Abstract: A photopolymerizable composition comprising (A) a polymer binder, (B) a photopolymerizable monomer and (C) a photopolymerization initiator, wherein the component (B) is at least one compound represented by the following formula (1): 1

Abstract: A photosensitive composition for sandblasting and a photosensitive film laminate having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising (A) a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups and a structural unit represented by formula: (B) an alkali-soluble compound, and (C) a photopolymerization initiator.

Abstract: An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

Abstract: A photosensitive composition for sandblasting and a photosensitive film having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups, a photopolymerization initiator, and at least one cellulose derivative selected from the group consisting of hydroxypropyl cellulose, ethylhydroxyethyl cellulose, hydroxypropylmethyl cellulose phthalate, and hydroxypropylmethyl cellulose acetate phthalate. The composition exhibits excellent adhesion to a substrate, high sensitivity, and high resistance to sandblasting.

Abstract: Plastic abrasives for sandblasting, in particular, those to be used in sandblast processing for forming barrier ribs and priming ribs; a sandblast processing method with the use of the same; and a method for treating sandblasting waste matters. A plastic abrasive for sandblasting characterized by being soluble in organic solvents or water/organic solvent mixtures and comprising plastic particles having an average particle size of 5 to 100 .mu.m; a method for sandblast processing a plasma display panel substrate by using the plastic abrasive; and a method for treating sandblasting waste matters.

Abstract: A modified cellulose compound and a photopolymerizable resin composition containing the same are disclosed, the modified cellulose compound being obtained by reacting a hydroxyl group of cellulose or a cellulose derivative with an isocyanate group of a specific (meth)acryloyloxyalkylene isocyanate compound. The photopolymerizable resin composition has excellent adhesion to a substrate and high flexibility, and the modified cellulose compound has properties of easily decomposing and volatilizing even after baking.

Abstract: An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

Abstract: Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photolithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.

Abstract: A photosensitive resin composition comprising the following components (A), (B), (C) and (D): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, (D) a polymeric complex of an alkali thioxanate wherein the photosensitive resin composition has an electrical insulation resistance of 8.0.times.10.sup.9 to 1.0.times.10.sup.14 .OMEGA..multidot.cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.

Abstract: Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photolithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.

Abstract: A photosensitive resin composition comprising the following components (A), (B) and (C): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, wherein the photosensitive resin composition has an electrical insulation resistance of 8.0.times.10.sup.9 to 1.0.times.1.0.sup.14 .OMEGA..multidot.cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.

Abstract: Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photo-lithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.