Patents by Inventor Hiroyuki AOU

Hiroyuki AOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10701850
    Abstract: When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: June 30, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Hiroyuki Aou, Takeshi Shibabuki
  • Publication number: 20180177085
    Abstract: When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.
    Type: Application
    Filed: May 29, 2015
    Publication date: June 21, 2018
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yoshihiro YASUI, Hiroyuki AOU, Takeshi SHIBABUKI