Abstract: An electrode composite body including a conductive polymer film in which the doping and dedoping capacities of the conductive polymer are improved, an electrolyte, and a redox capacitor including those are provided. The object is achieved by the followings: (1) an electrode composite body including a conductive polymer and an electrode for redox capacitors; (2) an electrode composite including a conductive polymer film and an electrode body for redox capacitors; (3) an electrolyte for redox capacitors that contains an ionic liquid as an essential component; (4) a redox capacitor composed of an electrolyte containing an ionic liquid as an essential component and an electrode composite body for redox capacitors; and (5) a composite body in which the anionic component contained in the ionic liquid and is the same component as a part of the dopant of the conductive polymer.

Abstract: The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200° C.

Abstract: The present invention provides means for forming an oxide film on a metal surface, means for repairing a defect of an oxide film, a high-performance electrolytic capacitor using the means, and an electrolyte of the capacitor. Namely, the prevent invention provides a method for easily forming an oxide film on the surface of a metal or an alloy thereof by anodization using a solution containing an ionic liquid. In an application of this method, an electrolytic capacitor having means for repairing a defect of an oxide film can be formed by a method using, as an electrolyte, an ionic liquid, a solution containing an ionic liquid and a salt, or a solution containing an ionic liquid and a conductive polymer or a TCNQ salt, and a valve metal or an alloy thereof as a metal.

Abstract: The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.

Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.

Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.

Abstract: A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.

Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.

Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Abstract: The invention discloses a thermosetting imide oligomer represented by the general formula (1A) or (1B): ##STR1## Where Ar.sub.1 indicates a tetravalent aromatic group, Ar.sub.2 indicates a divalent aromatic group, Ar.sub.1 or Ar.sub.2 can be of the same or different kind, X indicates a trivalent group and it can be of the same or different kind, n is an integer selected from 1 to 15, and R is a substitution group having reactivity.The invention further discloses a method for manufacturing a heat resistant laminated sheet using the imide oligomer, which is excellent in heat resistance, hygroscopic resistance and electric properties.

Abstract: This invention relates to heat-resistant polyimide blends and laminates thereof, which have excellent heat and moisture resistance, and excellent mechanical properties, including outstanding toughness. The blends contain a thermoplastic polyimide component and a thermosetting imide oligomer. The weight ratio of the thermoplastic component to thermosetting component is selected in the range of 99/1 to 5/95. The thermoplastic polyimide component has a number average molecular weight of 10,000 or more.

Abstract: Thermosetting esterimide oligomers of formulas (IA) and (IB) are disclosed: ##STR1## where A.sub.1, A.sub.2 and A.sub.4 are divalent organic groups, A.sub.3 is a monovalent organic group and A.sub.1, A.sub.2, A.sub.3 and A.sub.4 may be the same or different, with m being an integer of 1-30. The above compounds provide hard substances having excellent workability, heat resistance and mechanical properties.

Abstract: Thermosetting esterimide oligomers of formulas (IA) and (IB) are disclosed: ##STR1## where A.sub.1, A.sub.2 and A.sub.4 are divalent organic groups, A.sub.3 is a monovalent organic group and A.sub.1, A.sub.2, A.sub.3 and A.sub.4 may be the same or different, with m being an integer of 1-30. The above compounds provide hard substances having excellent workability, heat resistance and mechanical properties.

Abstract: A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.