Patents by Inventor Hiroyuki Etoh

Hiroyuki Etoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8402642
    Abstract: In a pocket coil spring structure assembling apparatus, a row-of-pocket-coil-springs auxiliary feed stock mechanism and a row-of-pocket-coil-springs delivery mechanism are connected together in series so as to form a row-of-pocket-coil-springs supply unit, a plurality of row-of-pocket-coil-springs supply units are disposed on an upstream side with respect to a sealing/cutting mechanism, a control apparatus is allowed to alternatively select a row-of-pocket-coil-springs supply unit to face the sealing/cutting mechanism from the plurality of row-of-pocket-coil-springs supply units, and a row-of-pocket-coil-springs supply unit alternatively selected is moved to face the sealing/cutting mechanism.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: March 26, 2013
    Assignee: Matsushita Industrial Co., Ltd.
    Inventors: Toshinori Kujuro, Hiroyuki Etoh
  • Publication number: 20110154653
    Abstract: In a pocket coil spring structure assembling apparatus, a row-of-pocket-coil-springs auxiliary feed stock mechanism and a row-of-pocket-coil-springs delivery mechanism are connected together in series so as to form a row-of-pocket-coil-springs supply unit, a plurality of row-of-pocket-coil-springs supply units are disposed on an upstream side with respect to a sealing/cutting mechanism, a control apparatus is allowed to alternatively select a row-of-pocket-coil-springs supply unit to face the sealing/cutting mechanism from the plurality of row-of-pocket-coil-springs supply units, and a row-of-pocket-coil-springs supply unit alternatively selected is moved to face the sealing/cutting mechanism.
    Type: Application
    Filed: September 8, 2010
    Publication date: June 30, 2011
    Inventors: Toshinori KUJURO, Hiroyuki Etoh
  • Publication number: 20090291300
    Abstract: An adhesive sheet comprising a substrate and an adhesive layer formed on at least one side of the substrate, characterized in that an adhesive agent contained in the adhesive layer comprises an acrylic ester copolymer and a citrate plasticizer; the acrylic ester copolymer has a glass transition temperature of ?45° C. or less; the citrate plasticizer is contained in an amount of 1.0 to 50.0 parts by mass (solid content), with respect to 100 parts by mass (solid content) of the acrylic ester copolymer; and a rate of a gel content in the adhesive agent in the adhesive layer is 70% or more, is disclosed. The adhesive sheet according to the present invention has a slightly-adhesive property and a removable property, and can be suitably used, for example, as a carrier sheet.
    Type: Application
    Filed: July 6, 2007
    Publication date: November 26, 2009
    Applicant: LINTEC CORPORATION
    Inventors: Hiroyuki Etoh, Takuya Tetsumoto
  • Publication number: 20080110574
    Abstract: A manufacturing method for efficiently cutting a pocket coil spring row which is incorporated and used in a chair, sofa, or bed mattress into lengths suitable for the use without waste of the material is provided wherein a method for double-sealing a separating portion between adjacent pocket coil springs at an arbitrary length position of a serial pocket coil spring row by means of ultrasonic welding or impulse welding and cutting a portion between the double seals with a cutter knife is provided.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 15, 2008
    Inventor: Hiroyuki Etoh
  • Patent number: 4885614
    Abstract: The present invention discloses a semiconductor device comprising a semiconductor layer being made of monocrystalline silicon or silicon-germanium alloy and a semiconductor layer being made of silicon-germanium-carbon alloy formed thereon, wherein the two layers form a heterojunction therebetween. In such a device, no lattice mismatch occurs between the layers or even if lattice mismatch occurs, it is only slight, so that the silicon-germanium-carbon alloy layer is in no danger of causing misfit dislocation therein.
    Type: Grant
    Filed: July 8, 1988
    Date of Patent: December 5, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Seijiro Furukawa, Hiroyuki Etoh, Akitoshi Ishizaka, Toshikazu Shimada