Patents by Inventor Hiroyuki Morisima

Hiroyuki Morisima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film
    Publication number: 20060199021
    Abstract: The present invention provides a composition comprising (a) a thermally decomposable polymer and (b) a siloxane oligomer evenly dissolved in (c) an organic solvent; a composition comprising (a) a thermally decomposable polymer, (b) a siloxane oligomer, and (c) an organic solvent in which both of the ingredients (a) and (b) are soluble; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith and then heating the resulting film to condense the siloxane oligomer and remove the thermally decomposable polymer; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith, subsequently conducting a first heating step in which the siloxane oligomer is crosslinked while keeping t
    Type: Application
    Filed: May 10, 2006
    Publication date: September 7, 2006
    Inventors: Takenori Narita, Hiroyuki Morisima, Shigeru Nobe, Kazuhiro Enomoto, Haruaki Sakurai, Nobuko Terada
  • Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film
    Publication number: 20040253462
    Abstract: The present invention provides a composition comprising (a) a thermally decomposable polymer and (b) a siloxane oligomer evenly dissolved in (c) an organic solvent; a composition comprising (a) a thermally decomposable polymer, (b) a siloxane oligomer, and (c)′ an organic solvent in which both of the ingredients (a) and (b) are soluble; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith and then heating the resulting film to condense the siloxane oligomer and remove the thermally decomposable polymer; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith, subsequently conducting a first heating step in which the siloxane oligomer is crosslinked while ke
    Type: Application
    Filed: July 13, 2004
    Publication date: December 16, 2004
    Applicant: Hitachi Chemical Co., Ltd.
    Inventors: Takenori Narita, Hiroyuki Morisima, Shigeru Nobe, Kazuhiro Enomoto, Haruaki Sakurai, Nobuko Terada