Abstract: A method for forming a resist underlayer film includes applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a coating film. The coating film is heated at a heating temperature of higher than 450° C. and 600° C. or lower in an atmosphere having an oxygen concentration of less than 0.01% by volume. The composition for forming a resist underlayer film includes: a compound including an aromatic ring; a polymer which thermally decomposes at the heating temperature in heating the coating film, and which is other than the compound; and a solvent. The compound has a molecular weight of 400 or more. A content of the polymer is less than a content of the compound in the composition for forming a resist underlayer film.

Abstract: A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).

Abstract: A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist under film directly or indirectly on the substrate; applying a composition for forming a resist film to the resist underlayer film to form a resist film on the resist underlayer film; exposing the resist film to radiation; and developing the exposed resist film by a developer. The composition for forming a resist underlayer film includes: a polymer; an onium salt that is capable of generating at least one polar group selected from the group consisting of a carboxy group and a hydroxy group by radiation or heat; and a solvent.

Abstract: A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing the exposed resist film. The composition for forming a resist underlayer film includes: a polymer; an acid generating agent; and a solvent. The resist underlayer film has a film thickness of 6 nm or less.

Abstract: A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a group represented by formula (1-1) or (1-2). In the formulas (1-1) and (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii) or (iv); * is a bond with the carbon atom in the formula (1); and Ar2, Ar3 and Ar4 are each independently a substituted or unsubstituted aromatic ring having 6 to 20 ring atoms that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2).

Abstract: A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 10 to 40 ring atoms; and R0 is a monovalent group including a heteroaromatic ring which includes a sulfur atom as a ring-forming atom.

Abstract: A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition. The composition includes a compound and a solvent. The compound includes: at least one nitrogen-containing ring structure selected from the group consisting of a pyridine ring structure and a pyrimidine ring structure; and a partial structure represented by formula (1-1) or (1-2). X1 and X2 are each independently a group represented by formula (i), (ii), (iii), or (iv); * is a bond with a moiety of the compound other than the partial structure represented by formula (1-1) or (1-2); and Ar11 and Ar12 are each independently a substituted or unsubstituted aromatic ring having 5 to 20 ring members that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2).

Abstract: A method for forming a protective film includes directly or indirectly coating only a periphery of a substrate with a composition. The composition includes a compound having an aromatic ring, and a solvent. The solvent includes a first solvent having a normal boiling point of 156° C. or higher and lower than 300° C. A content of the first solvent in the solvent is preferably 20 mass % or more and 100 mass % or less. The first solvent is preferably an ester, an alcohol, an ether, a carbonate, or a combination of two or more of an ester, an alcohol, an ether, and a carbonate.

Abstract: The power storage device comprises an electrode assembly including a positive electrode, a separator, and a negative electrode, and an electrolyte solution. The negative electrode comprises a negative electrode current collector and a negative electrode active material layer. The active material layer comprises a surplus region A not facing the positive electrode active material layer, an end region B facing a region in the positive electrode active material layer, the region extending from an end of the positive electrode active material layer toward a center of the positive electrode active material layer by a length of 5% of a length from the center to the end, and a center region C. A negative electrode potential VA and a negative electrode potential VC after the positive electrode and the negative electrode are short-circuited satisfy Formulas below: (1): VA?2.0 V, (2): VC?1.0 V, (3): VA/VC?0.7.

Abstract: There is provided a water-soluble additive composition including a cyclic carboxylic acid, the water-soluble additive composition satisfying at least one of the following Conditions 1 to 4: (Condition 1) component (A) the cyclic carboxylic acid, which is other than the following component (B1), and component (B1) one or more selected from the group consisting of gallic acid and an ester thereof are included; (Condition 2) the total content of Na+ and NH4+ is equal to or more than 100 ppm and equal to or less than 5000 ppm with respect to the cyclic carboxylic acid; (Condition 3) the total inorganic ion content (excluding hydrogen ions and hydroxyl group ions) is equal to or more than 300 ppm and equal to or less than 5000 ppm with respect to the cyclic carboxylic acid; and (Condition 4) component (A) the cyclic carboxylic acid, which is other than the following component (B2), and component (B2) an amino acid are included.

Abstract: A reactor includes a bobbin around which a coil is wound, and a core extending through the bobbin. The bobbin has a tubular shape. The core has a quadrangular prism shape. The core includes a distal end surface and a pair of side surfaces perpendicular to the distal end surface. The side surfaces are opposite surfaces of the core. The bobbin includes projections respectively provided on inner surfaces of the bobbin. The inner surfaces of the bobbin respectively face the side surfaces of the core. The projections extend in an axial direction of a tubular portion of the bobbin. The projections are in contact with the core.

