Patents by Inventor Hiroyuki Kitasako

Hiroyuki Kitasako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-molded semiconductor
    Patent number: 4903114
    Abstract: A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.
    Type: Grant
    Filed: June 15, 1988
    Date of Patent: February 20, 1990
    Assignee: Fujitsu Limited
    Inventors: Tsuyoshi Aoki, Michio Ono, Kazuhiro Maeda, Hiroyuki Kitasako