Abstract: A cause-effect sentence analysis device including: a cause-effect sentence extraction unit configured to extract a cause-effect sentence including a cause expression and an effect expression from a text; an acquisition unit configured to acquire information indicating a reference expression for analyzing the degree of similarity; a similarity degree analysis unit, for a cause-effect sentence extracted by the cause-effect sentence extraction unit, configured to calculate a cause similarity degree, namely, the degree of similarity between the reference expression and the cause expression included in the cause-effect sentence, and an effect similarity degree, namely, the degree of similarity between the reference expression and the effect expression; and a desired cause-effect sentence extraction unit for extracting a cause-effect sentence in which one of the cause expression and the effect expression included in the cause-effect sentence is similar to the reference expression and the other is not similar to the

Abstract: A liquid molding resin component for a reaction injection molding process includes a liquid resin reaction monomer including metathesis polymerizable cycloolefin and a plurality of nonswelling mica. The plurality of nonswelling mica have an average particle size in a range of about 35 micro m to about 500 micro m and have a bulk density in a range of about 0.10 g/ml to about 0.27 g/ml. Further, a liquid resin component system for a reaction injection molding process includes a plurality of liquid resin components, at least one of which includes a catalyst, at least one of which includes an activator, and at least one of which includes a plurality of nonswelling mica having an average particle size in a range of about 35 micro m to about 500 micro m and having a bulk density in a range of about 0.10 g/ml to 0.27 g/ml.

Abstract: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: The present invention provides instant noodles containing agar and curdlan, having water absorption of 250% or more upon reconstitution with water at 20° C. for 3 minutes, and being capable of reconstitution with water in a time of 5 minutes or less, and having an excellent texture with suitable hardness.

Abstract: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: An optical film is provided, the optical film including: a transparent support; and at least one low refractive index layer on or above the transparent support, the low refractive index layer being obtained by hardening a composition containing: (A) a fluorine atom-free polymerizable compound having two or more ethylenically unsaturated groups in one molecule thereof; (B) low refractive index inorganic fine particles; and (C) a polyrotaxane compound.

Abstract: After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line is formed by patterning a metal film formed on the entire top surface. Next, slits are formed in the metal interconnect line to partially expose an upper surface of the sacrificial layer. After the sacrificial layer is dissolved, the dissolved sacrificial layer is discharged through the slits to the outside. An air space is formed as a result of the removal of the sacrificial layer.

Abstract: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line is formed by patterning a metal film formed on the entire top surface. Next, slits are formed in the metal interconnect line to partially expose an upper surface of the sacrificial layer. After the sacrificial layer is dissolved, the dissolved sacrificial layer is discharged through the slits to the outside. An air space is formed as a result of the removal of the sacrificial layer.

Abstract: A silver-containing antimicrobial agent which is excellent in affinity to fiber, antimicrobial property, anti-fungus property and stability to heat and light. It comprises carboxymethyl cellulose containing silver in the amount of 0.01 to 1% by weight and having the degree of substitution to carboxymethyl group of not less than 0.4. The carboxymethyl cellulose may be a crosslinked compound to make the antimicrobial agent water resistant.

Abstract: A pattern transfer mask for use in an optical exposure process includes a transparent substrate having a surface; a light shielding film of a desired pattern disposed on the surface of the transparent substrate for shielding a part of a photoresist film from light transmitted through the mask and incident on the photoresist film and for transferring the desired pattern to the photoresist film; and a plurality of projections disposed at equal intervals on one side of and contacting the light shielding film pattern for reducing the intensity of light transmitted through the transparent substrate where the projections are present.

Abstract: In a method for producing a field effect transistor, a positive photoresist is deposited on a surface of a semiconductor substrate, the positive photoresist is exposed to light having an asymmetric intensity profile where a gate electrode is to be formed, the positive photoresist is converted into a negative photoresist, the negative photoresist is developed to form a pattern having an aperture opposite the gate electrode formation region of the substrate and asymmetric overhanging portions at the aperture, the semiconductor substrate is wet etched using the photoresist pattern as a mask to form a recess in the semiconductor substrate, and a gate metal is deposited using the photoresist pattern as a mask to form a gate electrode in the recess. Therefore, only one exposure process provides a photoresist pattern having asymmetric overhanging portions at the aperture of the pattern.

Abstract: A mask for use in an optical exposure apparatus with single wavelength light includes a light shielding film pattern having two spaced apart portions on a transparent substrate, a transparent thin film for shifting the phase of light transmitted through the mask disposed in the aperture between the light shielding film portions and spaced from the light shielding film portions. The resolution and contrast of the image of the pattern projected onto a wafer are enhanced and the resolution and depth of focus of the photoresist on which the pattern is projected are improved.