Patents by Inventor Hiroyuki Ochiai

Hiroyuki Ochiai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310640
    Abstract: A semiconductor storage device includes a first conductive layer that extends in a first direction; a second conductive layer that extends in the first direction and is arranged with the first conductive layer in a second direction; a first insulating layer that is provided between the first conductive layer and the second conductive layer; a semiconductor layer that extends in the second direction and faces the first conductive layer, the second conductive layer, and the first insulating layer in a third direction; a first charge storage layer that is provided between the first conductive layer and the semiconductor layer; a second charge storage layer that is provided between the second conductive layer and the semiconductor layer; a first high dielectric constant layer that is provided between the first conductive layer and the first charge storage layer; and a second high dielectric constant layer provided between the second conductive layer and the second charge storage layer.
    Type: Application
    Filed: August 30, 2021
    Publication date: September 29, 2022
    Applicant: Kioxia Corporation
    Inventors: Natsuki FUKUDA, Ryota NARASAKI, Takashi KURUSU, Yuta KAMIYA, Kazuhiro MATSUO, Shinji MORI, Shoji HONDA, Takafumi OCHIAI, Hiroyuki YAMASHITA, Junichi KANEYAMA, Ha HOANG, Yuta SAITO, Kota TAKAHASHI, Tomoki ISHIMARU, Kenichiro TORATANI
  • Publication number: 20220302162
    Abstract: According to one embodiment, a semiconductor storage device includes a plurality of electrode films on a substrate, spaced from one another in a first direction. A charge storage film is provided on a side face the electrode films via a first insulating film. A semiconductor film is provided on a side face of the charge storage film via a second insulating film. The charge storage film includes a plurality of insulator regions contacting the first insulating film, a plurality of semiconductor or conductor regions provided between the insulator regions and another insulator region.
    Type: Application
    Filed: August 26, 2021
    Publication date: September 22, 2022
    Inventors: Hiroyuki Yamashita, Yuta Saito, Keiichi Sawa, Kazuhiro Matsuo, Yuta Kamiya, Shinji Mori, Kota Takahashi, Junichi Kaneyama, Tomoki Ishimaru, Kenichiro Toratani, Ha Hoang, Shouji Honda, Takafumi Ochiai
  • Patent number: 11387618
    Abstract: A laser beam irradiation apparatus including: a plurality of laser light sources emitting first laser beams; and a light-condensing optics system having an incident face on which the first laser beams are made incident and performing an optical operation on the first laser beams to emit second laser beams. The plurality of laser light sources are configured to emit the first laser beams so that beam diameters are expanded towards the incident face. Each first laser beam overlaps at least one of the other laser beams on the incident face. The light-condensing optics system is configured so that beam diameters of second laser beams emitted from the light-condensing optics system are minimal on a target face, and a distance between a center of each second laser beam and the optical axis on the target face is smaller than a beam radius of each second laser beam on the target face.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: July 12, 2022
    Assignees: MITSUBISHI HEAVY INDUSTRIES, LTD., RIKEN
    Inventors: Masashi Iwashimizu, Hiroyuki Daigo, Shingo Nishikata, Kazunori Masukawa, Atsushi Ochiai, Toshikazu Ebisuzaki, Satoshi Wada, Yoshiyuki Takizawa
  • Publication number: 20210016342
    Abstract: An object-processing method applies a specific process to an object to be processed by connecting a power source to the object to be processed.
    Type: Application
    Filed: February 28, 2019
    Publication date: January 21, 2021
    Applicant: IHI Corporation
    Inventors: Hiroyuki OCHIAI, Masanori OKUDA, Takehiko UCHIYAMA, Kazunori TAHARA, Noriyoshi SAWADA
  • Patent number: 10589339
    Abstract: A method for manufacturing a blisk includes an intermediate product molding step of molding a blisk intermediate product including a circular disk-corresponding part, a plurality of rotor blade-corresponding parts, and bridges each connecting a front edge of one of each pair of the rotor blade-corresponding parts adjacent to each other and a rear edge of the other one of the rotor blade-corresponding parts. The method for manufacturing the blisk further includes a disk finishing step of cutting the disk-corresponding part so as to finish the disk-corresponding part into the disk in a product form, and a rotor blade finishing step of cutting each bridge so as to finish the respective rotor blade-corresponding parts into the respective rotor blades in a product form.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: March 17, 2020
    Assignees: IHI Corporation, Endo Manufacturing Co., Ltd.
