Patents by Inventor Hiroyuki Kon

Hiroyuki Kon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9166305
    Abstract: Good signal transmission characteristics can be stably obtained by a simple structure. A pressure-contact surface of a cover inner surface of a shell cover part 13b, which is openably/closably coupled to a cylindrical opening of an external conductor shell 13a, and an insulative pressing plate 11d is provided with a void part 14, which separates at least one of them from the other one. By virtue of this, it is configured that the characteristic impedance about the cable-shaped signal transmission medium SC can be adjusted by the void part 14, and the matching degree (VSWR) of the characteristic impedance with respect to transmission signals can be easily and appropriately matched.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: October 20, 2015
    Assignee: DAI-ICHI SEIKO CO., LTD.
    Inventors: Yoichi Hashimoto, Hiroyuki Kon
  • Publication number: 20150044912
    Abstract: Good signal transmission characteristics can be stably obtained by a simple structure. A pressure-contact surface of a cover inner surface of a shell cover part 13b, which is openably/closably coupled to a cylindrical opening of an external conductor shell 13a, and an insulative pressing plate 11d is provided with a void part 14, which separates at least one of them from the other one. By virtue of this, it is configured that the characteristic impedance about the cable-shaped signal transmission medium SC can be adjusted by the void part 14, and the matching degree (VSWR) of the characteristic impedance with respect to transmission signals can be easily and appropriately matched.
    Type: Application
    Filed: August 6, 2014
    Publication date: February 12, 2015
    Applicant: DAI-ICHI SEIKO CO. LTD.
    Inventors: Yoichi HASHIMOTO, Hiroyuki Kon
  • Patent number: 8304091
    Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: November 6, 2012
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsuhiro Matsunaga, Toshifumi Matsushima, Tetsuro Sato, Kensuke Nakamura, Hiroyuki Kon, Kenichiro Iwakiri
  • Patent number: 7423504
    Abstract: An electromagnetic relay is provided which is capable of reducing a contact bounce at time of closing a contact. The electromagnetic relay is so configured that an opposed angle ? is 0°<?<45°, when viewed from a direction to which a normally open fixed contact and a movable contact slide before the normally open fixed contact comes into surface-contact with the movable contact spring.
    Type: Grant
    Filed: April 11, 2006
    Date of Patent: September 9, 2008
    Assignee: NEC Tokin Corporation
    Inventors: Hiroyuki Kon, Masayuki Morimoto
  • Publication number: 20080107865
    Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
    Type: Application
    Filed: September 9, 2005
    Publication date: May 8, 2008
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tetsuhiro Matsunaga, Toshifumi Matsushima, Tetsuro Sato, Kensuke Nakamura, Hiroyuki Kon, Kenichiro Iwakiri
  • Patent number: 7199326
    Abstract: A positioning jig for a spot-welding electrode includes an attaching portion for temporarily attaching to a workpiece. A positioning portion of the jig is disposed in parallel to a central axis of the attaching portion and spaced from the central axis. The positioning portion has an imaginary central axis coinciding with the central axis of the attaching portion. With the attaching portion attached to that part of a workpiece surface which is to be spot welded, the electrode is set on the central axis of the attaching portion. An inclination of the electrode is corrected to make the electrode stand parallel to the positioning portion such that, even when the workpiece surface is curved, the electrode can be positioned perpendicularly to the workpiece surface part to be spot welded.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 3, 2007
    Assignee: Honda Motor Co., Ltd.
    Inventor: Hiroyuki Kon
  • Publication number: 20060226935
    Abstract: An electromagnetic relay is provided which is capable of reducing a contact bounce at time of closing a contact. The electromagnetic relay is so configured that an opposed angle ? is 0°<?<45°, when viewed from a direction to which a normally open fixed contact and a movable contact slide before the normally open fixed contact comes into surface-contact with the movable contact spring.
    Type: Application
    Filed: April 11, 2006
    Publication date: October 12, 2006
    Inventors: Hiroyuki Kon, Masayuki Morimoto
  • Publication number: 20050263495
    Abstract: A positioning jig for a spot-welding electrode includes an attaching portion for temporarily attaching to a workpiece. A positioning portion of the jig is disposed in parallel to a central axis of the attaching portion and spaced from the central axis. The positioning portion has an imaginary central axis coinciding with the central axis of the attaching portion. With the attaching portion attached to that part of a workpiece surface which is to be spot welded, the electrode is set on the central axis of the attaching portion. An inclination of the electrode is corrected to make the electrode stand parallel to the positioning portion such that, even when the workpiece surface is curved, the electrode can be positioned perpendicularly to the workpiece surface part to be spot welded.
    Type: Application
    Filed: May 23, 2005
    Publication date: December 1, 2005
    Applicant: Honda Motor Co., Ltd.
    Inventor: Hiroyuki Kon