Patents by Inventor Hiroyuki Gokuraku

Hiroyuki Gokuraku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7166348
    Abstract: Description is made of an open cell polystyrene resin foam having a content of organic volatile matters of less than 100 ppm. The open cell foam is suitable as a core material for a sound insulating material or a vacuum heat insulating material. The open cell foam can be produced by melt-kneading a polystyrene resin having a content of organic volatile matters of 100 ppm or higher together with water in an extruder, sucking out the organic volatile matters as an azeotrope with water through a vent, injecting a blowing agent and kneading the injected mixture, and extruding the mixture into a lower pressure area to cause the resin to foam.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: January 23, 2007
    Assignee: JSP Corporation
    Inventors: Masato Naito, Hiroyuki Gokuraku, Daisuke Imanari, Noritoshi Nishiyama
  • Patent number: 6875484
    Abstract: A multi-layer expansion-molded article of a polypropylene resin, which is obtained by molding a multi-layer parison comprising a foamed resin layer and a resin layer provided on the outer side of the foamed resin layer in a mold in such manner that at least part of the opposed inner surfaces of foamed resin layer in the parison are fusion-bonded to each other, and has a polypropylene resin layer on the surface of a foamed polypropylene resin layer, wherein a melt tension, MTfr (gf) and a melt flow rate, MFRfr (g/10 min) obtained by measurement to a polypropylene resin forming the foamed resin layer in the expansion-molded article satisfy the relationship [log MTfr>?0.74 log MFRfr+0.66], and a melt tension, MTur (gf) and a melt flow rate, MFRur (g/10 min) obtained by measurement to a polypropylene resin forming the resin layer on the surface of the foamed resin layer satisfy the relationship [log MTur>?1.02 log MFRur+0.47].
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: April 5, 2005
    Assignee: JSP Corporation
    Inventors: Naochika Kogure, Hiroyuki Gokuraku, Seiji Takahashi, Daisuke Imanari, Takashi Kitahama
  • Publication number: 20030175493
    Abstract: Description is made of an open cell polystyrene resin foam having a content of organic volatile matters of less than 100 ppm. The open cell foam is suitable as a core material for a sound insulating material or a vacuum heat insulating material.
    Type: Application
    Filed: March 12, 2003
    Publication date: September 18, 2003
    Inventors: Masato Naito, Hiroyuki Gokuraku, Daisuke Imanari, Noritoshi Nishiyama
  • Publication number: 20030042644
    Abstract: An extruded, polystyrene-based resin foam plate produced by extruding a foamable molten composition containing a polystyrene-based resin and a blowing agent consisting of (a) isobutane and (b) a blowing agent component other than isobutane, chlorofluorocarbons and fluorocarbons from a high pressure zone into a lower pressure zone. The extruded foam plate has a thickness of at least 10 mm and an apparent density of 25-60 kg/m3 contains residual isobutane in an amount of 0.45-0.80 mol per 1 kg thereof, has cells having an average diameter in the thickness direction thereof of 0.05-0.18 mm and a cell strain rate of 0.7-1.2, wherein the cell strain rate is obtained by dividing the average diameter in the thickness direction of the extruded foam plate by the average diameter in the horizontal direction of the extruded foam plate, meets the flammability standard on extruded polystyrene foam insulation plates as defined in JIS A9511-1995, and has a thermal conductivity of not greater than 0.028 W/m·K.
    Type: Application
    Filed: June 14, 2002
    Publication date: March 6, 2003
    Applicant: JSP CORPORATION
    Inventors: Hiroyuki Gokuraku, Naochika Kogure, Seiji Takahashi, Daisuke Imanari, Masato Naito
  • Patent number: 6432525
    Abstract: In the present invention, for the production of a blow-molded foam, there is used a base resin which is mainly composed of a polypropylene resin and has, at 230° C., a melt tension (MT) of 10 gf or over and a melt flow rate (MFR) of 0.5 g/10 minutes or over. A foaming agent is added to the base resin, followed by melt kneading by means of an extruder under high temperature and high pressure conditions to provide a foamable melt. This melt is subjected to extrusion from a circular die 5 and expanded to form a cylindrical foamed parison 4. Thereafter, molds 6, 6 are clamped, and the parison 4 in a softened condition is placed in the molds 6, 6, and a pressurized gas is blown into the parison 4 from a gas blowing port 7 for blow molding in the form of a hollow shape conforming to the mold profile to produce a blow-molded foam.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: August 13, 2002
    Assignee: JSP Corporation
    Inventors: Hiroyuki Gokuraku, Naochika Kogure, Takashi Kitahama
  • Patent number: 6256937
    Abstract: Prevention of damage of wooden construction materials of a building by termites by laying one or more panels each having a polycarbonate resin foam layer on the ground on which the building is constructed or by arranging such panels on surfaces of continuous footing of the building or of vertical concrete walls of the building. The concrete wall may be formed using modular concrete form structure units each having a pair of opposing side panels, with each side panel having a polycarbonate foam layer.
    Type: Grant
    Filed: December 16, 1998
    Date of Patent: July 10, 2001
    Assignee: JSP Corporation
    Inventors: Naochika Kogure, Takashi Kitahama, Kiyotaka Nanama, Hiroyuki Gokuraku
  • Patent number: 5854294
    Abstract: A polycarbonate resin-containing composition is extruded through a die together with a blowing agent to produce a foamed body. The composition has a storage modulus G'.sub.A dyn/cm.sup.2 at a temperature of 250.degree. C. and an angular frequency of 0.1 rad/sec and a storage modulus G'.sub.B dyn/cm.sup.2 at a temperature of 250.degree. C. and an angular frequency of 10 rad/sec, wherein the storage modulus G'.sub.A and storage modulus G'.sub.B satisfy the following conditions:0.ltoreq..alpha..ltoreq.2.02.20.ltoreq..beta..ltoreq.5.70where .alpha. represents (logG'.sub.B -logG'.sub.A)/2 and .beta. represents (logG'.sub.B+logG'.sub.A)/2.
    Type: Grant
    Filed: January 14, 1997
    Date of Patent: December 29, 1998
    Assignee: JSP Corporation
    Inventors: Kuninori Hirosawa, Yoshihisa Ishihara, Takeshi Aoki, Yasushi Terui, Yoshinori Shimojo, Hiroyuki Gokuraku, Naochika Kogure