Abstract: A radio-frequency module includes a module substrate having first and second major surfaces, a transmit filter disposed at the module substrate, a duplexer that is disposed at the module substrate and that includes a transmit filter and a receive filter, an antenna switch to selectively couple the transmit filter or the duplexer, and a switch to selectively couple the transmit filter or the transmit filter. The transmit filter has a pass band that includes an uplink operating band of a first band for frequency division duplex. The transmit filter has a pass band that includes the uplink operating band of the first band. The receive filter has a pass band that includes a downlink operating band of the first band. The transmit filter and the receive filter are stacked together and positioned beside the first major surface.

Abstract: A radio frequency module that includes a first antenna terminal, a second antenna terminal, a TDD filter, a transmission filter, a filter, and a first switch. The first switch has a first common terminal, a second common terminal, a first terminal, a second terminal, and a third terminal. The filter is connected to the first terminal, the TDD filter is connected to the second terminal, and the transmission filter is connected to the third terminal. The first switch is capable of switching between a first connection state and a second connection state. The first connection state connects the first common terminal to the first terminal and the first common terminal to the second terminal simultaneously. The second connection state connects the first common terminal to the first terminal, the first common terminal to the second terminal, and the second common terminal to the third terminal simultaneously.

Abstract: A high frequency module includes a mounting board, a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed on a main surface of either the first main surface or the second main surface of the mounting board. The electronic component is disposed on the main surface of the mounting board on which the power amplifier is disposed. The resin layer is disposed at least between the power amplifier and the electronic component in a plan view from a thickness direction of the mounting board. A groove portion is formed in the resin layer. The groove portion includes a bottom portion positioned between a third main surface of the power amplifier and the main surface of the mounting board when the mounting board is viewed from a direction orthogonal to the thickness direction of the mounting board.

Abstract: In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.

Abstract: In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.

Abstract: Assuming transmission signals in different frequency bands are simultaneously transmitted, the isolation lowering is suppressed. A radio frequency module includes a first power amplifier, a second power amplifier, a first switch, a second switch, a third switch, and a mounting substrate. The first switch, the second switch, and the third switch are configured to be capable of simultaneously connecting the first power amplifier and the second power amplifier to an antenna terminal. The first switch is disposed between the second switch and the third switch in plan view of the mounting substrate from a thickness direction. The second switch and the third switch are disposed on the same main surface out of the first main surface and the second main surface of the mounting substrate.

Abstract: A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.

Abstract: The total sum of wiring lengths between reception filters and low-noise amplifiers is reduced. A high frequency module includes a mounting board, a plurality of inductors, a plurality of reception filters, and an IC component. The plurality of inductors are mounted on a first main surface of the mounting board. The plurality of reception filters are mounted on the first main surface of the mounting board. The IC component is mounted on a second main surface of the mounting board and includes a low-noise amplifier. A rectangular region in which the plurality of inductors are positioned overlaps with the IC component when viewed in plan from a thickness direction of the mounting board. An electronic component that is closest to each of three or more sides out of four sides of the rectangular region is at least one of the plurality of reception filters.

Abstract: In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.

Abstract: In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.

Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

Abstract: A radio-frequency module includes a module substrate. The module substrate includes a first principal surface; a second principal surface on a side of the module substrate that is opposite to the first principal surface; a third principal surface that is recessed toward the first principal surface from the second principal surface in a plan view of the second principal surface; a recessed region in which the third principal surface is a bottom surface; and a protruding region located on an outer periphery of the recessed region, in a plan view of the second principal surface, wherein the protruding region has a via conductor disposed therein, the via conductor extending in a direction perpendicular to the second principal surface and having an end exposed on the second principal surface.

Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).

Abstract: A front-end circuit includes a power amplifier circuit configured to amplify power of multiple transmission waves having different frequency bands, a transmission filter provided between the power amplifier circuit and an antenna and configured to pass a predetermined transmission frequency band of an output signal of the power amplifier circuit, a switch provided between the power amplifier circuit and the antenna, and a matching circuit. In accordance with switching of whether the matching circuit is connected, an insertion loss in a frequency band of an intermodulation distortion within a communication band in an intra-band carrier aggregation mode is increased as compared to an insertion loss in a frequency band of an intermodulation distortion within the communication band in a single mode.

Abstract: A radio-frequency module includes a module substrate. The module substrate includes a first principal surface; a second principal surface on a side of the module substrate that is opposite to the first principal surface; a third principal surface that is recessed toward the first principal surface from the second principal surface in a plan view of the second principal surface; a recessed region in which the third principal surface is a bottom surface; and a protruding region located on an outer periphery of the recessed region, in a plan view of the second principal surface, wherein the protruding region has a via conductor disposed therein, the via conductor extending in a direction perpendicular to the second principal surface and having an end exposed on the second principal surface.

Abstract: In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.

Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).

Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

Abstract: A sensor unit including an object detection sensor and an inclination sensor is mounted to a vehicle, and axial misalignment of the object detection sensor is determined as follows. A first inclination angle acquiring step of disposing the sensor unit, so that a first predetermined direction is aligned with a second predetermined direction before the sensor unit is mounted to the vehicle, and acquiring a first inclination angle detected by the inclination sensor from the inclination sensor, is performed. Then, a second inclination angle acquiring step of mounting the sensor unit on the vehicle and acquiring a second inclination angle detected by the inclination sensor from the inclination sensor, is performed. Finally, an axial misalignment determining step of determining whether axial misalignment has occurred at the object detection sensor, based on the first inclination angle and the second inclination angle, is performed.

Abstract: A front-end circuit includes a power amplifier circuit configured to amplify power of multiple transmission waves having different frequency bands, a transmission filter provided between the power amplifier circuit and an antenna and configured to pass a predetermined transmission frequency band of an output signal of the power amplifier circuit, a switch provided between the power amplifier circuit and the antenna, and a matching circuit. In accordance with switching of whether the matching circuit is connected, an insertion loss in a frequency band of an intermodulation distortion within a communication band in an intra-band carrier aggregation mode is increased as compared to an insertion loss in a frequency band of an intermodulation distortion within the communication band in a single mode.