Abstract: An optical transmission module includes: a photoelectric conversion element that converts an electrical signal to an optical signal; a photoelectric conversion element-driving IC that drives the photoelectric conversion element; an optical fiber that transmits the optical signal; a guide holding member that holds the optical fiber; a cable that supplies power to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and a substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted. The substrate has first and second planes which are perpendicular to each other. The photoelectric conversion element is mounted on the first plane. The optical fiber is connected to a back side of the first plane. An optical axis of the optical fiber is perpendicular to the first plane. The cable is connected to the second plane in parallel with the optical axis of the optical fiber.

Abstract: An optical fiber cable connecting structure includes: a substrate having a through hole; an optical element on a first surface of the substrate and having a light emitting unit such that the light emitting unit faces the substrate; an optical fiber cable on a second surface of the substrate opposite to the first surface, an end face of the optical fiber cable on a substrate side being covered with a jacket; a guide positioning part that has an insertion hole into which the optical fiber cable is inserted, and is configured to position the optical fiber cable and the optical element; and an abutting part that has a taper-shaped opening and is configured to position the optical element and the optical fiber cable so as to be separated by a specified distance by fixing an outer periphery of the end face of the optical fiber cable by the opening.

Abstract: An optical transmission module includes: an optical device having a light emitting section that outputs light of an optical signal; an optical fiber that transmits the optical signal; a holding member in which a distal end portion of the optical fiber is inserted into a through hole having an inner diameter equivalent to an outer diameter of the optical fiber, and that is disposed on the optical device; and a lens section that is disposed in an opening on the optical device side of the through hole of the holding member, and that concentrates the light.

Abstract: An imaging module includes: an imaging unit including a light receiving unit having a plurality of pixels arranged in a specified shape including a lattice shape and configured to receive light and to perform photoelectric conversion on the received light, the imaging unit being configured to capture an image of a subject and to output the image as a light quantity signal; a signal processing unit configured to perform signal processing on the light quantity signal; and a flexible substrate which includes a bendable insulating film and on which the imaging unit and the signal processing unit are mounted. The flexible substrate is bent to arrange the signal processing unit and the flexible substrate in a space extending from an outer edge of an incident surface of the imaging unit in a direction perpendicular to the incident surface while maintaining a shape of the outer edge.

Abstract: A photoelectric conversion module includes: a substrate having a wiring layer and a through hole; a photoelectric conversion element having a light emitting unit or light receiving unit and mounted on the substrate such that the light emitting unit or light receiving unit faces the through hole; a protruding portion that has a hole portion communicating with the through hole, and protrudes from one of principal surfaces of one of the substrate and the photoelectric conversion element, one of the principal surfaces facing the other one of the substrate and the photoelectric conversion element; and an adhesive that is filled in a part of a region between the substrate and the photoelectric conversion element, the region being a region outside an inner peripheral surface of the hole portion, and that bonds the substrate to the photoelectric conversion element.

Abstract: A mounting apparatus includes a substrate; an optical component having a first surface on which light from the substrate is incident and a second surface from which the incident light goes out after the incident light is refracted; an adjustment unit that adjusts a position of the substrate and a position of the optical component by moving the substrate and the optical component relatively with the first surface of the optical component and the substrate being opposed to each other; an imaging unit that is arranged in an optical path of the light that goes out from the second surface; and a control unit that controls an amount by which the adjustment unit moves the substrate and the optical component relatively according to image data which is captured by the imaging unit, and that mounts the optical component on the substrate.

Abstract: An optical element module includes an optical element having a light receiving unit configured to input an optical signal or a light emitting unit configured to output an optical signal, a board on which the optical element is mounted, and a guide holding member that has a through hole into which an optical fiber is configured to be inserted for inputting and outputting the optical signal to or from the light receiving unit or the light emitting unit of the optical element, and is mounted and arranged to be aligned with the optical element in a thickness direction of the board. The through hole has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber. A diameter of the light receiving unit or the light emitting unit is smaller than that of the optical fiber.

