Patents by Inventor Hiroyuki Fukai
Hiroyuki Fukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11393621Abstract: A winding wire having a stranded wire formed by twisting a plurality of element wires whose a copper wire having a wire diameter of 0.05 to 0.5 mm and an extrusion coating layer coating the plurality of the element wires, wherein at least one of the element wires has a magnetic layer on an outer circumference of the copper wire, and the thickness of the extrusion coating layer is 40 to 400 ?m; as well as a coil and a transformer using the winding wire.Type: GrantFiled: October 19, 2018Date of Patent: July 19, 2022Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.Inventors: Hiroyuki Fukai, Isamu Kobayashi
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Patent number: 10645804Abstract: An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C.Type: GrantFiled: July 6, 2012Date of Patent: May 5, 2020Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Masaharu Matsuura, Nobuyuki Ogawa, Hiroaki Fujita, Hiroyuki Fukai
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Publication number: 20190051451Abstract: A winding wire having a stranded wire formed by twisting a plurality of element wires whose a copper wire having a wire diameter of 0.05 to 0.5 mm and an extrusion coating layer coating the plurality of the element wires, wherein at least one of the element wires has a magnetic layer on an outer circumference of the copper wire, and the thickness of the extrusion coating layer is 40 to 400 ?m; as well as a coil and a transformer using the winding wire.Type: ApplicationFiled: October 19, 2018Publication date: February 14, 2019Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.Inventors: Hiroyuki FUKAI, lsamu KOBAYASHI
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Publication number: 20140199533Abstract: An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C.Type: ApplicationFiled: July 6, 2012Publication date: July 17, 2014Inventors: Masaharu Matsuura, Nobuyuki Ogawa, Hiroaki Fujita, Hiroyuki Fukai
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Publication number: 20140008105Abstract: A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board mounting part. Through holes are provided in the printed circuit board. The conductor part is formed substantially perpendicular to the circuit board mounting part, and is inserted into a through hole. A female screw part is formed in the vicinity of the conductor part in the printed circuit board mounting part. The female screw part can be screwed together with a bolt, which is a securing member. The printed circuit board is connected to the conductor part by solder. A hole is formed in advance in the vicinity of the solder on the printed circuit board. The bolt passes through the hole and is secured to the female screw part.Type: ApplicationFiled: September 9, 2013Publication date: January 9, 2014Applicants: FURUKAWA AUTOMOTIVE SYSTEMS INC., FURUKAWA ELECTRIC CO., LTD.Inventors: Kyutaro ABE, Hiroyuki FUKAI, Yasushi KIHARA, Juro UTSUMI, Naomi TAKAHASHI
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Publication number: 20130112373Abstract: It is an object to provide a cooling device with an increased leeward cooling capacity without increasing the number of heat radiation fins to be installed and the amount of cooling air. The cooling device comprises a heat-receiving block thermally connected to a heat-generating element and heat radiation fin groups having a plurality of fins thermally connected to the heat-receiving block. A flow of cooling air is set in the direction parallel to the heat-receiving block. The plurality of heat radiation fin groups are arranged in tandem along the flow direction of the cooling air. Of the plurality of the heat radiation fin groups, the fin pitch of the heat radiation fin group arranged on the windward side of the cooling air is larger than the fin pitch of the heat radiation fin group arranged on the leeward side of the cooling air.Type: ApplicationFiled: May 18, 2011Publication date: May 9, 2013Inventors: Hiroyuki Fukai, Nobuyuki Hashimoto, Hiroshi Yamada, Masami Ikeda, Mamoru Shimada
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Patent number: 7572503Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.Type: GrantFiled: June 24, 2005Date of Patent: August 11, 2009Assignee: Hitachi Chemical Co., Ltd.Inventors: Shin Takanezawa, Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita
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Patent number: 6979712Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.Type: GrantFiled: February 9, 2004Date of Patent: December 27, 2005Assignee: Hitachi Chemical Co., Ltd.Inventors: Shin Takanezawa, Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita
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Publication number: 20050255270Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.Type: ApplicationFiled: June 24, 2005Publication date: November 17, 2005Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Shin Takanezawa, Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita
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Publication number: 20040161612Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.Type: ApplicationFiled: February 9, 2004Publication date: August 19, 2004Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Shin Takanezawa, Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita
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Patent number: 6306481Abstract: A multilayer circuit board having a resolution in the range of 25-80 &mgr;m, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220° C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.Type: GrantFiled: June 22, 1999Date of Patent: October 23, 2001Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.Inventors: Satoru Amou, Masao Suzuki, Tokihito Suwa, Mineo Kawamoto, Akio Takahashi, Masanori Nemoto, Hiroyuki Fukai, Mitsuo Yokota, Shiro Kobayashi, Masashi Miyazaki
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Patent number: 6190834Abstract: The present invention provides a photosensitive resin composition capable of forming an insulating film, which is superior in both a roughening property and an adhesiveness, and a via-hole, which is highly reliable in connection, and a multilayer printed circuit board. The present invention provides a photosensitive resin composition containing a first resin, which is an epoxy resin, and a second resin having a N-substituted carbamic acid ester atomic group and a radical polymeric unsaturated bond in its side chain. The second resin is desirably an oligomer having a repeating unit expressed by the following general formula (chem. 1) or (chem. 3) by 3-10 units. Where, X is H or CH3, Y and Z is H or an alkyl group of carbon number 1-4, n is 0 or 1, a part of R1 is an atomic group expressed by the following general formula (chem. 2), the residual R1 is a hydroxyl group, and R2 is an alkylene group of carbon number 1-4.Type: GrantFiled: May 6, 1998Date of Patent: February 20, 2001Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.Inventors: Masatoshi Narahara, Mineo Kawamoto, Tokihito Suwa, Masao Suzuki, Satoru Amou, Akio Takahashi, Hiroyuki Fukai, Mitsuo Yokota, Shiro Kobayashi, Masashi Miyazaki
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Patent number: 5914216Abstract: A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.Type: GrantFiled: July 18, 1997Date of Patent: June 22, 1999Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.Inventors: Satoru Amou, Masao Suzuki, Tokihito Suwa, Mineo Kawamoto, Akio Takahashi, Masanori Nemoto, Hiroyuki Fukai, Mitsuo Yokota, Shiro Kobayashi, Masashi Miyazaki