Patents by Inventor Hiroyuki Ikuta
Hiroyuki Ikuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12129544Abstract: The cleaning method according to an embodiment of the present invention is for cleaning a plasma processing apparatus that performs a plasma processing on a substrate. This cleaning method includes: forming a protective film; and cleaning. The forming the protective film involves forming the protective film in a plasma generation region by generating plasma while supplying a film-forming gas into a processing container in which a processing space including the plasma generation region and a diffusion region is formed. The cleaning involves cleaning an interior of the processing container in which the protective film has been formed by generating plasma while supplying a cleaning gas into the processing container.Type: GrantFiled: March 29, 2021Date of Patent: October 29, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshiyuki Kondo, Yutaka Fujino, Hiroyuki Ikuta, Hideki Yuasa
-
Patent number: 12112921Abstract: This plasma processing method comprises: arranging a substrate in a region away from a microwave plasma generation region in a chamber; setting the pressure in the chamber to 1 Torr or higher; introducing microwaves from a microwave plasma source in the chamber, generating microwave plasma by introducing a processing gas containing a reducing gas, and diffusing active species from the microwave plasma in the microwave plasma generation region to the substrate side; and applying high-frequency power to the substrate to generate cathode-coupled plasma near the substrate and attract ions near the substrate to the substrate.Type: GrantFiled: July 17, 2019Date of Patent: October 8, 2024Assignee: Tokyo Electron LimitedInventors: Hiroyuki Ikuta, Hirokazu Ueda, Yutaka Fujino
-
Patent number: 12077865Abstract: A film forming method of forming a film on a substrate by using a film forming apparatus including a processing container, and a stage provided in an interior of the processing container to place the substrate thereon and in which aluminum is contained, includes: forming a film continuously on one substrate or on a plurality of substrates by supplying a gas for film formation to the interior of the processing container while heating the substrate placed on the stage; cleaning the interior of the processing container with a fluorine-containing gas in a state in which the substrate is unloaded from the processing container; and performing a post-process by generating plasma of an oxygen- and hydrogen-containing-gas in the interior of the processing container, wherein the forming the film, the cleaning the interior of the processing container, and the performing the post-process are repeatedly performed.Type: GrantFiled: August 19, 2022Date of Patent: September 3, 2024Assignee: Tokyo Electron LimitedInventors: Hideki Yuasa, Hiroyuki Ikuta, Yutaka Fujino, Makoto Wada, Hirokazu Ueda
-
Patent number: 12060641Abstract: A film forming method includes: placing a substrate on which a pattern, which includes a plurality of convex and concave portions, is formed on a stage disposed inside a chamber; and selectively forming a silicon-containing film on the plurality of convex portions of the pattern by applying a bias power to the stage and introducing microwaves into the chamber while supplying a processing gas containing a silicon-containing gas and a nitrogen-containing gas into the chamber to generate plasma, wherein the selectively forming the silicon-containing film includes a first film formation of forming a silicon-containing film around upper sides of the plurality of convex portions and a second film formation of forming a silicon-containing film on upper portions of the plurality of convex portions.Type: GrantFiled: January 18, 2022Date of Patent: August 13, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Hirokazu Ueda, Hideki Yuasa, Yutaka Fujino, Yoshiyuki Kondo, Hiroyuki Ikuta
-
Publication number: 20230220545Abstract: The cleaning method according to an embodiment of the present invention is for cleaning a plasma processing apparatus that performs a plasma processing on a substrate. This cleaning method includes: forming a protective film; and cleaning. The forming the protective film involves forming the protective film in a plasma generation region by generating plasma while supplying a film-forming gas into a processing container in which a processing space including the plasma generation region and a diffusion region is formed. The cleaning involves cleaning an interior of the processing container in which the protective film has been formed by generating plasma while supplying a cleaning gas into the processing container.Type: ApplicationFiled: March 29, 2021Publication date: July 13, 2023Inventors: Yoshiyuki KONDO, Yutaka FUJINO, Hiroyuki IKUTA, Hideki YUASA
-
Publication number: 20230191474Abstract: A core quality estimation system that estimates quality of a core to be formed by filling a mold with kneaded sand produced by kneading in a kneading tank and heating the kneaded sand includes a computer that executes operations of acquiring mold temperature information of the mold, acquiring environmental information regarding a surrounding environment in which the core is formed, and estimating the quality of the core based on the mold temperature information and the environmental information.Type: ApplicationFiled: October 6, 2022Publication date: June 22, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Motoki HAYASHI, Hiroyuki IKUTA, Naoya TAKAHASHI
-
