Abstract: A print material storage container has: a substrate on which an electric circuit having terminals is provided; a fixing portion on which the substrate can be mounted by re-fixing; and a fixing member that fixes the fixing portion and a non-terminal portion, which is formed by excluding the terminals from the substrate, to each other. The non-terminal portion includes a re-fixed portion, which can be re-fixed to the fixing portion by the fixing member.

Abstract: A method for producing a glass filament, the method including: irradiating a raw yarn containing 70 wt % or more of SiO2 and having a raw yarn diameter of 100 to 2,000 ?m with laser light having a wavelength of 0.7 to 100 ?m to heat the raw yarn; and stretching the raw yarn to obtain the glass filament having a hydroxyl group (Si—OH) content of 300 ppm or less and a diameter of 1 to 20 ?m.

Abstract: An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.

Abstract: A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.

Abstract: A light-emitting device reliably supplying electric power to a light-emitting element on a supporting base and securing heat dissipation, and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a light-emitting element arranged on a first supporting base; a package covering the first supporting base and the light-emitting element therewith, and supporting the first supporting base; and a thermal conductive member having ends which are bonded to the light-emitting element and the package, respectively, so as to also have a wiring function.

Abstract: An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.

Abstract: An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.

Abstract: A light source module includes a light emitting diode and a wiring board. The light emitting diode (LED) chip group includes LED chips for red, green and blue colors. A plurality of the LED chip groups are mounted on the wiring board. A surface on one side of the wiring board is a device forming surface including the plurality of the LED chip groups, an external connecting terminal for leading out electrodes, and a wiring pattern for electrical connection between the LED chip groups and the external connecting terminal. A surface on the other side of the wiring board is a heat radiating surface which is thermally connected to the device forming surface and operative to radiate heat generated at the device forming surface to the exterior.

Abstract: A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.

Abstract: A light-emitting device reliably supplying electric power to a light-emitting element on a supporting base and securing heat dissipation, and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a light-emitting element arranged on a first supporting base; a package covering the first supporting base and the light-emitting element therewith, and supporting the first supporting base; and a thermal conductive member having ends which are bonded to the light-emitting element and the package, respectively, so as to also have a wiring function.

Abstract: An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.

Abstract: A light source apparatus is configured to generate light efficiently from a light-emitting device. The light source apparatus includes a substrate having a pair of electrodes, a light-emitting device and a transparent resin for sealing the light-emitting device. A white resist layer is formed on the substrate. The white resist layer is formed to cover apart of the electrodes. The white resist layer 6 includes an opening corresponding to the light-emitting device. A white member for controlling a shape of the transparent resin is formed on the white resist layer.

Abstract: A light source apparatus which can improve efficiency in generating light from a light-emitting device is provided. A light source apparatus 10 includes a substrate 1 having a pair of electrodes 2, 3, a light-emitting device 4 and a transparent resin 7 for sealing the light-emitting device 4, in which a white resist layer 6 is formed on the substrate 1, the white resist layer 6 is formed to cover part of the electrodes 2, 3, the white resist layer 6 includes an opening portion formed on at least the light-emitting device 4, near the light-emitting device and terminals of the electrodes 2, 3, and a white member for controlling a shape of the transparent resin 7 is formed on the white resist layer 6.

Abstract: A light source module includes a light emitting diode and a wiring board. The light emitting diode (LED) chip group includes LED chips for red, green and blue colors. A plurality of the LED chip groups are mounted on the wiring board. A surface on one side of the wiring board is a device forming surface including the plurality of the LED chip groups, an external connecting terminal for leading out electrodes, and a wiring pattern for electrical connection between the LED chip groups and the external connecting terminal. A surface on the other side of the wiring board is a heat radiating surface which is thermally connected to the device forming surface and operative to radiate heat generated at the device forming surface to the exterior.

Abstract: The present invention is directed to a semiconductor device and a semiconductor module both having an inexpensive and compact structure. The semiconductor module (M1) according to a first embodiment of the present invention is comprised of a plurality of semiconductor devices (A1) through (A3) having a structure that includes external connection electrodes (15) and (16) being provided on both the face side and the back side of outer peripheral portions of a printed wiring board (10), and a semiconductor integrated circuit chip (1A) being mounted on a central portion of the printed wiring board (10). The external connection electrodes (15) of the semiconductor devices (A1) and (A3) and the external connection electrodes (16) of the semiconductor device (A2) are electrically connected to each other by solder Sb, for example, either directly or through a chip part (30) or a relay board (40).

Abstract: A semiconductor device and a semiconductor module which can be constituted with a compact structure and inexpensively. The semiconductor module (M1) according to a first embodiment of the present invention is comprised of a plurality of semiconductor devices (A1), (A2), (A3) . . . having a structure in which external connection electrodes (15) and (16) are provided on both the face side and the back side of outer peripheral portions of a printed wiring board (10) and a semiconductor integrated circuit chip (1A) is mounted on a central portion of the printed wiring board (10), wherein the external connection electrodes (15) of the semiconductor devices (A1) and (A3) and the external connection electrodes (16) of the semiconductor device (A2) are electrically connected to each other by solder Sb or the like, either directly or through a chip part (30) or a relay board (40).

Abstract: An integrated electronic device has at least two semiconductor devices built up in a multi-layer construction on a wiring substrate in which a die pad and a plurality of electrode pads are formed, the semiconductor device having a plurality of electrodes formed thereon. The semiconductor device for a first stage is disposed on the die pad. The semiconductor device for a second stage is disposed on the top of the first stage semiconductor device with having an electrically insulating resin layer in between the first and second stage semiconductor devices. The electrodes of the semiconductor devices are wire-bonded with corresponding electrode pads, and all of the build-up semiconductor devices and their wires are sealed with insulating seal resin.

Abstract: A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17.

Abstract: A flux composition for use together with solder preforms, which comprises rosin, N-unsubstituted or N-substituted 2-pyrrolidone, and optionally a high boiling point ester solvent with a content of N-unsubstituted or N-substituted 2-pyrrolidone being 3-50% by weight and a content of the ester solvent being not greater than 30% by weight.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to from a cavity block and a center block. Opposing surfaces of the cavity block halves include a silicone rubber layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.