Patents by Inventor Hiroyuki ASAKAWA

Hiroyuki ASAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing method
    Patent number: 11699612
    Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: July 11, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Keiichi Takemoto, Yoichi Harayama, Hiroyuki Asakawa, Takahiro Rokugawa
  • Substrate fixing device
    Patent number: 11631598
    Abstract: A substrate fixing device includes a baseplate, an insulating layer over the baseplate, and an electrostatic chuck on the insulating layer. The insulating layer includes a heating element and a metal layer. The metal layer has a higher thermal conductivity than the insulating layer and is positioned closer to the electrostatic chuck than the heating element.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: April 18, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Iijima, Hiroyuki Asakawa, Keiichi Takemoto, Yoichi Harayama
  • SUBSTRATE FIXING DEVICE, ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK MANUFACTURING METHOD
    Publication number: 20220157636
    Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 19, 2022
    Inventors: Keiichi Takemoto, Yoichi Harayama, Hiroyuki Asakawa, Takahiro Rokugawa
  • SUBSTRATE FIXING DEVICE
    Publication number: 20200176282
    Abstract: A substrate fixing device includes a baseplate, an insulating layer over the baseplate, and an electrostatic chuck on the insulating layer. The insulating layer includes a heating element and a metal layer. The metal layer has a higher thermal conductivity than the insulating layer and is positioned closer to the electrostatic chuck than the heating element.
    Type: Application
    Filed: November 22, 2019
    Publication date: June 4, 2020
    Inventors: Nobuyuki IIJIMA, Hiroyuki ASAKAWA, Keiichi TAKEMOTO, Yoichi HARAYAMA