Abstract: Provided is a curable resin composition for a bonding film that has a high adhesion force to a copper foil with a small surface roughness, maintains a high adhesion force even after HAST, and can also be turned into a cured product superior in dielectric properties. The curable resin composition for a bonding film that is to be bonded to a copper foil, contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule, that is represented by the following formula (1), (2) or (3) wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 60 carbon atoms and is a hydrocarbon group other than a dimer acid frame-derived hydrocarbon group, D represents a dimer acid frame-derived hydrocarbon group, m, l and n are each 1 to 100; and (B) a catalyst.

Abstract: Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing: (A) a maleimide compound represented by the following general formula (1) wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and (B) a catalyst, wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.

Abstract: Provided is a heat-curable maleimide resin composition exhibiting no turbidity and separation when in the form of a varnish, and yielding a cured product that not only has excellent dielectric properties but also has a strong adhesive force to organic resins such as LCP and MPI and copper. The composition contains: (A) a styrene-based elastomer having a reactive functional group at both ends; (B) a maleimide compound represented by the following formula (1) wherein R1 represents a dimer acid skeleton-derived divalent hydrocarbon group; (C) an epoxy resin having at least two epoxy groups per molecule; and (D) an anionic polymerization initiating catalyst, wherein a ratio between the components (A) and (B) (mass ratio (A)/(B)) is 2 to 20.

Abstract: Provided is a heat-curable maleimide resin composition capable of yielding a cured product having excellent dielectric properties even in the high-frequency region, a low water absorption rate, and a high glass-transition temperature. The heat-curable maleimide resin composition contains: (A) two or more kinds of maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a reaction initiator, wherein a cured product of the heat-curable maleimide resin composition has a dielectric tangent of not larger than 0.003 both at 10 GHz and 40 GHz.

Abstract: Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000, wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Abstract: Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains: (A) 100 parts by mass of a maleimide compound having at least two maleimide groups in one molecule, having a number average molecular weight of greater than 4,000, and having at least one divalent organic group selected from a dimer acid skeleton, a linear alkylene group having not less than 6 carbon atoms, and a linear alkenylene group having not less than 6 carbon atoms; (B) 0.1 to 15 parts by mass of an epoxy resin having at least two epoxy groups in one molecule; and (C) 0.1 to 5 parts by mass of a diaminotriazine ring-containing imidazole.

Abstract: Provided is a maleimide resin film highly filled with inorganic particles and having a superior adhesion force. The maleimide resin film contains: (a) a maleimide represented by the following formula (1): wherein A independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms and at least one aliphatic ring having not less than 5 carbon atoms, and may contain a hetero atom; Q independently represents an arylene group that has not less than 6 carbon atoms, and may contain a hetero atom; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a (meth)acrylate; (c) inorganic particles; and (d) a curing catalyst.

Abstract: Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), (b) a cyclic imide compound represented by the following formula (2), and (c) a curing catalyst.

Abstract: One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiation curable organosilicon resin composition comprising 100 parts by mass of (A) a (meth)acryloyloxy group-containing organosilane represented by the formula (1) which has a (meth)acryloyloxy group or a monovalent organic group having 4 to 25 carbon atoms and having one, two, or three of said (meth)acryloyloxy group, and 1 to 50 parts by mass of (B) a photopolymerization initiator.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Abstract: Provided is a maleimide resin composition capable of being turned into a cured product superior in physical strength and dielectric property, having a fluororesin powder uniformly dispersed therein, exhibiting a low thixotropic ratio, and being turned into the shape of a film via coating. The maleimide resin composition contains: (a) a maleimide represented by the following formula (1): wherein independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms; Q independently represents an arylene group that has not less than 6 carbon atoms; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a fluororesin powder; and (c) a curing catalyst.

Abstract: Provided is a maleimide resin film highly filled with inorganic particles and having a superior adhesion force. The maleimide resin film contains: (a) a maleimide represented by the following formula (1): wherein A independently represents a tetravalent organic group having a cyclic structure(s); B independently represents an alkylene group that has not less than 6 carbon atoms and at least one aliphatic ring having not less than 5 carbon atoms, and may contain a hetero atom; Q independently represents an arylene group that has not less than 6 carbon atoms, and may contain a hetero atom; W represents a group represented by B or Q; n represents a number of 0 to 100, m represents a number of 0 to 100, provided that at least one of n or m is a positive number; (b) a (meth)acrylate; (c) inorganic particles; and (d) a curing catalyst.

Abstract: Provided are a heat-curable resin composition capable of being turned into a cured product having a high glass-transition temperature, a low dielectric tangent and a superior adhesion to a metal foil; and an adhesive agent, film, prepreg, laminate, circuit board as well as printed-wiring board using such heat-curable resin composition. The heat-curable resin composition contains: (A) a polyphenylene ether resin having reactive double bonds at molecular chain ends; (B) a (meth)acrylic acid ester compound; (C) a cyclic imide compound containing, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (D) a reaction initiator.

Abstract: Provided are a novel aromatic bismaleimide compound capable of being turned into a film without using a film-forming agent, and dissolved even in a solvent other than a high-boiling aprotic polar solvent; a production method of such compound; and a heat-curable cyclic imide resin composition that contains such compound, and is capable of being cured at a low temperature and turned into a cured product superior in mechanical properties, heat resistance, relative permittivity, dielectric tangent, moisture resistance and adhesiveness. The aromatic bismaleimide compound is represented by the following formula (1): wherein X1 independently represents a divalent group, m represents a number of 1 to 30, n represents a number of 1 to 5, each of A1 and A2 independently represents a divalent aromatic group. The heat-curable cyclic imide resin composition contains the above compound as a component (A), a reaction initiator (B) and an organic solvent (C).

Abstract: An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.