Abstract: In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

Abstract: A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.

Abstract: A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

Abstract: A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

Abstract: A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

Abstract: In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

Abstract: A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.

Abstract: A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.

Abstract: A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.

Abstract: In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.