: 10014572
    Abstract: An antenna device of the present disclosure includes: a dielectric layer; first and second conductor layers provided on both surfaces, respectively, of the dielectric layer; first and second antenna elements provided in the first conductor layer; a grounded conductor provided in the second conductor layer; and an EBG structure provided between the first and second antenna elements, wherein the EBG structure includes a first EBG portion provided in the first conductor layer, the first EBG portion including a plurality of first patch conductors electromagnetically coupled to the grounded conductor, and a second EBG portion provided in the second conductor layer, the second EBG portion including a plurality of second patch conductors electromagnetically coupled to the grounded conductor.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: July 3, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroyoshi Tagi, Hideki Iwaki
  • Patent number: 9960485
    Abstract: An antenna device comprises a first dielectric substrate; first and second antenna elements arranged on a first surface of the first dielectric substrate; a ground conductor arranged on a second surface of the first dielectric substrate; and an EBG structure arranged between the first and second antenna elements. The EBG structure comprises first patch conductors that are each arranged in contact with the first surface of the first dielectric substrate and are each electromagnetically coupled with the ground conductor; second patch conductors that are each arranged in a prescribed distance from the first surface of the first dielectric substrate in a direction opposite to the second surface, and are each electromagnetically coupled with corresponding one of the first patch conductors; and first connection conductors that electrically connect the first patch conductors with the second patch conductors.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 1, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroyoshi Tagi, Hideki Iwaki
  • Patent number: 9761933
    Abstract: An millimeter wave antenna includes an antenna body adapted to transmit and receive an electromagnetic wave of a millimeter wave band; and a radome that covers a transmitting and receiving surface of the antenna body. The transmitting and receiving surface and the radorm are apart from each other and have a space therebetween. The radome includes a gap adapted to allow the electromagnetic wave of the millimeter wave band to pass through the gap. A radar apparatus for vehicle includes the millimeter wave antenna.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: September 12, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Hiroyoshi Tagi
  • Publication number: 20160344095
    Abstract: An antenna device of the present disclosure includes: an antenna element that radiates a main lobe of a radio wave and one or more side lobes of the radio wave; and a radome through which the main lobe of the radio wave and the one or more side lobes of the radio wave. The radome has a focusing lens structure that focuses the main lobe of the radio wave and a diverging lens structure that diverges the one or more side lobes of the radio wave.
    Type: Application
    Filed: April 1, 2016
    Publication date: November 24, 2016
    Inventor: HIROYOSHI TAGI
  • Publication number: 20160344093
    Abstract: An antenna device of the present disclosure includes: a dielectric layer; first and second conductor layers provided on both surfaces, respectively, of the dielectric layer; first and second antenna elements provided in the first conductor layer; a grounded conductor provided in the second conductor layer; and an EBG structure provided between the first and second antenna elements, wherein the EBG structure includes a first EBG portion provided in the first conductor layer, the first EBG portion including a plurality of first patch conductors electromagnetically coupled to the grounded conductor, and a second EBG portion provided in the second conductor layer, the second EBG portion including a plurality of second patch conductors electromagnetically coupled to the grounded conductor.
    Type: Application
    Filed: April 27, 2016
    Publication date: November 24, 2016
    Inventors: HIROYOSHI TAGI, HIDEKI IWAKI
  • Publication number: 20160141748
    Abstract: An antenna device comprises a dielectric substrate that has first and second surfaces; first and second antenna elements that are arranged on the first surface of the dielectric substrate; a ground conductor that is arranged on the second surface of the dielectric substrate; and an electromagnetic band gap structure that is arranged between the first and second antenna elements on the dielectric substrate. The electromagnetic band gap structure comprises: a plurality of patch conductors that are arranged on the first surface of the dielectric substrate and are electromagnetically coupled with the ground conductor; and at least one opening that is arranged in the ground conductor to expose the dielectric substrate, and causes the electromagnetic coupling between the plurality of patch conductors and the ground conductor to change.
