Patents by Inventor Hiroyuki Monde

Hiroyuki Monde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7705079
    Abstract: The present invention provides a polyarylene sulfide resin composition which shows high dielectric constant and low dielectric dissipation factor, has excellent moldability, and has improved corrosive property to metal parts. More specifically, to 100 parts by weight of (A) polyarylene sulfide resin, compounded are 10 to 400 parts by weight of (B) an alkaline earth metal titanate showing 50 or higher relative dielectric constant and 0.05 or lower dielectric dissipation factor at 1 MHz, and containing less than 500 ppm of metal ion which is extracted by hot water; and 0.01 to 15 parts by weight of (C) one or more compound selected from hydroxides and oxides of alkaline earth metals.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: April 27, 2010
    Assignees: Polyplastics Co., Ltd., Otsuka Chemical Co., Ltd.
    Inventors: Hidemi Kondoh, Yoshihito Fukasawa, Hiroyuki Monde
  • Publication number: 20090253843
    Abstract: The present invention provides a polyarylene sulfide resin composition which shows high dielectric constant and low dielectric dissipation factor, has excellent moldability, and has improved corrosive property to metal parts. More specifically, to 100 parts by weight of (A) polyarylene sulfide resin, compounded are 10 to 400 parts by weight of (B) an alkaline earth metal titanate showing 50 or higher relative dielectric constant and 0.05 or lower dielectric dissipation factor at 1 MHz, and containing less than 500 ppm of metal ion which is extracted by hot water; and 0.01 to 15 parts by weight of (C) one or more compound selected from hydroxides and oxides of alkaline earth metals.
    Type: Application
    Filed: December 13, 2006
    Publication date: October 8, 2009
    Inventors: Hidemi Kondoh, Yoshihito Fukasawa, Hiroyuki Monde
  • Patent number: 7179844
    Abstract: It is an object of the present invention to provide a dielectric resin foam which has high and uniform dielectric properties and is preferable for use as various dielectric materials. A dielectric resin foam obtained by expanding a resin composition comprising a synthetic resin and a fibrous and/or plate-like dielectric inorganic filler is provided.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: February 20, 2007
    Assignees: Otsuka Chemical Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Minoru Aki, Hiroyuki Monde, Akira Tabuchi, Yoshifumi Tachi, Syougo Kawakami, Masatoshi Kuroda, Tetsuo Kishimoto, Kouichi Kimura
  • Publication number: 20040029985
    Abstract: It is an object of the present invention to provide a dielectric resin foam which has high and uniform dielectric properties and is preferable for use as various dielectric materials. A dielectric resin foam obtained by expanding a resin composition comprising a synthetic resin and a fibrous and/or plate-like dielectric inorganic filler is provided.
    Type: Application
    Filed: April 3, 2003
    Publication date: February 12, 2004
    Inventors: Minoru Aki, Hiroyuki Monde, Akira Tabuchi, Yoshifumi Tachi, Syougo Kawakami, Masatoshi Kuroda, Tetsuo Kishimoto, Kouichi Kimura
  • Patent number: 6570097
    Abstract: A connector with inhibited crosstalk for high speed signal circuits, where the connector contains an insulator formed from a resin composition obtained by incorporating 5 to 85% by weight of a ceramic dielectric powder having a dielectric constant of 30 or more determined at 25° C. and 1 MHz in a matrix resin, and the insulator is substantially homogeneous in the dielectric constant throughout the insulator.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Otsuka Chemical Co., Ltd.
    Inventors: Hiroyuki Monde, Akira Tabuchi, Shogo Kawakami
  • Publication number: 20020182935
    Abstract: A connector characterized by having an insulator formed of a resin composition obtained by incorporating 5 to 85% by weight of a ceramic dielectric powder having a dielectric constant of 30 or more determined at 25° C. and 1 MHz to a matrix resin.
    Type: Application
    Filed: September 27, 2001
    Publication date: December 5, 2002
    Inventors: Hiroyuki Monde, Akira Tabuchi, Shogo Kawakami
  • Patent number: 6333107
    Abstract: An electroconductive fiber comprising a fibrous core material whose surface is coated with an electroconductive substance, the fibrous core material having an average fiber length of 1 to 5 &mgr;m, an average fiber diameter of 0.01 to 0.5 &mgr;m and an aspect ratio of 3 or more, electroconductive resin composition containg the electroconductive fibers, and electroconductive thread prepared by spinning the electroconductive resin composition.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: December 25, 2001
    Assignee: Otsuka Kagaku Kabushiki Kaisha
    Inventors: Hiroshi Ogawa, Jun Ogawa, Hiroyuki Monde