Abstract: To provide a cleaning method and a cleaning apparatus for decreasing the total cost by producing high-performance semiconductor using silicon wafers with cleaner surface, decreasing the semiconductor production cost, decreasing the consumption of chemical solutions and the cleaning time by using a new cleaning method and apparatus, simplifying the recovery of waste liquids, and decreasing equipment investment.A cleaning method having a plurality of chemical-solution-cleaning processes characterized by performing a chemical-solution-cleaning process for continuously feeding a chemical solution to the surface of an object to be cleaned from an upper part of the object surface by horizontally setting the object in a cleaning bath, closing the bath, and then rotating the object and an ultrapure-water-cleaning process for feeding ultrapure water in order for each chemical solution in the same cleaning bath; and thereafter drying the object after cleaning it.

Abstract: A bellows pump which is disclosed herein has two bellows made of a plastic material and provided with liquid inlet and outlet ports for transferring a liquid by expanding and contracting the bellows. The bellows pump comprises cylinder cases in each of which the bellows is vertically expandably and contractably contained and mounted at its access port side to a ceiling of said cylinder cases, gas pumping means for alternately feeding a compressed gas from a lower end thereof into the cylinder cases, a pair of rods passed through bottoms of the cylinder cases and fixed to the lower ends of the bellows, and adapted to be moved in response to the expansion and contraction of the bellows, and actuating means adapted to be operated in response to the up and down movement of the rods.