Patents by Inventor Hiroyuki Horino

Hiroyuki Horino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soft magnetic alloy and magnetic component
    Patent number: 12211634
    Abstract: A soft magnetic alloy or the like combines high saturated magnetic flux density, low coercive force and high magnetic permeability ??. A soft magnetic alloy having the composition formula (Fe(1?(?+?))X1?X2?)(1?(a+b+c+d+e))BaSibCcCudMe. X1 is one or more elements selected from the group consisting of Co and Ni, X2 is one or more elements selected from the group consisting of Al, Mn, Ag, Zn, Sn, As, Sb, Bi, N, O and rare earth elements, and M is one or more elements selected from the group consisting of Nb, Hf, Zr, Ta, Ti, Mo, ?? and V. 0.090?a?0.240, 0.030.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: January 28, 2025
    Assignee: TDK CORPORATION
    Inventors: Akihiro Harada, Akito Hasegawa, Kazuhiro Yoshidome, Kenji Horino, Hiroyuki Matsumoto
  • Method of bonding and metallizing for light polarizers
    Patent number: 5427302
    Abstract: A method of bonding a light polarizer having a metal sheet 4, 4-1 affixed to an end face thereof to a securing metal layer 5 involves bonding the securing metal layer 6 to the metal sheet 4, 4-1 by means of welding, whereby not only the working efficiency may be enhanced, but also long-term reliability in bonding may be ensured.
    Type: Grant
    Filed: March 10, 1994
    Date of Patent: June 27, 1995
    Assignee: Chichibu Cement Co., Ltd.
    Inventors: Hiroyuki Horino, Toshiyuki Masuda, Tadatoshi Hosokawa