Patents by Inventor Hiroyuki Mitsuzuka

Hiroyuki Mitsuzuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminate for packaging and package
    Publication number: 20040077248
    Abstract: A packaging multilayer material 14 is formed by sequentially laying an air permeable heat-resistant fiber material layer 11 having a heat-resistance of not lower than 150° C., a polyethylene type resin spunbonded non-woven fabric layer 12 and a microporous film layer 13 in the above listed order by means of thermal bonding. The air permeable heat-resistant fiber material layer 11 is made of resin spunbonded non-woven fabric having a melting point between 150 and 300° C. and the polyethylene type resin spunbonded non-woven fabric layer 12 is an ethylene-&agr;-olefin copolymer having a density between 880 and 950 kg/m3, while the microporous film layer 13 is made of polyethylene type resin.
    Type: Application
    Filed: August 25, 2003
    Publication date: April 22, 2004
    Inventors: Akihiko Kurahashi, Hiroyuki Nakagami, Hiroyuki Mitsuzuka