Abstract: An object of the present invention is to provide a production method for producing an optical fiber ribbon that has an identification mark for identification, in which optical transmission loss is unlikely to be caused. A production method for producing an optical fiber cable for achieving the above objective includes: curing a photocurable resin by irradiating the photocurable resin with light, the photocurable resin being disposed to couple together a plurality of single-core coated optical fibers arranged in parallel; and forming a plurality of identification marks on the photocurable resin cured, the forming being performed by applying ink by an ink-jet method, in which the forming the plurality of identification marks is performed in a state in which a temperature of the photocurable resin is lower than or equal to 37.3° C.

Abstract: An electrocaloric effect element includes a container having a first wall and a second wall, the second wall facing the first wall, ionic liquid accommodated in the container, a first electrode provided at an outer surface of the first wall, and a movable electrode provided in the ionic liquid such that the movable electrode is movable in the ionic liquid.

Abstract: A vehicle has a motor that drives the vehicle, a battery that allows supplying an electric power to the motor, and a power conversion device disposed between the motor and the battery. An execution command of ripple charging and discharging that alternately charges and discharges multiple times with the battery is output to the power conversion device when a temperature of the battery is lower than a predetermined threshold temperature, and the flow rate of the heating medium is controlled such that the flow rate of the heating medium is reduced compared with a case where the temperature of the battery is lower than the temperature of the heating medium when the temperature of the battery is higher than the temperature of the heating medium that exchanges heat with the battery while the ripple charging and discharging is executed.

Abstract: An edible powder formed of particles smaller than a film thickness, a predetermined component, and an edible liquid having a mass 35% or less of a mass of the powder are kneaded to generate a plastic solid material containing a liquid. The solid material is extruded from a mold to plastically deform the solid material and a predetermined cross-sectional shape is imparted to the solid material. The solid material having the predetermined cross-sectional shape is sliced with a cutting edge so as to have a film shape having a predetermined thickness.

Abstract: An air conditioner that has a controller and is such that an outdoor unit, which is provided with a compressor, an outdoor heat exchanger, an accumulator, and a supercooling heat exchanger, and indoor units provided with indoor heat exchangers, are connected to each other by connecting piping to constitute a refrigerant circuit. The bottom of the accumulator is connected to an intake side of the compressor via return bypass piping that is provided with an electromagnetic valve. The cooling source for the supercooling heat exchanger is a supercooling bypass circuit provided with a supercooling expansion valve; and when the amount of refrigerant during heating operation is determined to be excessive, the controller performs a control so as to fully close the electromagnetic valve of the return bypass piping and to gradually increase the opening degree of the supercooling expansion valve of the supercooling bypass circuit from a fully closed state.

Abstract: A semiconductor device and a method for manufacturing a semiconductor device that enable characteristics to be improved are provided. A semiconductor device includes a substrate that has a first surface and a second surface that is located opposite the first surface, a first element that is disposed on the first surface, and a first resin layer that is disposed on the first surface and that is disposed around the first element in a plan view. The substrate includes a wiring layer. The first element includes a semiconductor layer, an electrode portion that is located on a surface of the semiconductor layer facing the substrate, and an insulating layer that is located opposite the electrode portion with the semiconductor layer interposed therebetween. The electrode portion is connected to the wiring layer. A height of the first resin layer from the first surface is more than a height of the first element from the first surface.

Abstract: A semiconductor device and a method for manufacturing a semiconductor device that enable characteristics to be improved are provided. A semiconductor device includes a substrate that has a first surface and a second surface that is located opposite the first surface, a first element that is disposed on the first surface, and a first resin layer that is disposed on the first surface and that is disposed around the first element in a plan view. The substrate includes a wiring layer. The first element includes a semiconductor layer, an electrode portion that is located on a surface of the semiconductor layer facing the substrate, and an insulating layer that is located opposite the electrode portion with the semiconductor layer interposed therebetween. The electrode portion is connected to the wiring layer. A height of the first resin layer from the first surface is more than a height of the first element from the first surface.

Abstract: According to one embodiment, in a low speed drive of outdoor fans, a first flow rate adjusting valve in a main outdoor heat exchanger side is narrowed to a closing degree or a close range thereof, and an opening degree of a second flow rate adjusting valve is controlled such that a supercooling degree of refrigerant in auxiliary outdoor heat exchangers becomes constantly a target value.

Abstract: Provided is an inexpensive microneedle array with little dimensional error that can control, with high precision, the amount of a predetermined component to be introduced to the inner part of the skin, and a production method for this microneedle array. A foundation that is insoluble or sparingly soluble in inner part of the skin is overlaid on a mold. A plurality of frustum-shaped protrusions, which are insoluble or sparingly soluble in the raw material liquid, provided on a first main surface of the foundation are fit into a plurality of cone-shaped recesses. The raw material liquid in the plurality of cone-shaped recesses dries and, as a result, a plurality of microneedles, which are dissolvable in the inner part of the skin, are fixed to tip surfaces of the plurality of frustum-shaped protrusions.

Abstract: An electrocaloric effect element includes a container having a first wall and a second wall, the second wall facing the first wall, ionic liquid accommodated in the container, a first electrode provided at an outer surface of the first wall, and a movable electrode provided in the ionic liquid such that the movable electrode is movable in the ionic liquid.

