Abstract: A photosensitive heat-resistant resin composition contains a polyamideimide resin, an organic solvent for dissolving the polyamideimide, an acrylic monomer or oligomer having at least two polymerizable double bonds, and a photoreaction initiator for initiating polymerization of the acrylic monomer or oligomer by photochemical reaction. The resin composition may be used to make a heat-resistant insulating film which may be patterned by selective irradiation of ultraviolet rays. The insulating film may be interposed between different conductor layers in a build-up multilayer circuit board.

Abstract: A visible radiation-curable solder resist composition which comprises a resin component, a component for promoting photo-polymerization or -crosslinking, and optionally a diluent and any other additives, the resion componebt comprising a novolak resin skeleton and a polyfunctional acrylic monomer and the component for promoting photo-polymerization or -crosslinking comprising a photo-reaction initiator, a sensitizing dye and a heterocyclic compound having at least two endocyclic nitrogen atoms.