Abstract: An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 ?m. Accordingly, it is possible to suppress heat resistance to be low.

Abstract: A substrate includes a base made of a metal material, a thermally conductive, light-reflective ceramic insulating layer, and a buffer layer formed between the base and the ceramic insulating layer and having a smaller linear expansion coefficient than the base.

Abstract: In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.

Abstract: An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 ?m. Accordingly, it is possible to suppress heat resistance to be low.

Abstract: Provided is a substrate having dielectric strength and light reflectivity, as well as excellent mass productivity. A substrate (10) for mounting a light-emitting element (20) thereon includes a base (12) and an insulation layer (30) disposed directly or indirectly on a surface of the base (12). The insulation layer (30) includes a reflection layer (32) that reflects light and a mesh glass sheet 31 that is disposed within the reflection layer (32) and that has a coefficient of linear expansion smaller than that of the reflection layer (32).

Abstract: Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.

Abstract: In a light-emitting device (30), a wiring pattern including conductor wirings (160, 165) and electrodes (170, 180) is formed on a substrate (110), and an Au layer (120) is formed on the wiring pattern.

Abstract: A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

Abstract: A substrate (120) includes a base (100) made of a metal material, a thermally conductive, light-reflective ceramic insulating layer (150), and a buffer layer (250) formed between the base (100) and the ceramic insulating layer (150) and having a smaller linear expansion coefficient than the base (100).

Abstract: There is provided a substrate excellent in high reflectance, high heat dissipation, withstand voltage property, and thermal and light stability. A substrate (5) includes an aluminum base (10), a reflective layer (17) which is formed between the aluminum base (10) and an electrode pattern (20) for electrical connection with a light emitting element to contain ceramic and reflects light from the light emitting element, and an intermediate layer (16) containing resin and having high thermal conductibility which is formed to reinforce withstand voltage performance of the reflective layer (17).

Abstract: In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.

Abstract: Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.

Abstract: A high heat dissipation effect and a high light utilization efficiency are realized. A substrate for a light emitting device includes an aluminum substrate (1), a high heat dissipation ceramic layer (2) disposed on the aluminum substrate (1), an etching frame (3) disposed on the high heat dissipation ceramic layer (2), and a highly reflective ceramic layer (4) disposed on the high heat dissipation ceramic layer (2) and the etching frame (3).

Abstract: A first land portion (2f) or a second land portion (2s) is formed on a board (1), and a first connector (20b) or a second connector (20s) is electrically connected while the first connector (20b) or the second connector (20s) is placed on the first land portion (2f) or the second land portion (2s).

Abstract: A reflector (10) according to one aspect of the present invention includes a metal reflector base (3) having a three-dimensional surface, and a ceramic layer (4) having optical reflectivity, which is formed on the three-dimensional surface.

Abstract: In a light-emitting device (30), a wiring pattern including conductor wirings (160, 165) and electrodes (170, 180) is formed on a substrate (110), and an Au layer (120) is formed on the wiring pattern.