Abstract: An object of the present invention is to provide an optical measurement technology capable of quantitatively measuring a size distribution of a particle that performs Brownian motion in a sample. A size distribution measurement device according to the present invention measures a reflected light intensity while scanning a focal point position along an optical axis direction of measurement light, and calculates the size distribution of the particle according to the highest reflected light intensity of the measured reflected light intensities (refer to FIG. 9).

Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.

Abstract: A tubular body that includes a plurality of first wires distributed in an annular portion of the tubular body, and a plurality of deformed second wires alternately disposed between each of the plurality of first wires, the plurality of first wires and the plurality of deformed second wires being in an alternately twisted arrangement in a longitudinal direction of the tubular body, where each of the plurality of first wires has a substantially circular shape in a cross section view, and each of the plurality of deformed second wires has a non-circular shape in the cross section view, has an arcuate side portion that receive a part of a side surface of an adjacent wire of the plurality of first wires, and has an annular sector shape protruding in a radial direction in the cross section view of the tubular body.

Abstract: A shaft assembly for an in vivo recovery mechanism is provided with a shaft, and a side wire sparsely wound onto the outer circumference of the shaft and having protruding and recessed parts on the outer circumferential surface thereof. Therefore, when rotating the shaft assembly as part of an in vivo recovery mechanism, a substance in the body is caught between the sparsely wound side wire on the shaft and held by the protruding and recessed parts formed on the side wire, whereby performance for recovering and transporting the substance in the body can be improved.

Abstract: A tubular body that includes a plurality of first wires distributed in an annular portion of the tubular body, and a plurality of deformed second wires alternately disposed between each of the plurality of first wires, the plurality of first wires and the plurality of deformed second wires being in an alternately twisted arrangement in a longitudinal direction of the tubular body, where each of the plurality of first wires has a substantially circular shape in a cross section view, and each of the plurality of deformed second wires has a non-circular shape in the cross section view, has an arcuate side portion that receive a part of a side surface of an adjacent wire of the plurality of first wires, and has an annular sector shape protruding in a radial direction in the cross section view of the tubular body.

Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.