Abstract: A pressure sensor 1 according to the first aspect of the invention includes: a substrate 50; and a functional element 40 which is laid on the substrate 50 and is composed of functional titanium oxide including crystal grains of at least one of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5) and having the property that at least a portion of crystal grains of at least one of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5) change into crystal grains of titanium dioxide (TiO2) when the functional titanium oxide is heated to 350° C. or higher. The substrate 50 includes a substrate thin-film section 51 having a thin film form in which the thickness in the stacking direction of the substrate 50 and the functional element 40 is smaller than that in the other directions.

Abstract: A functional element includes functional titanium oxide. The functional titanium oxide includes crystal grains of one or more of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5). The functional titanium oxide includes the property that at least a portion of crystal grains of one or more of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5) changes into crystal grains of titanium oxide (TiO2) when the functional titanium oxide is heated to 350° C. or higher.

Abstract: A time-dependent element of the present invention includes a time-dependent phase transition material that undergoes solid-solid phase transition developing with time after production irrespective of the presence of an external stimulus, in which one or more physical properties of the time-dependent element selected from a group consisting of composition, volume, transmittance, reflectance, electric resistance, and magnetic property change with time. A physical property temporal change prediction device includes a physical property temporal change prediction device body having the time-dependent element and is configured to predict a temporal change in one or more physical properties selected from a group consisting of composition, volume, transmittance, reflectance, electric resistance, and magnetic property.

Abstract: a pressure sensor 1 according to the first aspect of the invention includes: a substrate 50; and a functional element 40 which is laid on the substrate 50 and is composed of functional titanium oxide including crystal grains of at least one of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5) and having the property that at least a portion of crystal grains of at least one of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5) change into crystal grains of titanium dioxide (TiO2) when the functional titanium oxide is heated to 350° C. or higher. The substrate 50 includes a substrate thin-film section 51 having a thin film form in which the thickness in the stacking direction of the substrate 50 and the functional element 40 is smaller than that in the other directions.

Abstract: A functional element includes functional titanium oxide. The functional titanium oxide includes crystal grains of one or more of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5). The functional titanium oxide includes the property that at least a portion of crystal grains of one or more of ?-phase trititanium pentoxide (?-Ti3O5) and ?-phase trititanium pentoxide (?-Ti3O5) changes into crystal grains of titanium oxide (TiO2) when the functional titanium oxide is heated to 350° C. or higher.

Abstract: An insulating thermally conductive resin composition (10) includes a matrix resin (1) and insulators (2). The insulators (2) are dispersed in the matrix resin and have electrical insulation. The insulating thermally conductive resin composition further includes a thermally conductive phase (3) which has a hither thermal conductivity than the matrix resin and thermally connects the insulators with each other. The thermally conductive phase (3) is composed of an organic substance. The thermally conductive phase that thermally connects the insulators is composed of the organic substance, so that the resultant insulating thermally conductive resin composition has electrical insulation while having improved thermal conductivity.

Abstract: An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 ?m. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 ?m.

Abstract: An insulating thermally conductive resin composition (10) includes a matrix resin (1) and insulators (2). The insulators (2) are dispersed in the matrix resin and have electrical insulation. The insulating thermally conductive resin composition further includes a thermally conductive phase (3) which has a hither thermal conductivity than the matrix resin and thermally connects the insulators with each other. The thermally conductive phase (3) is composed of an organic substance. The thermally conductive phase that thermally connects the insulators is composed of the organic substance, so that the resultant insulating thermally conductive resin composition has electrical insulation while having improved thermal conductivity.

Abstract: An LED unit (100) includes a base unit (1). The LED unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having LED chips, the light emitting device being placed on a front surface of the base unit. The base unit is formed of a molding in which a metal member (11) is covered with thermally conductive resin having an electrical insulation property, and the thermally conductive resin is interposed between the light emitting device and the metal member. The LED unit can thus efficiently radiate heat generated in the light emitting device through the base unit toward a fixture to which the LED unit is attached.

Abstract: An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 ?m. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 ?m.

Abstract: The present disclosure is directed to providing a thermally conductive resin composition which can realize high thermal conduction without increasing the content of a thermally conductive filler, and also exhibits satisfactory moldability. Disclosed is a thermally conductive resin composition, comprising: a thermally conductive filler; and a binder resin, wherein the thermally conductive filler contains: a hard filler having a Mohs hardness of 5 or more; and a soft filler having a Mohs hardness of 3 or less, and wherein when the thermally conductive resin composition is solidified to stabilize its shape, the soft filler is pressed by the hard filler in the thermally conductive resin composition so that a surface of the soft filler is deformed by the hard filler in the pressed state to provide a face contact between the soft filler and the hard filler.

Abstract: The present invention provides a thermally conductive resin composition which can realize high thermal conduction without increasing a content of a thermally conductive filler by including a specific thermally conductive inorganic filler, and also exhibits satisfactory moldability. Disclosed is a thermally conductive resin composition, including: a thermally conductive filler; and a binder resin, wherein the thermally conductive resin composition contains, as the thermally conductive filler, an irregularly shaped filler having projection/recess structures on its surface.

Abstract: An aluminum nitride sintered product with a high thermal conductivity (at least 100 W/m.K) can be prepared at a sintering temperature of less than 1850.degree. C. (often less than 1650.degree. C.) using a sinterable combination of aluminum nitride powder with at least three sintering aids. The sintering aids include a source of a rare earth metal oxide, a source of an alkaline earth metal oxide, a boron source and, optionally, a source of aluminum oxide. The sinterable combinations may also be used to prepare cofired, multilayer substrates.

Abstract: An aluminum nitride (AlN) sintered product with a high thermal conductivity of 120 W/m.multidot.k or above can be produced at a relatively low sintering temperature of 1650.degree. C. or below in accordance with the following process of the present invention. That is, an A1N powder having a specific surface in a region of about 3.5 to 8 m.sup.2 /g and an oxygen content between 0.5 to 1.8 wt % is mixed with optimum additive amounts of sintering aids (I) to (III) to obtain a mixture powder. The sintering aid (I) is at least one selected from the group consisting of rare earth oxides and rare earth compounds which are converted to corresponding rare earth oxides by the sintering. The sintering aid (II) is at least one selected from the group consisting of alkaline earth oxides and alkaline earth compounds which are converted to corresponding alkaline earth oxides by the sintering. The sintering aid (III) is at least one selected from the group consisting of LAB.sub.6, NbC, and WB.

Abstract: A process for producing aluminum nitride powders is disclosed, which comprises mixing a water-soluble aluminum-containing compound or an aluminum alkoxide and a water-soluble carbon-containing compound and/or a water-soluble nitrogen-containing compound, with water; drying the mixture to obtain a solid; and calcining the solid in a nitrogen-containing non-oxidative atmosphere. According to the process of the invention, high-purity uniform aluminum nitride fine powders can be obtained rapidly and inexpensively.