Abstract: A mounting apparatus which mounts on a substrate, a component having an inclined surface which intersects with a contact surface of the substrate and the component, at an acute angle, includes a first light source having an optical path orthogonal to the contact surface, and a camera which picks up an image of the component and an image of the substrate, a second light source which irradiates light on the inclined surface, and a moving means which moves at least one of the component and the substrate relatively, in a plane parallel to the surface of contact, and reflected light which is irradiated from the second light source, and reflected by the inclined surface is incident on the image pickup section.

Abstract: An image pickup unit includes an image pickup device, an objective lens, and a prism that has a reflective surface. The image pickup unit includes: a projecting portion that is an area at which the image pickup device projects to the rear from the prism; a terminal portion provided on the projecting portion; a flexible printed wiring board that extends along the prism and the projecting portion; an image pickup device connection terminal portion formed on a face that faces the projecting portion of the flexible printed wiring board; and a cable connection terminal portion formed at an area that extends over the projecting portion of the flexible printed wiring board. The terminal portion and the image pickup device connection terminal portion are joined in an opposed state. An electronic component is mounted on a face on an opposite side to the reflective surface of the flexible printed wiring board.

Abstract: A stacked mounting structure includes a first substrate which includes a first electronic component, a second substrate disposed facing the first substrate and including a second electronic component, an intermediate member having a space for accommodating the second electronic component, an electroconductive member provided to the intermediate member, a first electrode for testing electrically connected to the first electronic component, as an electrode for testing an operation of the first electronic component, a connecting electrode toward the second substrate electrically connected to the second electronic component, as an electrode for electrically connecting to the electroconductive member, and a second electrode for testing provided to the first substrate as an electrode for testing an operation of the second electronic component and electrically connected to the second electronic component via the electroconductive member and the connecting electrode toward the second substrate.

Abstract: There is provided an image pickup module which can be formed by a simple process while securing the mechanical strength of an inner lead at the time of bending and when fixed, without increasing an outer dimension of the image pickup module. The image pickup module includes an image pickup element having an image pickup surface, and a flexible substrate is drawn to be directed rearward of the image pickup surface. A guide member which fixes the image pickup element and the flexible substrate is provided, and the guide member includes a portion which is extended along a rear surface of the image pickup element, and a portion which is extended along a gap between the image pickup element and the flexible substrate.

Abstract: A mounting apparatus includes a substrate; an optical component having a first surface on which light from the substrate is incident and a second surface from which the incident light goes out after the incident light is refracted; an adjustment unit that adjusts a position of the substrate and a position of the optical component by moving the substrate and the optical component relatively with the first surface of the optical component and the substrate being opposed to each other; an imaging unit that is arranged in an optical path of the light that goes out from the second surface; and a control unit that controls an amount by which the adjustment unit moves the substrate and the optical component relatively according to image data which is captured by the imaging unit, and that mounts the optical component on the substrate.

Abstract: A mounting apparatus which mounts on a substrate, a component having an inclined surface which intersects with a contact surface of the substrate and the component, at an acute angle, includes a first light source having an optical path orthogonal to the contact surface, and a camera which picks up an image of the component and an image of the substrate, a second light source which irradiates light on the inclined surface, and a moving means which moves at least one of the component and the substrate relatively, in a plane parallel to the surface of contact, and reflected light which is irradiated from the second light source, and reflected by the inclined surface is incident on the image pickup section.

Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.

Abstract: There is provided an image pickup module which can be formed by a simple process while securing the mechanical strength of an inner lead at the time of bending and when fixed, without increasing an outer dimension of the image pickup module. The image pickup module includes an image pickup element having an image pickup surface, and a flexible substrate is drawn to be directed rearward of the image pickup surface. A guide member which fixes the image pickup element and the flexible substrate is provided, and the guide member includes a portion which is extended along a rear surface of the image pickup element, and a portion which is extended along a gap between the image pickup element and the flexible substrate.

Abstract: There is provided a stacked mounting structure in which, it is possible to carry out testing of each substrate after the formation of (after manufacturing) the stacked mounting structure.

Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.