Abstract: A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

Abstract: A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

Abstract: A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

Abstract: A method for producing a wired circuit board includes the steps of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, and forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer. An oxidation-reduction potential of the polymeric liquid of the conductive polymer is lower than a standard electrode potential of a conductive material forming the conductive pattern.

Abstract: A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.