Patents by Inventor Hiroyuki Iwami

Hiroyuki Iwami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150075701
    Abstract: A process for producing a heat-insulating cavity mold, characterized by producing two members, i.e., a metallic surface layer member (1) for forming a metallic surface layer (5) of a cavity mold in a mold for thermoplastic resin molding and a cavity mold main body member (9) for forming the cavity mold, forming a heat-insulating layer (10?) on a bonding surface of the member (9), bonding the two members to each other, and subsequently eliminating an unnecessary part (3, 12) of the metallic surface layer member to form the metallic surface layer (5); a heat-insulating cavity mold; and a mold for thermoplastic resin molding which employs the cavity mold.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 19, 2015
    Inventor: Hiroyuki Iwami
  • Patent number: 8865042
    Abstract: A process for producing a heat-insulating cavity mold, characterized by producing two members, i.e., a metallic surface layer member (1) for forming a metallic surface layer (5) of a cavity mold in a mold for thermoplastic resin molding and a cavity mold main body member (9) for forming the cavity mold, forming a heat-insulating layer (10?) on a bonding surface of the member (9), bonding the two members to each other, and subsequently eliminating an unnecessary part (3, 12) of the metallic surface layer member to form the metallic surface layer (5); a heat-insulating cavity mold; and a mold for thermoplastic resin molding which employs the cavity mold.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: October 21, 2014
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventor: Hiroyuki Iwami
  • Publication number: 20100183761
    Abstract: A process for producing a heat-insulating cavity mold, characterized by producing two members, i.e., a metallic surface layer member (1) for forming a metallic surface layer (5) of a cavity mold in a mold for thermoplastic resin molding and a cavity mold main body member (9) for forming the cavity mold, forming a heat-insulating layer (10?) on a bonding surface of the member (9), bonding the two members to each other, and subsequently eliminating an unnecessary part (3, 12) of the metallic surface layer member to form the metallic surface layer (5); a heat-insulating cavity mold; and a mold for thermoplastic resin molding which employs the cavity mold.
    Type: Application
    Filed: May 2, 2007
    Publication date: July 22, 2010
    Inventor: Hiroyuki Iwami
  • Publication number: 20030031836
    Abstract: An adhesive tape comprising a substrate and an adhesive agent layer formed on one surface of the substrate; wherein a shape of non-adhesive section having an edge in a width direction of the adhesive tape as a part of an outer periphery of the shape of non-adhesive section is formed consecutively in a length direction of the adhesive tape, in at least one edge region in the width direction of the adhesive tape on a surface thereof on which the adhesive agent layer is formed, and an area fraction of the non-adhesive sections on the surface on which the adhesive agent layer is formed is in the range of from 1 to 40%, is good in adhesive characteristic and peelability; and further, good in loading stability on the adherent to which it is adhered.
    Type: Application
    Filed: August 6, 2002
    Publication date: February 13, 2003
    Inventors: Hiroyuki Iwami, Yukio Suzuki, Hirotaka Satou, Yoshiki Hashimoto
  • Patent number: 5468141
    Abstract: A mold for injection molding of a thermoplastic resin. The mold comprises a cavity block, a core block, and a cavity formed between the cavity block and the core block and adapted to be filled with a molten resin. The cavity block includes an insulating layer on a cavity side thereof, the insulating layer being made of a material selected from the group consisting of ceramic materials, porcelain enamel, glass materials, heat resistant plastic materials and their composites. The core block includes a release insulating layer on a cavity side thereof, the release insulating layer being made of a material selected from the group consisting of fluorocarbon resins, fluorocarbon resin composite materials, silicone resin composite materials and metal platings with fluorocarbon resin dispersion, the release insulating layer further being adapted to effect both mold releasing and heat insulation.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: November 21, 1995
    Assignee: Taiyo Manufacturing Works Co., Ltd.
    Inventors: Hiroyuki Iwami, Masayoshi Fukuoka, Hiroyuki Kanayama
  • Patent number: 5159671
    Abstract: A data transfer unit for a small computer system which has a host computer and main and auxiliary storage units, transfers data between the host computer, and the main and auxiliary storage units. The data transfer unit transfers the data, which is outputted from the host computer, from the data buffer to both the main and auxiliary storage units simultaneously, in an operation mode in which data is transferred from the host computer to the storage units. When an error occurs in the main or the auxiliary storage unit, the data transfer unit transfers the correct data from the other storage unit which is operating normally, to a substitute address in the storage unit in which the error has occured.
    Type: Grant
    Filed: September 19, 1988
    Date of Patent: October 27, 1992
    Assignee: Midori Electronics Co., Ltd.
    Inventor: Hiroyuki Iwami
  • Patent number: 4285901
    Abstract: An element having a molding surface defining the cavity of a mold for molding thermoplastic resin and a method of making the element. To regulate the cooling speed of the molten resin to be injected or placed into the cavity, the molding surface is provided by a thin metal layer and a layer of heat insulating material is formed on the inner side of the metal layer.
    Type: Grant
    Filed: June 27, 1979
    Date of Patent: August 25, 1981
    Inventors: Akira Yotsutsuji, Seiichi Ueda, Hiroyuki Iwami
  • Patent number: 4225109
    Abstract: An insulated metal mold having a molding surface defining the cavity of a mold for molding thermoplastic resin. To regulate the cooling speed of the molten resin to be injected or placed into the cavity, the molding surface is provided by a thin metal layer and a layer of heat insulating material is formed on the inner side of the metal layer.
    Type: Grant
    Filed: July 6, 1978
    Date of Patent: September 30, 1980
    Assignee: Osaka City & Taiyo Manufacturing Works Co., Ltd.
    Inventors: Akira Yotsutsuji, Seiichi Ueda, Hiroyuki Iwami