Patents by Inventor Hiroyuki KUWAE

Hiroyuki KUWAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding method and structure
    Patent number: 11676935
    Abstract: A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: June 13, 2023
    Assignees: WASEDA UNIVERSITY, HARIMA CHEMICALS, INC.
    Inventors: Jun Mizuno, Hiroyuki Kuwae, Kosuke Yamada, Masami Aihara, Takayuki Ogawa
  • BONDING METHOD AND STRUCTURE
    Publication number: 20220246575
    Abstract: A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.
    Type: Application
    Filed: April 3, 2020
    Publication date: August 4, 2022
    Applicants: WASEDA UNIVERSITY, HARIMA CHEMICALS, INC.
    Inventors: Jun MIZUNO, Hiroyuki KUWAE, Kosuke YAMADA, Masami AIHARA, Takayuki OGAWA