Abstract: A workpiece supply device used in semiconductor assembly machines such as wire bonding device, pellet bonding device, etc. including an elevator section having an elevator table that is raised and lowered and carries a magazine accommodated therein plate-form workpieces, a magazine stacker which guides the magazine, and a pusher assembly including a pusher arm pushing the workpiece out of the magazine one at a time. The magazine stacker is made up with a fixed guide and a movable guide. The movable guide is adjustable size wise in a direction wherein the workpiece is pushed out, and the pusher device is provided on the movable guide. Power source for the pusher device is installed parallel to the workpieces piled up in the magazine.