Patents by Inventor Hiroyuki Katou

Hiroyuki Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083591
    Abstract: Provided are an aircraft lightning probable area detection device, an aircraft lightning probable area transmission system, an aircraft lightning probable area detection method, and an aircraft lightning probable area detection program that suppress the data capacity and create an aircraft lightning probable area that enables intuitive understanding of aircraft lightning probable. An aircraft lightning probable area detection device includes: an information acquisition unit configured to acquire aircraft lightning probable information indicating a level of an expected lightning strike probability on a map; a data creation unit configured to create text data of an aircraft lightning probable area information on which the level of the expected lightning strike probability and a location are associated with each other by using the aircraft lightning probable information; and a transmission unit configured to transmit the text data to an aircraft.
    Type: Application
    Filed: March 29, 2023
    Publication date: March 14, 2024
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takashi Ikematsu, Hiroyuki Katou, Masato Ikehata, Hiroyuki Nishijima, Fumiya Homma
  • Publication number: 20100187149
    Abstract: A packaging device has a packaging box (12) formed by using a corrugated cardboard sheet and also has a first cushioning member (14) and a second cushioning member (16) that hold an object (W) in the packaging box (12). Each of the set of the cushioning members (14, 16) is formed by bending a corrugated cardboard sheet and has a holding surface section (40; 50) used to hold the object (W) and also has support surface sections (42a, 42b; 52a, 52b) continuing, at a first pair of opposite sides of the holding surface section (40; 50). The support surface sections (42a, 42b; 52a, 52b) are in surface contact with side faces (22, 24) of the packaging box (12) and tip ends of the support surface sections (42a, 42b; 52a, 52b) are in contact with a bottom face (20) of the packaging box (12).
    Type: Application
    Filed: June 10, 2008
    Publication date: July 29, 2010
    Inventors: Katsumi Tsukii, Mitsue Uchida, Hiroyuki Katou
  • Patent number: 7009470
    Abstract: Disclosed is a waveguide-type dielectric filter, which comprises a dielectric block, a plurality of resonators formed in the dielectric block, and a coupling portion for adjusting the coupling between the adjacent resonators. The dielectric block includes a pair of dielectric substrates which are divided in the arranging direction of the resonators and joined together through joint surfaces thereof, and a slot formed between the joint surfaces. The slot defines a through-hole severing as the coupling portion between the adjacent resonators. The slot may be formed in each of the joint surfaces or may be formed in only one of the joint surfaces. The above dielectric filter may include input and output sections, and a conductive film may be formed between the joint surfaces to provide a coupling portion of the input or output section. The present invention can provide a waveguide-type dielectric filter capable of being readily produced without causing any problem of mechanical strength.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: March 7, 2006
    Assignee: Toko, Inc.
    Inventors: Yukikazu Yatabe, Hiroshi Kojima, Hiroyuki Katou
  • Publication number: 20040140871
    Abstract: Disclosed is a waveguide-type dielectric filter, which comprises a dielectric block, a plurality of resonators formed in the dielectric block, and a coupling portion for adjusting the coupling between the adjacent resonators. The dielectric block includes a pair of dielectric substrates which are divided in the arranging direction of the resonators and joined together through joint surfaces thereof, and a slot formed between the joint surfaces. The slot defines a through-hole severing as the coupling portion between the adjacent resonators. The slot may be formed in each of the joint surfaces or may be formed in only one of the joint surfaces. The above dielectric filter may include input and output sections, and a conductive film may be formed between the joint surfaces to provide a coupling portion of the input or output section. The present invention can provide a waveguide-type dielectric filter capable of being readily produced without causing any problem of mechanical strength.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 22, 2004
    Applicant: Toko, Inc.
    Inventors: Yukikazu Yatabe, Hiroshi Kojima, Hiroyuki Katou
  • Patent number: 6707133
    Abstract: On a wafer, patterns of arrayed waveguide gratings are formed. Each arrayed waveguide grating has an arcuate shape obtained by arranging two curved-line portions convexed in the same direction at a predetermined spacing and connecting respective end portions thereof with two mutually parallel straight lines. These arrayed waveguide gratings are cut out along straight cutting paths and curved cutting paths in which two arcuate portions of the same shape are arranged side by side in a lateral direction. Thus, a larger number of chips can be produced as compared with a case where each array waveguide grating is cut out in a rectangular shape. Ultrasonic machining techniques or sandblast machining techniques are suitable for the cutting operation.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: March 16, 2004
    Assignee: NEC Corporation
    Inventors: Shinya Watanabe, Hiroyuki Katou
  • Publication number: 20040036147
    Abstract: On a wafer, patterns of arrayed waveguide gratings are formed. Each arrayed waveguide grating has an arcuate shape obtained by arranging two curved-line portions convexed in the same direction at a predetermined spacing and connecting respective end portions thereof with two mutually parallel straight lines. These arrayed waveguide gratings are cut out along straight cutting paths and curved cutting paths in which two arcuate portions of the same shape are arranged side by side in a lateral direction. Thus, a larger number of chips can be produced as compared with a case where each array waveguide grating is cut out in a rectangular shape. Ultrasonic machining techniques or sandblast machining techniques are suitable for the cutting operation.
    Type: Application
    Filed: August 27, 2003
    Publication date: February 26, 2004
    Applicant: NEC CORPORATION
    Inventors: Shinya Watanabe, Hiroyuki Katou
  • Publication number: 20020113242
    Abstract: On a wafer, patterns of arrayed waveguide gratings are formed. Each arrayed waveguide grating has an arcuate shape obtained by arranging two curved-line portions convexed in the same direction at a predetermined spacing and connecting respective end portions thereof with two mutually parallel straight lines. These arrayed waveguide gratings are cut out along straight cutting paths and curved cutting paths in which two arcuate portions of the same shape are arranged side by side in a lateral direction. Thus, a larger number of chips can be produced as compared with a case where each array waveguide grating is cut out in a rectangular shape. Ultrasonic machining techniques or sandblast machining techniques are suitable for the cutting operation.
    Type: Application
    Filed: February 7, 2002
    Publication date: August 22, 2002
    Applicant: NEC CORPORATION
    Inventors: Shinya Watanabe, Hiroyuki Katou