Patent number: 11615957Abstract: A method of forming a boron-based film mainly containing boron on a substrate includes forming, on the substrate, an adhesion layer containing an element contained in a surface of the substrate and nitrogen, and subsequently, forming the boron-based film on the adhesion layer.Type: GrantFiled: February 26, 2019Date of Patent: March 28, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Hirokazu Ueda, Jinwang Li, Masahiro Oka, Yoshimasa Watanabe, Yuuki Yamamoto, Hiroyuki Ikuta
-
Publication number: 20230062105Abstract: A film forming method includes repeatedly performing: forming a film on one substrate or consecutively on a plurality of substrates by supplying a film formation gas into a processing container while heating the substrate on a stage; cleaning an interior of the processing container by a fluorine-containing gas by setting a temperature of the stage to a first temperature at which a vapor pressure of an aluminum fluoride becomes lower than a control pressure in the processing container in a state in which the substrate is unloaded from the processing container; and performing a precoating continuously to the cleaning the interior of the processing container such that a precoat film is formed on at least a surface of the stage by setting the temperature of the stage to a second temperature at which the vapor pressure of the aluminum fluoride becomes lower than the control pressure in the processing container.Type: ApplicationFiled: August 19, 2022Publication date: March 2, 2023Inventors: Makoto WADA, Yutaka FUJINO, Hiroyuki IKUTA, Hideki YUASA, Hirokazu UEDA
-
Publication number: 20230061151Abstract: A film forming method of forming a film on a substrate by using a film forming apparatus including a processing container, and a stage provided in an interior of the processing container to place the substrate thereon and in which aluminum is contained, includes: forming a film continuously on one substrate or on a plurality of substrates by supplying a gas for film formation to the interior of the processing container while heating the substrate placed on the stage; cleaning the interior of the processing container with a fluorine-containing gas in a state in which the substrate is unloaded from the processing container; and performing a post-process by generating plasma of an oxygen- and hydrogen-containing-gas in the interior of the processing container, wherein the forming the film, the cleaning the interior of the processing container, and the performing the post-process are repeatedly performed.Type: ApplicationFiled: August 19, 2022Publication date: March 2, 2023Inventors: Hideki YUASA, Hiroyuki IKUTA, Yutaka FUJINO, Makoto WADA, Hirokazu UEDA
-
Publication number: 20220235462Abstract: A film forming method includes: placing a substrate on which a pattern, which includes a plurality of convex and concave portions, is formed on a stage disposed inside a chamber; and selectively forming a silicon-containing film on the plurality of convex portions of the pattern by applying a bias power to the stage and introducing microwaves into the chamber while supplying a processing gas containing a silicon-containing gas and a nitrogen-containing gas into the chamber to generate plasma, wherein the selectively forming the silicon-containing film includes a first film formation of forming a silicon-containing film around upper sides of the plurality of convex portions and a second film formation of forming a silicon-containing film on upper portions of the plurality of convex portions.Type: ApplicationFiled: January 18, 2022Publication date: July 28, 2022Inventors: Hirokazu UEDA, Hideki YUASA, Yutaka FUJINO, Yoshiyuki KONDO, Hiroyuki IKUTA
-
Publication number: 20220223378Abstract: This plasma processing method comprises: arranging a substrate in a region away from a microwave plasma generation region in a chamber; setting the pressure in the chamber to 1 Torr or higher; introducing microwaves from a microwave plasma source in the chamber, generating microwave plasma by introducing a processing gas containing a reducing gas, and diffusing active species from the microwave plasma in the microwave plasma generation region to the substrate side; and applying high-frequency power to the substrate to generate cathode-coupled plasma near the substrate and attract ions near the substrate to the substrate.Type: ApplicationFiled: July 17, 2019Publication date: July 14, 2022Inventors: Hiroyuki IKUTA, Hirokazu UEDA, Yutaka FUJINO
-
Publication number: 20220037124Abstract: A plasma processing apparatus for generating plasma from a processing gas using microwaves and performing plasma processing on a substrate is provided. The apparatus includes a processing chamber having a substrate support on which the substrate is placed; a plurality of microwave radiation units arranged at a central portion and an outer peripheral portion of a ceiling wall of the processing chamber and configured to radiate microwaves; and a controller configured to complete microwave radiation from the microwave radiation unit in the central portion upon completion of plasma processing of the substrate and then complete microwave radiation from the microwave radiation units in the outer peripheral portion.Type: ApplicationFiled: July 29, 2021Publication date: February 3, 2022Inventors: Satoshi ITOH, Hiroyuki IKUTA, Yoshiyuki KONDO, Hideki YUASA, Soudai EMORI
-