    Type: Application
    Filed: October 14, 2015
    Publication date: May 19, 2016
    Inventors: HIROYOSHI TAGI, HIDEKI IWAKI
  • Publication number: 20160141749
    Abstract: An antenna device comprises a first dielectric substrate; first and second antenna elements arranged on a first surface of the first dielectric substrate; a ground conductor arranged on a second surface of the first dielectric substrate; and an EBG structure arranged between the first and second antenna elements. The EBG structure comprises first patch conductors that are each arranged in contact with the first surface of the first dielectric substrate and are each electromagnetically coupled with the ground conductor; second patch conductors that are each arranged in a prescribed distance from the first surface of the first dielectric substrate in a direction opposite to the second surface, and are each electromagnetically coupled with corresponding one of the first patch conductors; and first connection conductors that electrically connect the first patch conductors with the second patch conductors.
    Type: Application
    Filed: October 16, 2015
    Publication date: May 19, 2016
    Inventors: HIROYOSHI TAGI, HIDEKI IWAKI
  • Publication number: 20150349414
    Abstract: An millimeter wave antenna includes an antenna body adapted to transmit and receive an electromagnetic wave of a millimeter wave band; and a radome that covers a transmitting and receiving surface of the antenna body. The transmitting and receiving surface and the radorm are apart from each other and have a space therebetween. The radome includes a gap adapted to allow the electromagnetic wave of the millimeter wave band to pass through the gap. A radar apparatus for vehicle includes the millimeter wave antenna.
    Type: Application
    Filed: May 14, 2015
    Publication date: December 3, 2015
    Inventor: HIROYOSHI TAGI
  • Patent number: 8119919
    Abstract: Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: February 21, 2012
    Assignee: Panasonic Corporation
    Inventors: Hiroyoshi Tagi, Eiji Takahashi, Yoshiyuki Saito
  • Publication number: 20100163282
    Abstract: Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.
    Type: Application
    Filed: October 22, 2007
    Publication date: July 1, 2010
    Inventors: Hiroyoshi Tagi, Eiji Takahashi, Yoshiyuki Saito
  • Publication number: 20070137890
    Abstract: A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.
    Type: Application
    Filed: January 29, 2007
    Publication date: June 21, 2007
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyoshi Tagi, Tetsuyoshi Ogura, Yutaka Taguchi, Toshiyuki Asahi, Tatsuo Ogawa
  • Patent number: 7056571
    Abstract: There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate, wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except for top portions of the yarns.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: June 6, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoru Tomekawa, Tetsuyoshi Ogura, Hiroyoshi Tagi
  • Publication number: 20040211590
    Abstract: A multilayer printed wiring board of the present invention includes, e.g., an electrical insulating layer, a plurality of wiring layers arranged alternately with the electrical insulating layer, and a plurality of conductors passing through the electrical insulating layer in its thickness direction for electrically connecting the wiring layers. A plating layer is formed so as to cover the side of the electrical insulating layer and electrically connected to ground wiring. The impedance of a signal transmission conductor arranged in the edge portion of the electrical insulating layer is controlled by a ground conductor arranged opposite to the plating layer with this signal transmission conductor sandwiched between them and the plating layer.
    Type: Application
    Filed: April 19, 2004
    Publication date: October 28, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroyoshi Tagi, Seiichi Nakatani, Yoshiyuki Saito, Takeshi Nakayama
  • Publication number: 20040142154
    Abstract: There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except top portions of the yarns.
    Type: Application
    Filed: December 19, 2003
    Publication date: July 22, 2004
    Inventors: Satoru Tomekawa, Tetsuyoshi Ogura, Hiroyoshi Tagi
  • Publication number: 20040012935
    Abstract: A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 22, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroyoshi Tagi, Tetsuyoshi Ogura, Yutaka Taguchi, Toshiyuki Asahi, Tatsuo Ogawa