Patents by Inventor Hiroyuki INAGI

Hiroyuki INAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 9620442
    Abstract: A semiconductor device includes a package part having a semiconductor element sealed in resin, a plurality of first leads each having an outer portion extending from a first side of the package part, and a plurality of second leads each having an outer portion extending from a second side of the package part. A combined bottom surface area of the outer portions of the plurality of first leads is greater than a combined bottom surface area of the outer portions of the plurality of second leads. The semiconductor device also includes a heat dissipation plate provided on the bottom surface of the package part and connected to at least one of the plurality of second leads.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: April 11, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Eiji Shimada, Gentaro Ookura, Hiroyuki Inagi
  • SEMICONDUCTOR DEVICE
    Publication number: 20170040245
    Abstract: A semiconductor device includes a package part having a semiconductor element sealed in resin, a plurality of first leads each having an outer portion extending from a first side of the package part, and a plurality of second leads each having an outer portion extending from a second side of the package part. A combined bottom surface area of the outer portions of the plurality of first leads is greater than a combined bottom surface area of the outer portions of the plurality of second leads. The semiconductor device also includes a heat dissipation plate provided on the bottom surface of the package part and connected to at least one of the plurality of second leads.
    Type: Application
    Filed: October 19, 2016
    Publication date: February 9, 2017
    Inventors: Eiji SHIMADA, Gentaro OOKURA, Hiroyuki INAGI
  • Semiconductor device
    Patent number: 9515013
    Abstract: A semiconductor device includes a package part having a semiconductor element sealed in resin, a plurality of first leads each having an outer portion extending from a first side of the package part, and a plurality of second leads each having an outer portion extending from a second side of the package part. A combined bottom surface area of the outer portions of the plurality of first leads is greater than a combined bottom surface area of the outer portions of the plurality of second leads. The semiconductor device also includes a heat dissipation plate provided on the bottom surface of the package part and connected to at least one of the plurality of second leads.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: December 6, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Eiji Shimada, Gentaro Ookura, Hiroyuki Inagi
  • SEMICONDUCTOR DEVICE
    Publication number: 20160079147
    Abstract: A semiconductor device includes a package part having a semiconductor element sealed in resin, a plurality of first leads each having an outer portion extending from a first side of the package part, and a plurality of second leads each having an outer portion extending from a second side of the package part. A combined bottom surface area of the outer portions of the plurality of first leads is greater than a combined bottom surface area of the outer portions of the plurality of second leads. The semiconductor device also includes a heat dissipation plate provided on the bottom surface of the package part and connected to at least one of the plurality of second leads.
    Type: Application
    Filed: March 2, 2015
    Publication date: March 17, 2016
    Inventors: Eiji SHIMADA, Gentaro OOKURA, Hiroyuki INAGI