    Inventors: Hiroyuki Ochiai, Nobutaka Yanagidani, Rui Kondo
  • Publication number: 20180250733
    Abstract: A method for manufacturing a blisk includes an intermediate product molding step of molding a blisk intermediate product including a circular disk-corresponding part, a plurality of rotor blade-corresponding parts, and bridges each connecting a front edge of one of each pair of the rotor blade-corresponding parts adjacent to each other and a rear edge of the other one of the rotor blade-corresponding parts. The method for manufacturing the blisk further includes a disk finishing step of cutting the disk-corresponding part so as to finish the disk-corresponding part into the disk in a product form, and a rotor blade finishing step of cutting each bridge so as to finish the respective rotor blade-corresponding parts into the respective rotor blades in a product form.
    Type: Application
    Filed: April 12, 2018
    Publication date: September 6, 2018
    Applicants: IHI Corporation, Endo Manufacturing Co., Ltd.
    Inventors: Hiroyuki OCHIAI, Nobutaka YANAGIDANI, Rui KONDO
  • Patent number: 9855606
    Abstract: In the process of cutting the outer circumference 10o of a hollow rotating shaft 10 by using a finishing turning tool 36, the position of the finishing turning tool 36 is adjusted in the direction orthogonal to the virtual reference shaft center VS so that the center position CPo of the outer circumference 10o of the hollow rotating shaft 10 is deviated from the virtual reference shaft center VS in the same direction as the direction of the deviation vector ?Di by an amount corresponding to the magnitude |?Di| of the deviation vector ?Di. This can reduce the unbalance to zero also in the middle of the shaft and sufficiently reduce runout of the hollow rotating shaft 10 even if the rotation speed of the hollow rotating shaft 10 increases. Accordingly, it is possible to further improve the reliability of the hollow rotating shaft 10 at high rotation speed.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: January 2, 2018
    Assignee: IHI Corporation
    Inventors: Hiroyuki Ochiai, Yutaka Watanabe, Masanobu Natsuake, Kouzou Hasegawa
  • Patent number: 9695939
    Abstract: A seal structure includes: first and second members defining a hollow internal area of a fluid device; and a seal member fixed to the first member for sealing a gap between the first and second members. The seal member includes a sliding contact member being in sliding contact with a surface of the second member and formed of a resin. The second member includes a resin layer and a resin layer holding structure. The resin layer is formed by sliding the second member on the sliding contact member to transfer the resin forming the sliding contact member onto a sliding contact portion of the surface of the second member at which the second member comes into contact with the sliding contact member. The resin layer holding structure is a porous film formed by electric discharge surface treatment and holds the resin layer in the sliding contact portion.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: July 4, 2017
    Assignee: IHI Corporation
    Inventors: Hifumi Tabata, Nobuhiko Yunoki, Mitsutoshi Watanabe, Hiroyuki Ochiai, Eiji Hosoi
  • Patent number: 9694430
    Abstract: A wing surface finishing method is the one in which after finishing of a leading edge and a trailing edge and finishing of a ventral portion and a back portion in a wing surface of a wing component are separated into separate steps, a finishing end mill is made to approach a ventral portion and a back portion of awing surface corresponding area of a workpiece after a speed of the finishing end mill is increased, finishing processing is applied to the ventral portion and the back portion of the wing surface corresponding area of the workpiece, respectively, and the speed of the finishing end mill is decreased after the finishing end mill is moved away from the wing surface corresponding area of the workpiece.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: July 4, 2017
    Assignee: IHI Corporation
    Inventors: Hiroyuki Ochiai, Kengo Kuwahara, Toshihisa Takekawa
  • Publication number: 20170136548
    Abstract: In the process of cutting the outer circumference 10o of a hollow rotating shaft 10 by using a finishing turning tool 36, the position of the finishing turning tool 36 is adjusted in the direction orthogonal to the virtual reference shaft center VS so that the center position CPo of the outer circumference 10o of the hollow rotating shaft 10 is deviated from the virtual reference shaft center VS in the same direction as the direction of the deviation vector ?Di by an amount corresponding to the magnitude |?Di| of the deviation vector ?Di. This can reduce the unbalance to zero also in the middle of the shaft and sufficiently reduce runout of the hollow rotating shaft 10 even if the rotation speed of the hollow rotating shaft 10 increases. Accordingly, it is possible to further improve the reliability of the hollow rotating shaft 10 at high rotation speed.
