Abstract: The electric vehicle according to the present disclosure calculates motor torque using an MT vehicle model simulating an MT vehicle having a manual transmission and an internal combustion engine. In the first operation mode, an operation amount of a pseudo-clutch pedal and a shift position of a pseudo-gearshift are input to the MT vehicle model to reflect operation of the pseudo-clutch pedal and operation of the pseudo-gearshift in electric motor control. In the second operation mode where the operation of the pseudo-clutch pedal is not needed, an operation amount of a clutch pedal calculated by a driver model is input to the MT vehicle model instead of the operation amount of the pseudo-clutch pedal.

Abstract: An electric vehicle is configured to be able to perform running by an MT mode that controls an electric motor with a torque characteristic like an MT vehicle having a manual transmission and an internal combustion engine, and running by an EV mode that controls the electric motor with a normal torque characteristic. The electric vehicle includes a mode changeover switch for switching to the running by the MT mode.

Abstract: A distance information acquisition unit acquires distance information representing a distance between a terminal device and an image processing device, based on a radio wave arriving from the terminal device. A direction information acquisition unit acquires direction information representing a direction of the terminal device in relation to the image processing device, based on the radio wave arriving from the terminal device. A controller performs processing to perform image processing, based on the distance information and the direction information. The controller performs processing to perform image processing, when a position of the terminal device is within a predetermined range in relation to the image processing device and a rate of change in at least one of the distance from the terminal device and the direction of the terminal device is equal to or lower than a threshold.

Abstract: An image processing device is communicatively connected to a terminal device. An operation panel accepts an operation from a user. A communication unit has a plurality of antennas and is used to communicate with the terminal device. A controller performs control according to direction information representing a direction of the terminal device in relation to the image processing device, acquired based on a radio wave transmitted between the terminal device and the communication unit. The communication unit is provided within a range corresponding to the operation panel, in a left-right direction as viewed from a front face side where the operation panel can be operated, of side faces of the image processing device.

Abstract: A tape carrier substrate includes: a tape carrier base 1; a first terminal section 2A including a plurality of first terminals 2a arranged with one another in a first direction W; a second terminal section 2B including a plurality of second terminals 2b; and first and second conductive wires 3a and 3b. A plurality of slits 7 arranged with one another in the first direction are provided in the tape carrier base. An interval between one of the plurality of slits placed at one end in the first direction and a corresponding end of the tape carrier base in the first direction and an interval between another one of the plurality of slits placed at the other end in the first direction and a corresponding end of the tape carrier base in the first direction are greater than an interval between adjacent ones of the plurality of slits.

Abstract: In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

Abstract: A light-emitting device (1) includes a base (10), a light reflecting member (11) placed on the base (10), a case (12) surrounding the light reflecting member (11), and a plurality of light-emitting elements (13) arranged on the inner surface of the case (12). The light reflecting member (11) reflects light emitted from an emission source including the light-emitting elements (13) toward an opening (12a) of the case (12). In the light-emitting device (1), since a plurality of light-emitting elements (13) can be arranged three-dimensionally, the size of the light-emitting device can be reduced easily. Moreover, the light reflecting member (11) reflects light emitted from the emission source including the light-emitting elements (13) toward the opening (12a) of the case (12), so that the light-emitting device can have high brightness.

Abstract: An objective is to provide an automatic cleaning device for machine tool in which cleaning efficiency is improved by performing cleaning for a large range during machining. To achieve this, an air nozzle (21) that removes, by air-blowing, chips (Wa) and cutting oil (C) dispersed while a workpiece is being machined to an outside of the machine is allowed to move not only independently from a movement of a spindle head (16), but also relatively to a workpiece (W) in directions of three orthogonal axes.

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract: The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.

Abstract: A scroll fluid machine comprises compression chambers defined with an orbiting scroll orbiting relative to a fixed scroll, and a back pressure chamber provided on the face opposite from a wrap of the orbiting scroll. A back pressure port is provided, which is formed in an end-plate of the orbiting scroll and connects from a compression chamber side opening opened to a compression chamber side and to a back pressure chamber side opening opened to a back pressure chamber side. The compression chamber side opening is opened and closed by an end-plate of the fixed scroll according as the orbiting motion of the orbiting scroll to perform connection and blockage of the back pressure port. The flow resistance of fluid flowing in and out between the back pressure chamber and the compression chamber is reduced and the compression efficiency and reliability are improved.

Abstract: In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

Abstract: A wiring board according to the present invention includes: an insulating base 22; a plurality of first conductor wirings 23a aligned in an inner region on the insulating base; bumps 24 formed on the respective first conductor wirings; and a protective film 25a that is formed on the insulating base so as to cover the first conductor wirings and has an opening region through which the bumps are exposed. The height of at least part of a surface of the protective film from a surface of the insulating base is greater than the height of the bumps from the surface of the insulating base. With this configuration, it is possible to decrease the thickness in the state where a protective tape is placed on the wiring board to protect bumps, thereby increasing the length of the wiring board that can be held by a reel for supplying the wiring board.

Abstract: A flexible insulating base, a plurality of conductor wirings aligned on the flexible insulating base, and bump electrodes provided respectively in end portions of the plurality of conductor wirings in a region where a semiconductor chip is to be placed are provided. The semiconductor chip is mounted on the conductor wirings by bonding electrode pads formed on the semiconductor chip to the bump electrodes. An auxiliary conductor wiring formed similarly to the conductor wirings is provided on the insulating base, and an auxiliary bump electrode formed similarly to the bump electrodes is provided on the auxiliary conductor wiring, so that the electrode pads formed on the semiconductor chip can be registered with respect to the bump electrodes on the conductor wirings by positioning the semiconductor chip with reference to the auxiliary bump electrode.

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings.

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings.

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

Abstract: A semiconductor device in accordance with the present invention is a mounted body of a semiconductor chip with a plurality of electrode pads arranged in a plurality of stages and a tape wiring board, the average pitch of the electrode pads on the entire semiconductor chip can be reduced, while ensuring stable connectivity, by leading together to the outside of the semiconductor chip two or more wirings of the tape wiring board connected to the electrode pads on the inner side between the electrode pads arranged in a row on the outer periphery of the semiconductor chip.