Patent number: 11229890Abstract: A size of an agitating mechanism can be reduced. An agitating mechanism according to an aspect of the present disclosure is an agitating mechanism for agitating fluid flowing through inside a pipe, including: a rotary body placed inside the pipe so as to be able to rotate in a circumferential direction of an inner circumferential surface of the pipe; and a regulation part configured to regulate a movement of the rotary body in a longitudinal direction of the pipe. The rotary body includes a hollow part penetrating the pipe in the longitudinal direction of the pipe and an agitating blade provided in the hollow part.Type: GrantFiled: November 9, 2018Date of Patent: January 25, 2022Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yu Takanezawa, Hiroyuki Ikuta
-
Patent number: 11203060Abstract: A casting method includes loading molten metal into a cavity from a sleeve, and sending a gas into the cavity from the outside of the cavity, except the sleeve, to pressurize a gas in the cavity and to increase the pressure value of the gas in the cavity to the atmospheric pressure or higher.Type: GrantFiled: September 17, 2020Date of Patent: December 21, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroyuki Ikuta, Yoshikazu Abe
-
Patent number: 11159066Abstract: A rotor of rotary electric machines includes a rotor core which include first and second core blocks. The first core block is formed by stacking the steel plates in a state where the steel plates are engaged by a first crimping portion and skewed in a first direction in a circumferential direction. The second core block is formed by stacking the steel plates in a state where the steel plates are engaged by a second crimping portion and skewed in a second direction facing the first direction. The first and second core blocks are connected in an axial direction in the rotor core. A hole for inserting the first crimping portion is provided in an intermediate steel plate which is part of the annular steel plates. This intermediate steel plate is provided at a block boundary position of the second core bock and is connected to the first core block.Type: GrantFiled: June 20, 2019Date of Patent: October 26, 2021Assignee: DENSO CORPORATIONInventor: Hiroyuki Ikuta
-
Publication number: 20210187601Abstract: A casting method includes loading molten metal into a cavity from a sleeve, and sending a gas into the cavity from the outside of the cavity, except the sleeve, to pressurize a gas in the cavity and to increase the pressure value of the gas in the cavity to the atmospheric pressure or higher.Type: ApplicationFiled: September 17, 2020Publication date: June 24, 2021Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroyuki IKUTA, Yoshikazu ABE
-
Publication number: 20210090888Abstract: A method of forming a boron-based film mainly containing boron on a substrate includes forming, on the substrate, an adhesion layer containing an element contained in a surface of the substrate and nitrogen, and subsequently, forming the boron-based film on the adhesion layer.Type: ApplicationFiled: February 26, 2019Publication date: March 25, 2021Inventors: Hirokazu UEDA, Jinwang LI, Masahiro OKA, Yoshimasa WATANABE, Yuuki YAMAMOTO, Hiroyuki IKUTA
-
Patent number: 10894523Abstract: A crash box capable of easily deforming into a bellows shape and absorbing impact energy more reliably, and its manufacturing method are provided. The present disclosure is applied to a crash box which is partly deformed in an axial direction to absorb impact energy when the crash box receives an impact in the axial direction. A first layer made of metal and a second layer made of metal containing a larger volume of bubbles than that of the first layer are alternately formed in the axial direction in the crash box according to the present disclosure.Type: GrantFiled: October 2, 2018Date of Patent: January 19, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroyuki Ikuta, Yu Takanezawa, Rikuto Takagi, Mitsutaka Yoshida
-
Publication number: 20200224289Abstract: A method for predicting a martensitic transformation rate and a method for setting processing conditions capable of improving the accuracy of a prediction of a martensitic transformation rate when a steel material is subjected to deformation processing as well as to heat treatment are provided. A method for predicting a martensitic transformation rate according to an embodiment includes predicting a rate of a transformation to a martensitic phase that appears when a steel material is subjected to deformation processing as well as to heat treatment in which a temperature of the steel material is changed, in which a martensitic transformation rate Vm is calculated by using a prediction formula, the method further including identifying parameters m and n of the prediction formula, and calculating the martensitic transformation rate at a predetermined temperature and a predetermined strain rate by using the prediction formula into which the identified parameters are substituted.Type: ApplicationFiled: December 31, 2019Publication date: July 16, 2020Applicants: The University of Tokyo, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Jun YANAGIMOTO, Kenshiro MIMURA, Dai KOBUCHI, Hiroyuki IKUTA, Takahiro ISHIGURO
-
Patent number: 10533515Abstract: An intake-port core includes a body part having the same outer shape as that of the intake port, a port-injector part having the same outer shape as that of a port-injector insertion part, and an extending part. A cooling-water flow-passage core includes a water-jacket core having the same outer shape as that of a water jacket. The intake-port core is inserted from the extending part thereof into the water-jacket core so as to join the cooling-water flow-passage core to the intake-port core. Thereafter, a core print part that is a separate body from the intake-port core is joined to the intake-port core.Type: GrantFiled: February 21, 2017Date of Patent: January 14, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yusei Kusaka, Kazuya Mikashima, Hiroyuki Ikuta