    Type: Application
    Filed: January 27, 2017
    Publication date: May 18, 2017
    Applicant: IHI Corporation
    Inventors: Hiroyuki OCHIAI, Yutaka WATANABE, Masanobu NATSUAKE, Kouzou HASEGAWA
  • Publication number: 20170028571
    Abstract: A first cutting blade 5 is formed on a blade edge portion 3a on one side in a blade thickness direction of a blade 3, a second cutting blade 7 is formed on a blade edge portion on other side in the blade thickness direction of the blade 3, a handle 9 is provided on the blade 3, a hard coating 11 if formed by PVD or CVD on the blade edge portion 3b on the other side in the blade thickness direction of the blade 3, a rough surface 13 is formed by grinding processing or shot blast processing on a base of the hard coating 11 on the blade edge portion 3b on the other side in the blade thickness direction of the blade 3, and a maximum height Rz of surface roughness of the rough surface 13 is set to 10 to 30 ?m.
    Type: Application
    Filed: October 12, 2016
    Publication date: February 2, 2017
    Applicant: IHI Corporation
    Inventors: Yoshiyuki SAITO, Hiroyuki OCHIAI
  • Patent number: 9478325
    Abstract: Employing a compact molded from powder of metal or the like as an electrode 11, generating pulsed discharges between the electrode 11 and a treating portion Wa of work W in working oil L as a mixture with powder of semiconductor or conductor mixed therein, using discharge energy thereof for locally fusing surface regions of the treating portion Wa of work W, showering molten pieces of electrode material or reactants of the electrode material onto the treating portion Wa of work W, forming a covering film C on the treating portion Wa of work W.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 25, 2016
    Assignee: IHI CORPORATION
    Inventors: Mitsutoshi Watanabe, Hiroyuki Ochiai, Hiroki Yoshizawa, Yukihiro Shimoda, Masayoshi Shiino
  • Patent number: 9284647
    Abstract: A sliding surface of a high-temperature portion is subjected to an electro-discharge surface treatment with one or both of a high-temperature hard material (4) and a material having a lubricating property at a high temperature (6). The high-temperature hard material (4) is any or a mixture of cBN, TiC, TiN, TiAlN, TiB2, WC, Cr3C2, SiC, ZrC, VC, B4C, Si3N4, ZrO2, and Al2O3. The material having the lubricating property at the high temperature (6) contains chromium and/or chromium oxide (Cr2O3) and/or hexaboron nitride (hBN). An electrode formed by compression molding of the high-temperature hard material, and the high-temperature lubricating material containing at least one of Cr and hBN and having the lubricating property at the high temperature is used as the electrode for the electro-discharge surface treatment.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: March 15, 2016
    Assignees: MITSUBISHI DENKI KABUSHIKI KAISHA, IHI CORPORATION
    Inventors: Hiroyuki Ochiai, Mitsutoshi Watanabe, Mikiya Arai, Shigeru Saburi, Eiji Nakayama, Akihiro Goto, Masao Akiyoshi
  • Publication number: 20160052071
    Abstract: A wing surface finishing method is the one in which after finishing of a leading edge and a trailing edge and finishing of a ventral portion and a back portion in a wing surface of a wing component are separated into separate steps, a finishing end mill is made to approach a ventral portion and a back portion of awing surface corresponding area of a workpiece after a speed of the finishing end mill is increased, finishing processing is applied to the ventral portion and the back portion of the wing surface corresponding area of the workpiece, respectively, and the speed of the finishing end mill is decreased after the finishing end mill is moved away from the wing surface corresponding area of the workpiece.
