Abstract: Provided are an ophthalmic lens and a technique related thereto, the ophthalmic lens including two lens elements 1 and 2 having powers with different signs, in which when the Abbe number (e-line reference) of the lens element 1 having a power with a smaller absolute value is ?e1, and the Abbe number (e-line reference) of the other lens element 2 is ?e2, Formula 1 below is satisfied, and ?e1<?e2??(Formula 1) when a partial dispersion ratio PgF?1 between the g-line and F?-line in the lens element 1 having the power with the smaller absolute value, and a partial dispersion ratio PgF?2 between the g-line and F?-line in the other lens element 2 are set, the following Formula 2 is satisfied. PgF?1>PgF?2??(Formula 2).

Abstract: Provided is a resin composition containing: (A) a first cyclic imide compound of the following formula (1): wherein A independently represents a tetravalent organic group having a cyclic structure, Q independently represents an alicyclic hydrocarbon group of the formula (2): wherein R1, R2, R3, and R4 independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and x1 and x2 are each 0 to 4, wherein B independently represents a divalent hydrocarbon group (excluding the group represented by the formula (2)), wherein X represents a hydrogen atom or a methyl group, and wherein n is 1 to 200; (B) a second cyclic imide compound of the formula (3): wherein A, B, and X are defined as above in the formula (1), and s is 0 to 200; (C) an epoxy compound; and (D) a curing catalyst.

Abstract: A resin composition includes: an organic solvent; fixing resin particles; lubricant particles; and water. The lubricant particles each contain an organic compound, a difference (d1?d2) between a volume average particle diameter (d1) of the lubricant particles and a volume average particle diameter (d2) of the fixing resin particles is 70 nm or more. The organic solvent includes an organic solvent having a boiling point of 190° C. to 280° C. In a total weight of the resin composition, a content of the lubricant particles is 0.1 wt % to 8.0 wt %, and a content of the organic solvent having a boiling point of 190° C. to 280° C. is 6.0 wt % to 10.0 wt %.

Abstract: Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), (b) a cyclic imide compound represented by the following formula (2), and (c) a curing catalyst.

Abstract: An anisotropic electro-conductive film having high reliability, which electrically connects circuit electrodes having a fine pattern. The anisotropic film contains an insulating resin and particle groups. The particle groups are groups of particles in which a plurality of particles are bound together with a binder. The particle groups are regularly arranged with an interval of 1 ?m to 1,000 ?m.

Abstract: Provided is a bismaleimide compound where the compound itself has a superior solubility in various solvents; a resin composition containing this compound has a superior flexibility; and a cured product of such composition has a low relative permittivity and dielectric tangent, a low thermal expansion coefficient, and a superior heat resistance due to a high glass-transition temperature. The bismaleimide compound is represented by the following formula (1): wherein A independently represents a cyclic structure-containing tetravalent organic group; B independently represents a dimer acid frame-derived divalent hydrocarbon group; Q independently represents an aromatic ring-containing divalent group that has a fluorene frame or indene frame; W is B or Q; n is 1 to 100; m is 1 to 100; no restrictions are imposed on an order of each repeating unit identified by n and m, and a bonding pattern thereof may be alternate, block or random.

Abstract: Provided is a curable resin composition for a bonding film that has a high adhesion force to a copper foil with a small surface roughness, maintains a high adhesion force even after HAST, and can also be turned into a cured product superior in dielectric properties. The curable resin composition for a bonding film that is to be bonded to a copper foil, contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule, that is represented by the following formula (1), (2) or (3) wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 60 carbon atoms and is a hydrocarbon group other than a dimer acid frame-derived hydrocarbon group, D represents a dimer acid frame-derived hydrocarbon group, m, l and n are each 1 to 100; and (B) a catalyst.

Abstract: Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing: (A) a maleimide compound represented by the following general formula (1) wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and (B) a catalyst, wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.

Abstract: Provided is a heat-curable maleimide resin composition exhibiting no turbidity and separation when in the form of a varnish, and yielding a cured product that not only has excellent dielectric properties but also has a strong adhesive force to organic resins such as LCP and MPI and copper. The composition contains: (A) a styrene-based elastomer having a reactive functional group at both ends; (B) a maleimide compound represented by the following formula (1) wherein R1 represents a dimer acid skeleton-derived divalent hydrocarbon group; (C) an epoxy resin having at least two epoxy groups per molecule; and (D) an anionic polymerization initiating catalyst, wherein a ratio between the components (A) and (B) (mass ratio (A)/(B)) is 2 to 20.

Abstract: Provided is a heat-curable maleimide resin composition capable of yielding a cured product having excellent dielectric properties even in the high-frequency region, a low water absorption rate, and a high glass-transition temperature. The heat-curable maleimide resin composition contains: (A) two or more kinds of maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a reaction initiator, wherein a cured product of the heat-curable maleimide resin composition has a dielectric tangent of not larger than 0.003 both at 10 GHz and 40 GHz.

Abstract: Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000, wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Abstract: Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains: (A) 100 parts by mass of a maleimide compound having at least two maleimide groups in one molecule, having a number average molecular weight of greater than 4,000, and having at least one divalent organic group selected from a dimer acid skeleton, a linear alkylene group having not less than 6 carbon atoms, and a linear alkenylene group having not less than 6 carbon atoms; (B) 0.1 to 15 parts by mass of an epoxy resin having at least two epoxy groups in one molecule; and (C) 0.1 to 5 parts by mass of a diaminotriazine ring-containing imidazole.

Abstract: Provided is a maleimide resin film highly filled with inorganic particles and having a superior adhesion force. The maleimide resin film contains: (a) a maleimide represented by the following formula (1): wherein A independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms and at least one aliphatic ring having not less than 5 carbon atoms, and may contain a hetero atom; Q independently represents an arylene group that has not less than 6 carbon atoms, and may contain a hetero atom; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a (meth)acrylate; (c) inorganic particles; and (d) a curing catalyst.

Abstract: Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), (b) a cyclic imide compound represented by the following formula (2), and (c) a curing catalyst.

Abstract: One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiation curable organosilicon resin composition comprising 100 parts by mass of (A) a (meth)acryloyloxy group-containing organosilane represented by the formula (1) which has a (meth)acryloyloxy group or a monovalent organic group having 4 to 25 carbon atoms and having one, two, or three of said (meth)acryloyloxy group, and 1 to 50 parts by mass of (B) a photopolymerization initiator.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Abstract: Provided is a maleimide resin composition capable of being turned into a cured product superior in physical strength and dielectric property, having a fluororesin powder uniformly dispersed therein, exhibiting a low thixotropic ratio, and being turned into the shape of a film via coating. The maleimide resin composition contains: (a) a maleimide represented by the following formula (1): wherein independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms; Q independently represents an arylene group that has not less than 6 carbon atoms; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a fluororesin powder; and (c) a curing catalyst.