Abstract: An optical subassembly manufacturing method includes forming connecting electrodes and a piece of high-melting-point glass on a wiring substrate; positioning on and connecting to the connecting electrodes, an optoelectronic converting element; disposing on the piece of high-melting-point glass, a piece of low-melting-point glass having a melting point lower than the piece of high-melting-point glass; and fixing to the piece of low-melting-point glass, a protruding portion of a lens member further having a lens portion. The protruding portion has a shape matching that of the piece of high-melting-point glass, and relative positions of the protruding portion and the optical axis of the lens portion are determined to correspond to relative positions of the connecting electrodes and the piece of high-melting-point glass. The fixing includes fixing the protruding portion of the lens member to the piece of high-melting-point glass via surface tension generated by melting the piece of low-melting-point glass.

Abstract: A photoelectric conversion device includes a circuit substrate that has a first concave portion having a light transmission hole, a first metal interconnection that is formed from a bottom of the first concave portion to a face of the circuit substrate where the first concave portion is formed, an optical element that is arranged in the first concave portion so that an optical axis thereof passes through the light transmission hole and is flip-chip bonded to the first metal interconnection on the bottom of the first concave portion, and a circuit chip that is a driver circuit chip for driving the optical element or an amplifier circuit chip for amplifying a signal from the optical element and is flip-chip bonded to the first metal interconnection of the face where the first concave portion is formed.

Abstract: A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

Abstract: Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.

Abstract: An optical subassembly manufacturing method includes forming connecting electrodes and a piece of high-melting-point glass on a wiring substrate; positioning on and connecting to the connecting electrodes, an optoelectronic converting element; disposing on the piece of high-melting-point glass, a piece of low-melting-point glass having a melting point lower than the piece of high-melting-point glass; and fixing to the piece of low-melting-point glass, a protruding portion of a lens member further having a lens portion. The protruding portion has a shape matching that of the piece of high-melting-point glass, and relative positions of the protruding portion and the optical axis of the lens portion are determined to correspond to relative positions of the connecting electrodes and the piece of high-melting-point glass. The fixing includes fixing the protruding portion of the lens member to the piece of high-melting-point glass via surface tension generated by melting the piece of low-melting-point glass.

Abstract: An optical module according to the present invention comprises an electric wiring substrate, a first optical element mounted on the electric wiring substrate so that a heat generation section of the first optical element is positioned relatively close to a substrate surface of the electric wiring substrate and a heat sink mounted on the same plane as the mounting plane of the first optical element on the electric wiring substrate, the heat sink being mounted on the electric wiring substrate so that an area of electric wiring on the electric wiring substrate overlaps the heat sink. This improves the efficiency of heat radiation of the optical module.

Abstract: A photoelectric conversion device includes a circuit substrate that has a first concave portion having a light transmission hole, a first metal interconnection that is formed from a bottom of the first concave portion to a face of the circuit substrate where the first concave portion is formed, an optical element that is arranged in the first concave portion so that an optical axis thereof passes through the light transmission hole and is flip-chip bonded to the first metal interconnection on the bottom of the first concave portion, and a circuit chip that is a driver circuit chip for driving the optical element or an amplifier circuit chip for amplifying a signal from the optical element and is flip-chip bonded to the first metal interconnection of the face where the first concave portion is formed.

Abstract: An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.

Abstract: The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.

Abstract: An optical module according to the present invention comprises an electric wiring substrate, a first optical element mounted on the electric wiring substrate so that a heat generation section of the first optical element is positioned relatively close to a substrate surface of the electric wiring substrate and a heat sink mounted on the same plane as the mounting plane of the first optical element on the electric wiring substrate, the heat sink being mounted on the electric wiring substrate so that an area of electric wiring on the electric wiring substrate overlaps the heat sink. This improves the efficiency of heat radiation of the optical module.

Abstract: A multiplexer-demultiplexer includes a first lens, a multilayer filter, and a second lens. The first lens is positioned to collimate a multi-wavelength light having various wavelengths. The multilayer filter includes multiple filter films each arranged at a different angle, is positioned such that collimated multi-wavelength light enters and/or exits at an angle, separates the collimated multi-wavelength light into single-wavelength light according to wavelength, and reflects each of the single-wavelength light. The second lens is positioned to converge each of the single-wavelength lights separated by the multilayer filter at a different position.

Abstract: Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.

Abstract: A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

Abstract: An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.

Abstract: The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.

Abstract: According to the present invention, there is provided an optical module made up of an optical element, a protective component for protecting an optical transmission medium to be optically coupled to the optical element and an electric wiring formed on the protective component in conjunction with the optical element. This can reduce the number of principal components constituting the optical module, which realizes a small-size and low-cost optical module.

Abstract: An optical module including a substrate having a groove; an optical waveguide layer formed on the substrate, the optical waveguide layer including an optical waveguide core having first and second ends, the first end being aligned with the groove, and an optical waveguide cladding covering the optical waveguide core; a ferrule having a through hole; and an optical fiber inserted and fixed in the through hole. The ferrule has a flat cut portion for semicylindrically exposing a part of the optical fiber inserted and fixed in the through hole. The ferrule is fixed at the flat cut portion to the substrate so that the part of the optical fiber exposed to the flat cut portion is inserted into the groove of the substrate until one end of the optical fiber abuts against the first end of the optical waveguide core.

Abstract: An optical module including a substrate having a groove; an optical waveguide layer formed on the substrate, the optical waveguide layer including an optical waveguide core having first and second ends, the first end being aligned with the groove, and an optical waveguide cladding covering the optical waveguide core; a ferrule having a through hole; and an optical fiber inserted and fixed in the through hole. The ferrule has a flat cut portion for semicylindrically exposing a part of the optical fiber inserted and fixed in the through hole. The ferrule is fixed at the flat cut portion to the substrate so that the part of the optical fiber exposed to the flat cut portion is inserted into the groove of the substrate until one end of the optical fiber abuts against the first end of the optical waveguide core.

Abstract: A ferrule assembly includes a ferrule having a through-hole, a first end portion, a second end portion, and an intermediate portion between the first and second end portions, and an optical fiber inserted and fixed in the through-hole. The ferrule has at the intermediate portion a cutaway flat portion allowing the optical fiber inserted in the through-hole to be semi-exposed, and the optical fiber has its entire circumference held by the ferrule at least at the first and second end portions of the ferrule.

Abstract: An optical module including a substrate having a groove; an optical waveguide layer formed on the substrate, the optical waveguide layer including an optical waveguide core having first and second ends, the first end being aligned with the groove, and an optical waveguide cladding covering the optical waveguide core; a ferrule having a through hole; and an optical fiber inserted and fixed in the through hole. The ferrule has a flat cut portion for semicylindrically exposing a part of the optical fiber inserted and fixed in the through hole. The ferrule is fixed at the flat cut portion to the substrate so that the part of the optical fiber exposed to the flat cut portion is inserted into the groove of the substrate until one end of the optical fiber abuts against the first end of the optical waveguide core.