Patents by Inventor Hiroyuki KONTANI

Hiroyuki KONTANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member
    Patent number: 11147156
    Abstract: A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 ?m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: October 12, 2021
    Assignees: Sumitomo Electric Industries, Ltd., AL.M.T. CORP.
    Inventors: Isao Iwayama, Shigeki Koyama, Masashi Okamoto, Yuta Inoue, Hiroyuki Kontani, Takehisa Yamamoto
  • COMPOSITE MEMBER, HEAT RADIATION MEMBER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING COMPOSITE MEMBER
    Publication number: 20190297725
    Abstract: A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 ?m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.
    Type: Application
    Filed: November 8, 2017
    Publication date: September 26, 2019
    Applicants: Sumitomo Electric Industries, Ltd., A.L.M.T. Corp.
    Inventors: Isao IWAYAMA, Shigeki KOYAMA, Masashi OKAMOTO, Yuta INOUE, Hiroyuki KONTANI, Takehisa YAMAMOTO