Abstract: The medicinal product of the present invention contains, as an active ingredient, at least one of a cyclic carboxylic acid compound derived from a plant-derived saccharide and a microorganism, and a derivative thereof. Further, it is preferable that the cyclic carboxylic acid compound is a compound represented by Formula (1).

Abstract: A reactor includes a bobbin around which a coil is wound, and a core extending through the bobbin. The bobbin has a tubular shape. The core has a quadrangular prism shape. The core includes a distal end surface and a pair of side surfaces perpendicular to the distal end surface. The side surfaces are opposite surfaces of the core. The bobbin includes projections respectively provided on inner surfaces of the bobbin. The inner surfaces of the bobbin respectively face the side surfaces of the core. The projections extend in an axial direction of a tubular portion of the bobbin. The projections are in contact with the core.

Abstract: Breakage of a ring core or a bobbin upon injection molding of molten resin is to be prevented in a method of manufacturing a reactor including the ring core. A reactor includes a ring core, a bobbin, a pair of coils, and a plastic cover. The bobbin includes a pair of cylinder portions, and flanges connecting ends of the cylinder portions. The reactor is manufactured by following processes. First protrusions that make contact with an inner circumferential surface of the ring core are provided on outer sides of the flanges along a cylinder axis direction. Second protrusions are provided at positions facing the corresponding first protrusions across the ring core are provided on a cavity surface of a mold that forms the plastic cover by injection molding. The plastic cover is formed by injecting molten resin into the mold while clamping the ring core by the first and second protrusions.

Abstract: A reactor includes a reactor body and a heat sink. The reactor body includes coil wire wound around a core. The heat sink is fixed to the reactor body through a heat transfer sheet. The heat sink includes a restricting wall for the heat transfer sheet such that expansion of the heat transfer sheet in a first direction is restricted more than expansion of the heat transfer sheet in a second direction. The first direction is an extending direction of the coil wire on a surface of the reactor body, which abuts on the heat transfer sheet. The second direction is an axis direction of the coil wire.

Abstract: A binder composition for power storage devices comprising a polymer which contains at least 3 to 40 mass % of a first recurring unit derived from an unsaturated carboxylic acid ester having an alicyclic hydrocarbon group and 1 to 40 mass % of a second recurring unit derived from an ?, ?-unsaturated nitrile compound based on 100 mass % of the total of all recurring units.

Abstract: A composition for forming a protective film that is placed between a positive electrode and a negative electrode of an electrical storage device, includes polymer particles (A1), polymer particles (A2), and a liquid medium, the polymer particles (A1) including a repeating unit derived from a compound that includes two or more polymerizable unsaturated groups in an amount of less than 15 parts by mass based on 100 parts by mass of the polymer particles (A1), and the polymer particles (A2) including a repeating unit derived from a compound that includes two or more polymerizable unsaturated groups in an amount of 20 to 100 parts by mass based on 100 parts by mass of the polymer particles (A2).

Abstract: A reactor includes a heat dissipation sheet and a main body. The main body includes a first coil, a second coil, a resin cover and a pressing frame. The resin cover has a central section that covers side surfaces of the first and second coil between the first and second coil. The pressing frame extends along outer peripheries of bottom surfaces of the first coil and the second coil. The pressing frame is configured to press the heat dissipation sheet toward the cooler. The pressing frame has a coupled section that is coupled to a lower surface of the central section. The pressing frame is able to be displaced in a vertical direction with respect to the resin cover other than the central section.

Abstract: An electrical storage device electrode binder composition containing a polymer (A) and a liquid medium (B). A repeating unit (A4) derived from an unsaturated carboxylic acid compound is included in the polymer (A) in an amount of 5-40 parts by mass based on 100 parts by mass of the total repeating units in polymer (A). The polymer (A) is in particle form, and the polymer particles have a surface acid content of 1-6 mmol/g.

Abstract: A reactor includes a heat dissipation sheet and a main body. The main body includes a first coil, a second coil, a resin cover and a pressing frame. The resin cover has a central section that covers side surfaces of the first and second coil between the first and second coil. The pressing frame extends along outer peripheries of bottom surfaces of the first coil and the second coil. The pressing frame is configured to press the heat dissipation sheet toward the cooler. The pressing frame has a coupled section that is coupled to a lower surface of the central section. The pressing frame is able to be displaced in a vertical direction with respect to the resin cover other than the central section.