Abstract: The present invention relates to a sealing lid for a package containing an optical element. For the sealing lid, a translucent material such as glass that can transmit light such as visible light is used. The present invention includes a lid main body made of the translucent material. The lid main body includes a joining region having a frame shape corresponding to an outer circumferential shape of the lid main body. A plurality of pieces of brazing material made of a eutectic alloy are fused on the joining region of the lid main body. An arrangement state of the brazing material includes aligning spherical pieces of brazing material continuously to form a frame shape along the joining region.

Abstract: A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au—Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni—Sn ally layer disposed between the Ni plating layer and the Au—Sn brazing material layer. It is preferable if the Ni—Sn alloy layer has a thickness of 0.6-5.0 ?m. It is also preferable if Au—Sn brazing material layer has a Sn content of 20.65-23.5 wt %.

Abstract: A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au—Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni—Sn ally layer disposed between the Ni plating layer and the Au—Sn brazing material layer. It is preferable if the Ni—Sn alloy layer has a thickness of 0.6-5.0 ?m. It is also preferable if Au—Sn brazing material layer has a Sn content of 20.65-23.5 wt %.

Abstract: An object of the present invention is to provide a method of producing an Ag—ZnO electric contact material which can uniformly disperse ZnO micrograms in Ag; which maintains low contact resistance; which exhibits enhanced welding resistance and wear resistance; and which is suitable in view of production costs. The method of producing an Ag—ZnO electrical contact material comprises casting Ag and Zn at predetermined proportions and subjecting the resultant Ag—ZnO alloy to internal oxidation so as to disperse ZnO in Ag, the method being characterized in that an Ag—Zn alloy comprising 5-10 wt. % (as reduced to weight of metal) Zn, the balance being Ag, is formed into chips; the chips are subjected to internal oxidation; the internally oxidized chips are compacted to thereby form billets; the billets are pressed and sintered; and subsequently, the sintered billets are extruded, to thereby yield uniform dispersion, in Ag, of ZnO micrograms.