    Type: Application
    Filed: November 5, 2015
    Publication date: February 25, 2016
    Applicant: IHI Corporation
    Inventors: Hiroyuki OCHIAI, Kengo KUWAHARA, Toshihisa TAKEKAWA
  • Patent number: 9187831
    Abstract: A sliding surface of a high-temperature portion is subjected to an electro-discharge surface treatment with one or both of a high-temperature hard material (4) and a material having a lubricating property at a high temperature (6). The high-temperature hard material (4) is any or a mixture of cBN, TiC, TiN, TiAlN, TiB2, WC, Cr3C2, SiC, ZrC, VC, B4C, Si3N4, ZrO2, and Al2O3. The material having the lubricating property at the high temperature (6) contains chromium and/or chromium oxide (Cr2O3) and/or hexaboron nitride (hBN). An electrode formed by compression molding of the high-temperature hard material, and the high-temperature lubricating material containing at least one of Cr and hBN and having the lubricating property at the high temperature is used as the electrode for the electro-discharge surface treatment.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: November 17, 2015
    Assignees: ISHIKAWAJIMA-HARIMA HEAVY INDUSTRIES CO., LTD., MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Hiroyuki Ochiai, Mitsutoshi Watanabe, Mikiya Arai, Shigeru Saburi, Eiji Nakayama, Akihiro Goto, Masao Akiyoshi
  • Patent number: 9147571
    Abstract: An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: September 29, 2015
    Assignees: EAGLE INDUSTRY CO., LTD., EAGLEBURGMANN JAPAN CO., LTD.
    Inventors: Hidekazu Takahashi, Masahiko Inoue, Hiroyuki Ochiai
  • Publication number: 20150104585
    Abstract: A seal structure includes: first and second members defining a hollow internal area of a fluid device; and a seal member fixed to the first member for sealing a gap between the first and second members. The seal member includes a sliding contact member being in sliding contact with a surface of the second member and formed of a resin. The second member includes a resin layer and a resin layer holding structure. The resin layer is formed by sliding the second member on the sliding contact member to transfer the resin forming the sliding contact member onto a sliding contact portion of the surface of the second member at which the second member comes into contact with the sliding contact member. The resin layer holding structure is a porous film formed by electric discharge surface treatment and holds the resin layer in the sliding contact portion.
    Type: Application
    Filed: December 17, 2014
    Publication date: April 16, 2015
    Applicant: IHI Corporation
    Inventors: Hifumi TABATA, Nobuhiko Yunoki, Mitsutoshi Watanabe, Hiroyuki Ochiai, Eiji Hosoi
  • Patent number: 8993917
    Abstract: A forming 7 die is filled with a powder (11) of electrode material, the powder (11) of electrode material filled in the forming die is compressed to form a porous powder compact (27), the porous powder compact (27) is set in place in a chamber (25) of a heat-treating furnace (23), the chamber (25) is supplied with inert gas or hydrogen gas, and inert gas or hydrogen gas is heated by heaters (39) in the heat-treating furnace (23) and blown toward the powder compact (27), as blows circulating in the chamber (25), whereby the powder compact is heated with heat of convection flows of inert gas or hydrogen gas, or mixed gas containing inert gas as principal component and hydrogen gas, so the electrode material of the powder compact is sintered.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: March 31, 2015
    Assignee: IHI Corporation
    Inventors: Masayoshi Shiino, Hiroyuki Ochiai, Mitsutoshi Watanabe, Hiroki Yoshizawa, Issei Otera
  • Patent number: 8776382
    Abstract: A cutting instrument has a cutting blade portion formed with a skin made of an electrode material or a reaction product of the electrode material, the electrode material having been molten by pulse discharges induced between the cutting blade portion and an electrode in a machining liquid or gas, having as the electrode one of a mold molded from powder of a kind or powder of a mixture of kinds out of a metal or metals, a metal compound or metal compounds, and a ceramic or ceramics, and a heat-treated mold being the mold as heat-treated.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: July 15, 2014
    Assignee: IHI Corporation
    Inventors: Hiroyuki Ochiai, Mitsutoshi Watanabe, Takashi Furukawa, Hiroki Yoshizawa, Yukihiro Shimoda, Sadao Doi
  • Patent number: 8727355
    Abstract: A semiconductor fabrication device welded bellows of an accordion structure is characterized in that a plurality of annular bellows plates having faces curving in a radial direction are connected alternatingly at the outside diameter side and inside diameter side, wherein the annular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate, a gas layer disposed between the two bellows plates, the treatment-side bellows plate being of lesser thickness, and the non-treatment-side bellows plate being of greater thickness. The bellows are highly resistant to damage caused by foreign matter; or, in the unlikely case that the treatment-side bellows plate becomes damaged, the damage can be compensated for by the non-treatment side bellows plate.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: May 20, 2014
    Assignees: Eagle Industry Co., Ltd., EagleBurgmann Japan Co., Ltd.
    Inventors: Hidekazu Takahashi, Masahiko Inoue, Hiroyuki Ochiai