Patents by Inventor Hiroyuka Shiraki

Hiroyuka Shiraki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing silicon wafer and silicon wafer
    Publication number: 20040053516
    Abstract: Silicon wafer W is thermal-annealed in atmosphere G to form new vacancies therein in a thermal annealing step and atmosphere G in the thermal annealing step contains a nitride gas having a lower decomposition temperature than a decomposable temperature of N2 so that the thermal annealing is carried out at a lower temperature or for a short time to suppress generation of slip and to provide satisfactory surface roughness.
    Type: Application
    Filed: May 28, 2003
    Publication date: March 18, 2004
    Inventors: Yoshinobu Nakada, Hiroyuka Shiraki