Abstract: An edible powder formed of particles smaller than a film thickness, a predetermined component, and an edible liquid having a mass 35% or less of a mass of the powder are kneaded to generate a plastic solid material containing a liquid. The solid material is extruded from a mold to plastically deform the solid material and a predetermined cross-sectional shape is imparted to the solid material. The solid material having the predetermined cross-sectional shape is sliced with a cutting edge so as to have a film shape having a predetermined thickness.

Abstract: A dentin regenerative cell culture that can bring about a rapid regeneration of dentin in a deficit region. In the treatment of a tooth using the dentin regenerative cell culture, a root canal where a pulpectomy has been performed is filled with a root canal filler containing dental pulp stem cells. The dentin regenerative cell culture is then implanted in the deficit region of dentin, and temporary sealing with a packing is carried out. The dentin regenerative cell culture is formed three-dimensionally in conformity with the shape of the deficit region with the coalescence of cell masses of a plurality of odontoblasts, and thus the dentin regeneration is well promoted. In addition, gaps between the dentin regenerative cell culture and biological tissue can be rapidly filled. Infection due to bacterial infiltration can thereby be prevented.

Abstract: An electrode unit of a joining apparatus includes an abutting section provided with a tapered outer circumferential surface that contacts a tapered pressure-receiving surface by being inserted into an inside of a first metal member. The tapered outer circumferential surface inclines in a direction of getting closer to an axial center of the abutting section from one end side to another end side. At least part of the abutting section has a thickness elastically deformable in such a manner that the tapered outer circumferential surface aligns with the tapered pressure-receiving surface during application of a pressurizing force to the first metal member and a second metal member.

Abstract: The present invention enables correct placement of an electronic mark on a frame of captured image data intended by a remote control apparatus performing monitoring. Monitoring image data with a time code is transmitted to an external device. A command (an electronic mark placement command, or the like) to which a time code value showing a command target frame in the monitoring image data is added is received from the remote control apparatus. Processing based on the command is performed on a frame corresponding to the time code value added to the command, among image data corresponding to the monitoring image data recorded on a recording medium.

Abstract: To achieve stable administration of a medicine into a dermis by improving the operability of a device that inserts a microneedle into a skin. An impacting type applicator (1) for a microneedle patch is an applicator that applies a microneedle patch (3) to a skin includes a main body (5), a spring expanding/compressing lever (7), a resilient body (9), a lock mechanism (11), and a piercing switch (13). The spring expanding/compressing lever (7) is movably attached to the main body (5), and the microneedle patch (3) can be attached to a leading end of the spring expanding/compressing lever (7). The resilient body (9) is a member that imparts a biasing force to the spring expanding/compressing lever (7). The lock mechanism (11) is a mechanism that locks the spring expanding/compressing lever (7) in a state where the resilient body (9) exerts the biasing force on the main body (5).

Abstract: A semiconductor device and a method for manufacturing a semiconductor device that enable characteristics to be improved are provided. A semiconductor device includes a substrate that has a first surface and a second surface that is located opposite the first surface, a first element that is disposed on the first surface, and a first resin layer that is disposed on the first surface and that is disposed around the first element in a plan view. The substrate includes a wiring layer. The first element includes a semiconductor layer, an electrode portion that is located on a surface of the semiconductor layer facing the substrate, and an insulating layer that is located opposite the electrode portion with the semiconductor layer interposed therebetween. The electrode portion is connected to the wiring layer. A height of the first resin layer from the first surface is more than a height of the first element from the first surface.

Abstract: There is provided a method for manufacturing Ni wiring. The method includes forming an Ni film on a surface of a substrate having a recess formed thereon by CVD or ALD by using an Ni compound as a film forming material and NH3 gas and H2 gas as reduction gases to partially fill the recess. The method further includes annealing the substrate to make the Ni film on the surface of the substrate and on a side surface of the recess reflow into the recess.

Abstract: The present invention enables correct placement of an electronic mark on a frame of captured image data intended by a remote control apparatus performing monitoring. Monitoring image data with a time code is transmitted to an external device. A command (an electronic mark placement command, or the like) to which a time code value showing a command target frame in the monitoring image data is added is received from the remote control apparatus. Processing based on the command is performed on a frame corresponding to the time code value added to the command, among image data corresponding to the monitoring image data recorded on a recording medium.

Abstract: An electrode unit of a joining apparatus includes an abutting section provided with a tapered outer circumferential surface that contacts a tapered pressure-receiving surface by being inserted into an inside of a first metal member. The tapered outer circumferential surface inclines in a direction of getting closer to an axial center of the abutting section from one end side to another end side. At least part of the abutting section has a thickness elastically deformable in such a manner that the tapered outer circumferential surface aligns with the tapered pressure-receiving surface during application of a pressurizing force to the first metal member and a second metal member.

Abstract: A joining apparatus includes an electrifying/pressurizing head provided with an abutting surface contacting a pressure-receiving surface of a first metal member, joins the first metal member and a second metal member by electrification and pressurization employing the electrifying/pressurizing head, and obtains a joined body in which a joining interface inclines with respect to the pressure-receiving surface. The abutting surface includes: an electrode section capable of electrifying the first metal member; and an insulating section configured from an insulating material. At least a shortest portion where a distance from the joining interface will be shortest, of the pressure-receiving surface will be a non-contact-with-electrode section of non-contact with the electrode section, and the insulating section contacts at least part of the non-contact-with-electrode section.