Patents by Inventor Hiroyoshi Tagi
Hiroyoshi Tagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10367258Abstract: An antenna device of the present disclosure includes: an antenna element that radiates a main lobe of a radio wave and one or more side lobes of the radio wave; and a radome through which the main lobe of the radio wave and the one or more side lobes of the radio wave. The radome has a focusing lens structure that focuses the main lobe of the radio wave and a diverging lens structure that diverges the one or more side lobes of the radio wave.Type: GrantFiled: April 1, 2016Date of Patent: July 30, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Hiroyoshi Tagi
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Patent number: 10122074Abstract: An antenna device comprises a dielectric substrate that has first and second surfaces; first and second antenna elements that are arranged on the first surface of the dielectric substrate; a ground conductor that is arranged on the second surface of the dielectric substrate; and an electromagnetic band gap structure that is arranged between the first and second antenna elements on the dielectric substrate. The electromagnetic band gap structure comprises: a plurality of patch conductors that are arranged on the first surface of the dielectric substrate and are electromagnetically coupled with the ground conductor; and at least one opening that is arranged in the ground conductor to expose the dielectric substrate, and causes the electromagnetic coupling between the plurality of patch conductors and the ground conductor to change.Type: GrantFiled: October 14, 2015Date of Patent: November 6, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroyoshi Tagi, Hideki Iwaki
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Patent number: 10014572Abstract: An antenna device of the present disclosure includes: a dielectric layer; first and second conductor layers provided on both surfaces, respectively, of the dielectric layer; first and second antenna elements provided in the first conductor layer; a grounded conductor provided in the second conductor layer; and an EBG structure provided between the first and second antenna elements, wherein the EBG structure includes a first EBG portion provided in the first conductor layer, the first EBG portion including a plurality of first patch conductors electromagnetically coupled to the grounded conductor, and a second EBG portion provided in the second conductor layer, the second EBG portion including a plurality of second patch conductors electromagnetically coupled to the grounded conductor.Type: GrantFiled: April 27, 2016Date of Patent: July 3, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroyoshi Tagi, Hideki Iwaki
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Patent number: 9960485Abstract: An antenna device comprises a first dielectric substrate; first and second antenna elements arranged on a first surface of the first dielectric substrate; a ground conductor arranged on a second surface of the first dielectric substrate; and an EBG structure arranged between the first and second antenna elements. The EBG structure comprises first patch conductors that are each arranged in contact with the first surface of the first dielectric substrate and are each electromagnetically coupled with the ground conductor; second patch conductors that are each arranged in a prescribed distance from the first surface of the first dielectric substrate in a direction opposite to the second surface, and are each electromagnetically coupled with corresponding one of the first patch conductors; and first connection conductors that electrically connect the first patch conductors with the second patch conductors.Type: GrantFiled: October 16, 2015Date of Patent: May 1, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroyoshi Tagi, Hideki Iwaki
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Patent number: 9761933Abstract: An millimeter wave antenna includes an antenna body adapted to transmit and receive an electromagnetic wave of a millimeter wave band; and a radome that covers a transmitting and receiving surface of the antenna body. The transmitting and receiving surface and the radorm are apart from each other and have a space therebetween. The radome includes a gap adapted to allow the electromagnetic wave of the millimeter wave band to pass through the gap. A radar apparatus for vehicle includes the millimeter wave antenna.Type: GrantFiled: May 14, 2015Date of Patent: September 12, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Hiroyoshi Tagi
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Publication number: 20160344095Abstract: An antenna device of the present disclosure includes: an antenna element that radiates a main lobe of a radio wave and one or more side lobes of the radio wave; and a radome through which the main lobe of the radio wave and the one or more side lobes of the radio wave. The radome has a focusing lens structure that focuses the main lobe of the radio wave and a diverging lens structure that diverges the one or more side lobes of the radio wave.Type: ApplicationFiled: April 1, 2016Publication date: November 24, 2016Inventor: HIROYOSHI TAGI
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Publication number: 20160344093Abstract: An antenna device of the present disclosure includes: a dielectric layer; first and second conductor layers provided on both surfaces, respectively, of the dielectric layer; first and second antenna elements provided in the first conductor layer; a grounded conductor provided in the second conductor layer; and an EBG structure provided between the first and second antenna elements, wherein the EBG structure includes a first EBG portion provided in the first conductor layer, the first EBG portion including a plurality of first patch conductors electromagnetically coupled to the grounded conductor, and a second EBG portion provided in the second conductor layer, the second EBG portion including a plurality of second patch conductors electromagnetically coupled to the grounded conductor.Type: ApplicationFiled: April 27, 2016Publication date: November 24, 2016Inventors: HIROYOSHI TAGI, HIDEKI IWAKI
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Publication number: 20160141748Abstract: An antenna device comprises a dielectric substrate that has first and second surfaces; first and second antenna elements that are arranged on the first surface of the dielectric substrate; a ground conductor that is arranged on the second surface of the dielectric substrate; and an electromagnetic band gap structure that is arranged between the first and second antenna elements on the dielectric substrate. The electromagnetic band gap structure comprises: a plurality of patch conductors that are arranged on the first surface of the dielectric substrate and are electromagnetically coupled with the ground conductor; and at least one opening that is arranged in the ground conductor to expose the dielectric substrate, and causes the electromagnetic coupling between the plurality of patch conductors and the ground conductor to change.Type: ApplicationFiled: October 14, 2015Publication date: May 19, 2016Inventors: HIROYOSHI TAGI, HIDEKI IWAKI
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Publication number: 20160141749Abstract: An antenna device comprises a first dielectric substrate; first and second antenna elements arranged on a first surface of the first dielectric substrate; a ground conductor arranged on a second surface of the first dielectric substrate; and an EBG structure arranged between the first and second antenna elements. The EBG structure comprises first patch conductors that are each arranged in contact with the first surface of the first dielectric substrate and are each electromagnetically coupled with the ground conductor; second patch conductors that are each arranged in a prescribed distance from the first surface of the first dielectric substrate in a direction opposite to the second surface, and are each electromagnetically coupled with corresponding one of the first patch conductors; and first connection conductors that electrically connect the first patch conductors with the second patch conductors.Type: ApplicationFiled: October 16, 2015Publication date: May 19, 2016Inventors: HIROYOSHI TAGI, HIDEKI IWAKI
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Publication number: 20150349414Abstract: An millimeter wave antenna includes an antenna body adapted to transmit and receive an electromagnetic wave of a millimeter wave band; and a radome that covers a transmitting and receiving surface of the antenna body. The transmitting and receiving surface and the radorm are apart from each other and have a space therebetween. The radome includes a gap adapted to allow the electromagnetic wave of the millimeter wave band to pass through the gap. A radar apparatus for vehicle includes the millimeter wave antenna.Type: ApplicationFiled: May 14, 2015Publication date: December 3, 2015Inventor: HIROYOSHI TAGI
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Patent number: 8119919Abstract: Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.Type: GrantFiled: October 22, 2007Date of Patent: February 21, 2012Assignee: Panasonic CorporationInventors: Hiroyoshi Tagi, Eiji Takahashi, Yoshiyuki Saito
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Publication number: 20100163282Abstract: Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.Type: ApplicationFiled: October 22, 2007Publication date: July 1, 2010Inventors: Hiroyoshi Tagi, Eiji Takahashi, Yoshiyuki Saito
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Publication number: 20070137890Abstract: A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.Type: ApplicationFiled: January 29, 2007Publication date: June 21, 2007Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyoshi Tagi, Tetsuyoshi Ogura, Yutaka Taguchi, Toshiyuki Asahi, Tatsuo Ogawa
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Patent number: 7056571Abstract: There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate, wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except for top portions of the yarns.Type: GrantFiled: December 19, 2003Date of Patent: June 6, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoru Tomekawa, Tetsuyoshi Ogura, Hiroyoshi Tagi
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Publication number: 20040211590Abstract: A multilayer printed wiring board of the present invention includes, e.g., an electrical insulating layer, a plurality of wiring layers arranged alternately with the electrical insulating layer, and a plurality of conductors passing through the electrical insulating layer in its thickness direction for electrically connecting the wiring layers. A plating layer is formed so as to cover the side of the electrical insulating layer and electrically connected to ground wiring. The impedance of a signal transmission conductor arranged in the edge portion of the electrical insulating layer is controlled by a ground conductor arranged opposite to the plating layer with this signal transmission conductor sandwiched between them and the plating layer.Type: ApplicationFiled: April 19, 2004Publication date: October 28, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Hiroyoshi Tagi, Seiichi Nakatani, Yoshiyuki Saito, Takeshi Nakayama
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Publication number: 20040142154Abstract: There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except top portions of the yarns.Type: ApplicationFiled: December 19, 2003Publication date: July 22, 2004Inventors: Satoru Tomekawa, Tetsuyoshi Ogura, Hiroyoshi Tagi
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Publication number: 20040012935Abstract: A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.Type: ApplicationFiled: July 7, 2003Publication date: January 22, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Hiroyoshi Tagi, Tetsuyoshi Ogura, Yutaka Taguchi, Toshiyuki Asahi, Tatsuo Ogawa